SMD LED 23-22C/S2BHC-B30/2A Datasheet - 2.3x2.2mm - 2.0V/3.3V - 60mW/95mW - Brilliant Orange & Blue - English Technical Document

1. Product Overview

The 23-22C/S2BHC-B30/2A is a compact, surface-mount LED component designed for high-density board applications. It is available in two distinct chip types: the S2 chip, which emits a Brilliant Orange color using AlGaInP material, and the BH chip, which emits a Blue color using InGaN material. Both variants are housed in a water-clear resin package. Its primary advantages include a significantly reduced footprint compared to lead-frame LEDs, enabling miniaturization of end products, reduced storage requirements, and suitability for automated assembly processes. The device is compliant with key environmental and safety standards, including RoHS, EU REACH, and halogen-free requirements.

1.1 Core Features and Target Market

The LED is packaged on 8mm tape within a 7-inch diameter reel, making it fully compatible with high-speed automatic pick-and-place equipment. It is designed for use with standard infrared and vapor phase reflow soldering processes. The multi-color capability within the same package footprint offers design flexibility. Its primary target applications include backlighting for instrument panels, switches, and LCD displays in consumer electronics, as well as status indicators in telecommunication devices such as telephones and fax machines. Its general-purpose nature also makes it suitable for a wide range of indicator and illumination tasks where space is at a premium.

2. Technical Parameter Deep-Dive

This section provides a detailed, objective analysis of the electrical, optical, and thermal specifications as defined in the absolute maximum ratings and electro-optical characteristics tables.

2.1 Absolute Maximum Ratings

The device has a maximum reverse voltage (VR) rating of 5V for both chip types. The continuous forward current (IF) is rated at 25mA. However, the peak forward current (IFP) capability differs: the S2 (Orange) chip can handle 60mA pulses at a 1/10 duty cycle and 1kHz, while the BH (Blue) chip can handle 100mA under the same conditions. This indicates a higher transient current tolerance for the InGaN-based blue LED. The power dissipation (Pd) ratings are 60mW for the S2 chip and 95mW for the BH chip, reflecting different thermal characteristics of the semiconductor materials. The operating temperature range is specified from -40°C to +85°C, with a slightly wider storage temperature range of -40°C to +90°C.

2.2 Electro-Optical Characteristics at Ta=25°C

Under a standard test condition of 10mA forward current, the typical luminous intensity (Iv) for both chips is 22.5mcd, with a maximum of 57.0mcd as defined by the binning structure. The viewing angle (2θ1/2) is a wide 130 degrees, typical for a reflector-style SMD package, providing broad, diffuse illumination. The S2 chip has a typical peak wavelength (λp) of 611nm and a dominant wavelength (λd) of 605nm, placing it in the orange region. The BH chip has a typical peak wavelength of 468nm and a dominant wavelength of 470nm, characteristic of a blue LED. The spectral bandwidth (Δλ) is 17nm for the S2 and 25nm for the BH. The forward voltage (VF) is a key parameter: the S2 chip has a typical VF of 2.0V (min 1.7V, max 2.4V), while the BH chip has a typical VF of 3.3V (min 2.7V, max 3.7V). This voltage difference is critical for circuit design, especially in multi-color or parallel drive configurations. The reverse current (IR) at VR=5V is specified at a maximum of 10μA for S2 and 50μA for BH.

3. Binning System Explanation

The luminous output of LEDs naturally varies during manufacturing. To ensure consistency for the end-user, products are sorted into performance bins.

3.1 Luminous Intensity Binning

The datasheet defines two primary bins for luminous intensity, applicable to both the S2 and BH chip types, measured at IF=10mA. Bin Code 1 covers the range from 22.5mcd to 36.0mcd. Bin Code 2 covers the higher output range from 36.0mcd to 57.0mcd. A note specifies a tolerance of ±11% on the luminous intensity, which applies within each bin. This binning allows designers to select LEDs appropriate for their brightness requirements and helps maintain uniform appearance in an array.

