Table of Contents
- 1. Product Overview
- 2. Key Features and Compliance
- 3. Absolute Maximum Ratings
- 4. Electro-Optical Characteristics
- 4.1 Luminous Intensity and Binning
- 4.2 Spectral and Electrical Parameters
- 5. Package Outline and Mechanical Dimensions
- 5.1 Key Package Dimensions (Typical)
- 5.2 Polarity Identification
- 6. Label Explanation and Ordering Information
- 7. Packaging Specifications
- 8. Handling, Storage, and Soldering Guidelines
- 8.1 Over-Current Protection
- 8.2 Moisture Sensitivity and Storage
- 8.3 Reflow Soldering Profile (Pb-free)
- 8.4 Hand Soldering and Rework
- 9. Application Areas
- 10. Design Considerations and Technical Analysis
- 10.1 Driving Circuit Design
- 10.2 Thermal Management
- 10.3 Optical Performance
- 10.4 Comparison with Alternative Technologies
- 11. Frequently Asked Questions (FAQ)
- 11.1 Can I drive this LED without a resistor?
- 11.2 What is the difference between Peak and Dominant Wavelength?
- 11.3 How do I select the correct brightness rank (CAT)?
- 11.4 Is this LED suitable for outdoor use?
- 12. Practical Application Example
- 13. Operating Principle
- 14. Industry Context and Trends
1. Product Overview
The 95-21UYC/S530-XX/XXX is a compact, surface-mount LED designed for indicator and backlighting applications. Utilizing AlGaInP chip technology, it emits a Super Yellow light with a water-clear resin encapsulation. Its primary advantages include a significantly smaller footprint compared to leaded components, enabling higher packing density on PCBs, reduced equipment size, and suitability for automated assembly processes, ensuring placement accuracy.
2. Key Features and Compliance
The device is packaged on 12mm tape wound on a 7-inch diameter reel, compatible with standard automatic placement equipment. It is a mono-color type, lead-free (Pb-free), and compliant with key environmental and safety regulations. This includes adherence to the EU RoHS directive, EU REACH regulations, and halogen-free standards (Bromine <900 ppm, Chlorine <900 ppm, Br+Cl < 1500 ppm). The product itself is maintained within RoHS compliant specifications.
3. Absolute Maximum Ratings
These ratings define the limits beyond which permanent damage to the device may occur. Operation under or at these conditions is not guaranteed.
- Reverse Voltage (VR): 5 V
- Forward Current (IF): 20 mA (Continuous)
- Peak Forward Current (IFP): 60 mA (Duty Cycle 1/10 @ 1kHz)
- Power Dissipation (Pd): 60 mW
- Operating Temperature (Topr): -40°C to +85°C
- Storage Temperature (Tstg): -40°C to +90°C
- Electrostatic Discharge (ESD): 2000 V (Human Body Model)
- Soldering Temperature (Tsol): Reflow: 260°C for 10 sec max; Hand: 350°C for 3 sec max.
4. Electro-Optical Characteristics
All parameters are specified at an ambient temperature (Ta) of 25°C and a forward current (IF) of 20mA, unless otherwise noted.
4.1 Luminous Intensity and Binning
The luminous intensity (Iv) is categorized into ranks (A2 through A7), providing a range of brightness options for design flexibility.
- Rank A2: Typical 496 mcd (Min. 198 mcd)
- Rank A3: Typical 714 mcd (Min. 463 mcd)
- Rank A4: Typical 892 mcd (Min. 661 mcd)
- Rank A5: Typical 1156 mcd (Min. 793 mcd)
- Rank A6: Typical 1454 mcd (Min. 991 mcd)
- Rank A7: Typical 1600 mcd (Min. 1150 mcd)
4.2 Spectral and Electrical Parameters
- Viewing Angle (2θ1/2): 25° (Typical)
- Peak Wavelength (λp): 591 nm (Typical)
- Dominant Wavelength (λd): 589 nm (Typical)
- Spectral Bandwidth (Δλ): 15 nm (Typical)
- Forward Voltage (VF): 2.4 V (Typical), 2.0 V (Min.) at IF=20mA
- Reverse Current (IR): 10 μA (Max.) at VR=5V
Note: The 5V reverse voltage rating is applicable for IR testing only. The device is not designed for operation under reverse bias.