4. Performance Curve Analysis

While the PDF indicates the presence of typical electro-optical characteristic curves for both the S2 and BH chips on pages 4 and 5, the specific graphical data is not provided in the text content. Typically, such curves would illustrate the relationship between forward current and luminous intensity (I-I curve), forward voltage versus forward current (V-I curve), and the effect of ambient temperature on luminous intensity. These curves are essential for understanding the LED's behavior under non-standard operating conditions, such as driving at currents other than 10mA or operating in elevated temperature environments. Designers should consult the full graphical datasheet to accurately model performance in their specific application.

5. Mechanical and Package Information

5.1 Package Outline Dimensions

The device follows the 23-22C package outline. The dimensions are provided in millimeters with a standard tolerance of ±0.1mm unless otherwise noted. The package is a surface-mount device with a reflector cup to enhance light output and directivity. The polarity is indicated by the physical structure of the package, typically with a notch or a marked cathode. The exact footprint and recommended solder pad layout are critical for reliable soldering and thermal management and should be adhered to as shown in the dimensional drawing.

6. Soldering and Assembly Guidelines

Proper handling and soldering are crucial for reliability.

6.1 Storage and Moisture Sensitivity

The LEDs are packaged in a moisture-resistant barrier bag with desiccant. The bag should not be opened until the components are ready for use. Before opening, storage conditions should be 30°C or less and 90% relative humidity (RH) or less. After opening, the components have a "floor life" of 1 year when stored at 30°C/60%RH or less. Unused parts should be resealed in a moisture-proof package. If the desiccant indicator shows saturation or the storage time is exceeded, a baking treatment at 60±5°C for 24 hours is required before reflow soldering to prevent "popcorning" damage.

6.2 Reflow Soldering Profile

The device is compatible with Pb-free reflow soldering. The recommended temperature profile includes a pre-heating stage between 150-200°C for 60-120 seconds, a time above liquidus (217°C) of 60-150 seconds, and a peak temperature not exceeding 260°C for a maximum of 10 seconds. The maximum ramp-up rate to peak is 6°C/sec, and the maximum ramp-down rate is 3°C/sec. Reflow soldering should not be performed more than two times. Stress should not be applied to the LED during heating, and the PCB should not be warped after soldering.

6.3 Hand Soldering and Rework

If hand soldering is necessary, the iron tip temperature must be below 350°C, and contact time per terminal must be limited to 3 seconds or less. The soldering iron power should be 25W or less. A minimum interval of 2 seconds should be left between soldering each terminal. Rework after the LED is soldered is not recommended. If unavoidable, a specialized double-head soldering iron must be used to simultaneously heat both terminals and avoid mechanical stress. The potential for damage during rework must be evaluated beforehand.

7. Packaging and Ordering Information

7.1 Tape and Reel Specifications

The components are supplied in embossed carrier tape with a width of 8mm, wound onto a standard 7-inch (178mm) diameter reel. Each reel contains 2000 pieces. The reel has a hub diameter of 13mm and a flange diameter of 180mm. The carrier tape pocket dimensions and pitch are designed to secure the 23-22C package during shipping and automated handling.

7.2 Label Explanation

The packaging includes labels with key information: CPN (Customer's Product Number), P/N (Product Number), QTY (Packing Quantity), CAT (Luminous Intensity Rank/Bin Code), HUE (Chromaticity Coordinates & Dominant Wavelength Rank), REF (Forward Voltage Rank), and LOT No (Lot Number for traceability).

8. Application Recommendations

8.1 Design Considerations

Current Limiting: An external current-limiting resistor is mandatory. The forward voltage has a range, and a small change in supply voltage can cause a large change in current, potentially leading to instantaneous failure. The resistor value must be calculated based on the worst-case VF (minimum) to ensure the current does not exceed the maximum rating.
Thermal Management: While power dissipation is low, maintaining junction temperature within limits is vital for longevity and stable light output. Ensure adequate PCB copper area or thermal vias if operating at high ambient temperatures or near maximum current.
ESD Protection: The ESD sensitivity is 2000V (HBM) for the S2 chip and 150V (HBM) for the BH chip. The blue BH chip is significantly more ESD-sensitive. Standard ESD handling precautions must be observed during assembly, and circuit-level ESD protection may be necessary for the BH variant in sensitive environments.

8.2 Application Restrictions

This product is intended for general commercial and industrial applications. It is not specifically designed or qualified for high-reliability applications where failure could lead to personal injury or significant property damage. Such applications include, but are not limited to, military/aerospace systems, automotive safety-critical systems (e.g., braking, airbags), and life-support medical equipment. For these applications, a product with different specifications, qualifications, and reliability data is required.

9. Technical Comparison and Differentiation

The key differentiator of this product is the availability of two distinct semiconductor technologies (AlGaInP and InGaN) in the same mechanical package (23-22C). This allows designers to source orange and blue indicators with identical footprints and soldering profiles from a single component line, simplifying procurement and PCB layout. The wide 130-degree viewing angle is characteristic of a reflector package, offering more diffuse light than a side-view or top-view lens package, which is advantageous for backlighting and panel illumination where even light spread is desired. Its compliance with modern environmental standards (Pb-free, Halogen-Free, REACH) is a baseline expectation but remains a critical feature for market access.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I drive the S2 (Orange) and BH (Blue) LEDs in parallel from the same voltage source?
A: Not directly without careful design. Their typical forward voltages differ significantly (2.0V vs. 3.3V). If connected in parallel to a 3.3V source, the orange LED would likely be over-driven and damaged. Separate current-limiting resistors calculated for each LED's VF range are essential.

Q: What is the meaning of the \"B30/2A\" suffix in the part number?
A: While not explicitly decoded in this excerpt, such suffixes typically denote specific binning combinations for luminous intensity (B30 likely relates to brightness bin) and chromaticity/voltage (2A likely relates to color/wavelength and forward voltage bins). The exact mapping should be confirmed with the full manufacturer's bin code document.

Q: How do I interpret the \"Tolerance of Luminous Intensity: ±11%\" note?
A: This tolerance applies to the values stated within each bin (Code 1 or Code 2). It means an LED labeled as Bin 1 (22.5-36.0mcd) could measure anywhere from approximately 20.0mcd to 40.0mcd when considering both the bin range and the ±11% tolerance. This is important for applications requiring tight brightness matching.

11. Practical Design and Usage Case

Case: Designing a Multi-Status Indicator Panel: A designer is creating a control panel that requires a green status LED (not in this datasheet), an orange warning LED, and a blue activity LED. While this datasheet doesn't cover green, it provides orange (S2) and blue (BH). The designer can use the 23-22C footprint for both colored LEDs, simplifying the PCB layout to a single land pattern. They would design three separate driver circuits. For the orange LED, assuming a 5V supply and targeting 10mA, they would calculate the series resistor using the minimum VF (1.7V) for safety: R = (5V - 1.7V) / 0.01A = 330 Ohms. For the blue LED: R = (5V - 2.7V) / 0.01A = 230 Ohms. They would specify Bin Code 2 for both to ensure maximum and matched brightness. The panel cutouts would be designed to accommodate the 130-degree viewing angle for optimal visibility.

12. Operating Principle Introduction

Light Emitting Diodes (LEDs) are semiconductor devices that emit light when an electric current passes through them. This phenomenon is called electroluminescence. In the S2 (AlGaInP) chip, electrons recombine with holes in the aluminum gallium indium phosphide crystal lattice, releasing energy in the form of photons with wavelengths in the orange/red part of the spectrum. In the BH (InGaN) chip, the recombination occurs within an indium gallium nitride structure, producing photons in the blue spectrum. The specific color (wavelength) is determined by the bandgap energy of the semiconductor material, which is engineered during the crystal growth process. The water-clear resin package acts as a lens and protective layer, while the integrated reflector cup helps direct the emitted light upward, creating the wide viewing angle.

13. Technology Trends

The LED industry continues to evolve towards higher efficiency (more lumens per watt), improved color rendering, and greater miniaturization. The 23-22C package represents a mature, widely adopted form factor. Current trends in SMD indicator LEDs include the development of even smaller packages (e.g., 1.0x0.5mm), increased adoption of chip-scale packaging (CSP) for ultra-thin designs, and the integration of multiple color chips (RGB) into a single package for full-color tunable lighting. There is also a strong focus on enhancing reliability and performance under high-temperature conditions, driven by automotive and industrial applications. The move towards higher drive currents for increased brightness from tiny packages necessitates ongoing improvements in thermal management at the chip and package level.