5. Package Outline and Mechanical Dimensions
The LED comes in a standard SMD package. The key dimensions are provided in detailed drawings (referenced as TR7, TR9, TR10 in the datasheet). Unless specified otherwise, the dimensional tolerance is ±0.1 mm.
5.1 Key Package Dimensions (Typical)
- Package Length: 2.0 mm
- Package Width: 1.25 mm
- Package Height: 0.8 mm
- Land Pattern: Design guidelines are provided to ensure proper soldering and thermal management.
5.2 Polarity Identification
The cathode is typically marked on the package. Consult the detailed dimension drawing for the exact marking scheme.
6. Label Explanation and Ordering Information
The product labeling includes several codes for traceability and specification:
- CPN: Customer's Product Number
- P/N: Product Number (e.g., 95-21UYC/S530-XX/XXX)
- LOT No: Manufacturing Lot Number
- QTY: Packing Quantity
- CAT: Luminous Intensity Rank (A2-A7)
- HUE: Dominant Wavelength Rank
- REF: Forward Voltage Rank
7. Packaging Specifications
The components are supplied on embossed carrier tape for automated handling.
- Carrier Tape Width: 12 mm
- Reel Diameter: 7 inches
- Pocket Pitch: 4.0 mm
- Quantity per Reel: Standard quantity as per EIA specification.
- Bulk Packing: Also available in bags of 1000 pieces.
8. Handling, Storage, and Soldering Guidelines
8.1 Over-Current Protection
An external current-limiting resistor is mandatory. The LED's V-I characteristic is exponential, meaning a small increase in voltage can cause a large, damaging increase in current.
8.2 Moisture Sensitivity and Storage
This component is moisture-sensitive (MSL).
- Before opening: Store at ≤30°C and ≤90% RH.
- After opening: The floor life is 72 hours at ≤30°C and ≤60% RH.
- Rebaking: If the moisture barrier bag is compromised or storage time is exceeded, bake at 60±5°C for 24 hours before use.
8.3 Reflow Soldering Profile (Pb-free)
A recommended temperature profile is provided:
- Pre-heating: 150-200°C for 60-120 seconds (max ramp 3°C/sec).
- Time above liquidus (217°C): 60-150 seconds.
- Peak Temperature: 260°C maximum, held for no more than 10 seconds.
- Time above 255°C: Maximum 30 seconds.
- Cooling Rate: Maximum 6°C/sec.
Critical Notes: Do not exceed two reflow cycles. Avoid mechanical stress on the LED during heating. Do not warp the PCB after soldering.
8.4 Hand Soldering and Rework
If hand soldering is unavoidable:
- Use a soldering iron with a tip temperature <350°C.
- Limit contact time to 3 seconds per terminal.
- Use a low-power iron (<25W).
- Allow a 2-second minimum interval between soldering terminals.
- Avoid rework. If absolutely necessary, use a dual-head soldering iron to simultaneously heat both terminals and minimize thermal stress. Verify device functionality after rework.
9. Application Areas
This LED is suitable for a wide range of low-power indicator and backlighting functions, particularly where space and weight are constraints.
- Status indicators in consumer electronics (indoor use).
- Backlighting for LCD panels, membrane switches, and symbols.
- Indicator and panel lighting in office equipment (printers, copiers).
- Battery-powered device indicators (remote controls, portable instruments).
- Audio/Video equipment status lights.
- Dashboard and switch backlighting in automotive interiors.
- Indicator and keypad backlighting in telecommunication devices (phones, fax machines).
10. Design Considerations and Technical Analysis
10.1 Driving Circuit Design
Given a typical forward voltage of 2.4V, a series resistor is essential. The resistor value (Rs) can be calculated using Ohm's Law: Rs = (Vsupply - VF) / IF. For a 5V supply and a target IF of 20mA, Rs ≈ (5 - 2.4) / 0.02 = 130 Ω. A standard 130Ω or 150Ω resistor with adequate power rating (P = IF2 * Rs) should be used.
10.2 Thermal Management
While the power dissipation is low (60mW max), proper PCB layout is crucial for long-term reliability. Ensure the solder pads connect to sufficient copper area to act as a heat sink, especially if operating near the maximum current or at elevated ambient temperatures.
10.3 Optical Performance
The 25° viewing angle provides a relatively focused beam, making it suitable for directed indicator applications. The Super Yellow color (λd ~589nm) offers high visual contrast and is often used for caution or attention indicators.
10.4 Comparison with Alternative Technologies
Compared to older through-hole yellow LEDs, this SMD version offers a drastic reduction in size and weight, enabling modern, miniaturized designs. The AlGaInP material system provides high efficiency and good color purity for yellow emission. Compared to some white LEDs used for backlighting, it offers a saturated color without the need for phosphors, potentially simplifying the optical design for specific color requirements.
11. Frequently Asked Questions (FAQ)
11.1 Can I drive this LED without a resistor?
No. Operating without a current-limiting resistor will almost certainly destroy the LED due to overcurrent, even with a small voltage source like a 3V coin cell.
11.2 What is the difference between Peak and Dominant Wavelength?
Peak Wavelength (λp): The wavelength at which the spectral power distribution is maximum (591 nm typical). Dominant Wavelength (λd): The single wavelength perceived by the human eye that matches the color of the light (589 nm typical). For monochromatic LEDs like this one, they are very close.
11.3 How do I select the correct brightness rank (CAT)?
Choose based on your application's required luminous intensity. Rank A2 is the dimmest, and A7 is the brightest. Consider ambient light conditions and viewing distance. For high-ambient-light situations, a higher rank (A5-A7) may be necessary.
11.4 Is this LED suitable for outdoor use?
The datasheet specifies applications as "indoor." The operating temperature range (-40°C to +85°C) is wide, but outdoor use would require additional design validation for factors like UV exposure, humidity sealing, and thermal cycling, which are not covered in this document.
12. Practical Application Example
Scenario: Designing a low-battery indicator for a handheld medical device.
- Component Selection: The 95-21UYC in Rank A5 is chosen for its bright, attention-grabbing yellow light.
- Circuit Design: The device is powered by a 3.3V regulator. A 47Ω series resistor is calculated: (3.3V - 2.4V) / 0.02A = 45Ω. The nearest standard value of 47Ω results in a forward current of approximately 19.1mA, which is safe and provides sufficient brightness.
- PCB Layout: The LED is placed near the device's display. The PCB pads are connected to a small copper pour on the top layer to aid heat dissipation.
- Assembly: The LEDs are placed using a pick-and-place machine from the 12mm tape reel and soldered using the specified Pb-free reflow profile.
- Result: A reliable, compact, and clearly visible low-battery warning indicator.
13. Operating Principle
This is a semiconductor light-emitting diode. When a forward bias voltage exceeding its characteristic forward voltage (VF) is applied, electrons and holes recombine in the active region of the AlGaInP semiconductor chip. This recombination process releases energy in the form of photons (light). The specific composition of the AlGaInP alloy determines the bandgap energy, which directly defines the wavelength (color) of the emitted light—in this case, yellow (~589 nm). The water-clear resin package acts as a lens, shaping the light output into the specified 25° viewing angle.
14. Industry Context and Trends
SMD LEDs like the 95-21 series represent the industry standard for indicator applications, having largely replaced through-hole LEDs due to automation compatibility and space savings. The trend continues towards even smaller package sizes (e.g., 0402, 0201 metric) for ultra-compact devices. Furthermore, there is a strong industry-wide push for higher efficiency (more light output per mA of current) and improved color consistency across bins. The compliance with halogen-free and RoHS standards reflects the electronics industry's ongoing commitment to environmental responsibility and material safety. Devices in this class are foundational components in the Internet of Things (IoT) and portable electronics, where miniaturization and low power consumption are paramount.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |