LTSN-N213EGBW SMD LED Datasheet - Tri-Color (Red/Green/Blue) - Package Dimensions - Voltage 1.8-3.8V - Power 75-76mW - English Technical Document

1. Product Overview

This document provides the complete technical specifications for the LTSN-N213EGBW, a surface-mount device (SMD) Light Emitting Diode (LED). This component integrates three individual LED chips (Red, Green, and Blue) within a single package, making it suitable for applications requiring multi-color indication or color mixing. The device is designed for automated assembly processes and space-constrained applications common in modern electronics.

1.1 Features

• Compliant with RoHS (Restriction of Hazardous Substances) directives.
• Packaged on 8mm tape for compatibility with 7-inch diameter reels, facilitating automated pick-and-place assembly.
• Standard EIA (Electronic Industries Alliance) package footprint.
• Input compatible with standard integrated circuit (IC) logic levels.
• Designed for compatibility with automated placement and infrared (IR) reflow soldering equipment.
• Preconditioned to JEDEC (Joint Electron Device Engineering Council) Moisture Sensitivity Level 3.

1.2 Applications

This LED is intended for a broad range of electronic equipment where reliable, multi-color status indication is required. Typical application areas include:

• Telecommunication equipment (e.g., routers, switches, base stations).
• Office automation devices (e.g., printers, scanners, multifunction devices).
• Home appliances with status displays.
• Industrial control and instrumentation panels.
• Indoor signage and informational display systems.

2. Technical Parameters: In-Depth Objective Interpretation

The following sections provide a detailed breakdown of the device's operational limits and performance characteristics. All data is specified at an ambient temperature (Ta) of 25°C unless otherwise noted.

2.1 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. Operation under or at these limits is not guaranteed and should be avoided in circuit design.

• Power Dissipation (Pd): 75 mW for the Red chip, 76 mW for the Green and Blue chips. This is the maximum amount of power the device can dissipate as heat.
• Peak Forward Current (I_FP): 80 mA for all colors. This is the maximum allowable instantaneous current, typically specified for pulsed operation (1/10 duty cycle, 0.1ms pulse width).
• DC Forward Current (I_F): 30 mA for Red, 20 mA for Green and Blue. This is the maximum continuous forward current recommended for reliable long-term operation.
• Operating Temperature Range: -40°C to +85°C. The device is guaranteed to function within this ambient temperature range.
• Storage Temperature Range: -40°C to +100°C. The device can be stored without applied power within this range.

2.2 Electrical and Optical Characteristics

These are the typical performance parameters measured under standard test conditions (I_F = 20mA, Ta=25°C).

• Luminous Intensity (I_V): The light output measured in millicandelas (mcd).
  • Red: Minimum 345 mcd, Maximum 720 mcd.
  • Green: Minimum 750 mcd, Maximum 1300 mcd.
  • Blue: Minimum 140 mcd, Maximum 280 mcd.
• Viewing Angle (2θ_1/2): Approximately 120 degrees (typical). This is the full angle at which the luminous intensity is half of its peak axial value, indicating a wide viewing pattern.
• Peak Emission Wavelength (λ_P): The wavelength at which the spectral power distribution is maximum.
  • Red: 630 nm (typical).
  • Green: 518 nm (typical).
  • Blue: 467 nm (typical).
• Dominant Wavelength (λ_d): The single wavelength perceived by the human eye that defines the color.
  • Red: 617-627 nm (typical range).
  • Green: 517-527 nm (typical range).
  • Blue: 462-472 nm (typical range).
• Spectral Line Half-Width (Δλ): The bandwidth of the emitted spectrum at half its maximum intensity.
  • Red: 25 nm (typical).
  • Green: 35 nm (typical).
  • Blue: 20 nm (typical).
• Forward Voltage (V_F): The voltage drop across the LED when driven at the test current.
  • Red: 1.8V (Min), 2.5V (Max).
  • Green: 2.8V (Min), 3.8V (Max).
  • Blue: 2.8V (Min), 3.8V (Max).
• Reverse Current (I_R): Maximum 10 μA for all colors at a reverse voltage (V_R) of 5V. Note: This device is not designed for operation under reverse bias; this parameter is for test purposes only.

3. Binning System Explanation

To ensure color and brightness consistency in production, LEDs are sorted into bins based on key parameters. The LTSN-N213EGBW uses a two-dimensional binning system.

3.1 Luminous Intensity (I_V) Bins

LEDs are categorized based on their light output at 20mA.

• Red:
  • Bin U1: 345.0 - 500.0 mcd
  • Bin U2: 500.0 - 720.0 mcd
• Green:
  • Bin V1: 750.0 - 1000.0 mcd
  • Bin V2: 1000.0 - 1300.0 mcd
• Blue:
  • Bin R2: 140.0 - 200.0 mcd
  • Bin S1: 200.0 - 280.0 mcd

Tolerance on each intensity bin is +/-11%.

3.2 Dominant Wavelength (λ_d) Bins

LEDs are categorized based on their perceived color (dominant wavelength).

• Red:
  • Bin V: 617.0 - 622.0 nm
  • Bin W: 622.0 - 627.0 nm
• Green:
  • Bin AP: 517.0 - 522.0 nm
  • Bin AQ: 522.0 - 527.0 nm
• Blue:
  • Bin AC: 462.0 - 467.0 nm
  • Bin AD: 467.0 - 472.0 nm

Tolerance for each dominant wavelength bin is +/- 1 nm.

3.3 Combined Bin Code

The final product tag uses a combined code (e.g., A1, C2, D3) that references a specific combination of intensity and wavelength bins for all three colors, as defined in the cross-tables provided in the datasheet. This ensures a matched set of characteristics for the Red, Green, and Blue chips within a single unit.

4. Performance Curve Analysis

The datasheet includes typical characteristic curves which are essential for understanding device behavior under varying conditions. While specific graphs are not reproduced here, they typically include:

• Relative Luminous Intensity vs. Forward Current (I-V Curve): Shows how light output increases with current, typically in a non-linear relationship. Operating near the maximum DC current may offer diminishing returns in brightness while increasing heat and stress.
• Forward Voltage vs. Forward Current: Demonstrates the diode's exponential I-V characteristic. The forward voltage has a negative temperature coefficient, meaning it decreases slightly as the junction temperature rises.
• Relative Luminous Intensity vs. Ambient Temperature: Illustrates the thermal quenching effect, where light output decreases as the ambient (and thus junction) temperature increases. This is particularly important for high-power or high-temperature applications.
• Spectral Distribution: Graphs showing the relative power emitted across wavelengths for each color, highlighting the peak and dominant wavelengths and spectral width.

5. Mechanical and Package Information

5.1 Package Dimensions

The device conforms to a standard SMD footprint. Key dimensional notes include:

• All dimensions are in millimeters.
• Standard tolerance is ±0.2 mm unless otherwise specified on the detailed dimension drawing.
• The package incorporates a diffused lens for each color chip to widen the viewing angle.

5.2 Pin Assignment

The tri-color LED has a common-cathode or common-anode configuration (specific configuration should be verified from the package diagram). The datasheet indicates pin assignments for the Red (Pin 2), Green (Pin 3), and Blue (Pin 4) anodes, with a common cathode likely on Pin 1. Correct polarity identification is crucial during PCB layout and assembly.

5.3 Recommended PCB Attachment Pad

A land pattern diagram is provided to ensure proper solder joint formation and mechanical stability. Adherence to this recommended footprint is critical for successful reflow soldering and long-term reliability.

6. Soldering and Assembly Guidelines

6.1 IR Reflow Soldering Profile

The device is compatible with infrared (IR) reflow soldering processes using lead-free (Pb-free) solder. The recommended profile conforms to J-STD-020B. Key parameters typically include:

• Preheat ramp rate.
• Soak (preheat) temperature and time to activate flux and minimize thermal shock.
• Liquidus temperature and time above liquidus (TAL).
• Peak reflow temperature (must not exceed the device's maximum tolerance, usually around 260°C for a short duration).
• Cooling ramp rate.

6.2 Cleaning

If cleaning after soldering is necessary, only specified chemicals should be used. The datasheet recommends immersion in ethyl alcohol or isopropyl alcohol at normal temperature for less than one minute. Unspecified chemicals may damage the LED package or lens.

6.3 Storage and Handling

• Sealed Package: Devices are shipped in a moisture-barrier bag with desiccant. They should be stored at ≤30°C and ≤70% Relative Humidity (RH) and used within one year of the bag seal date.
• Opened Package: Once the moisture barrier bag is opened, components are exposed to ambient humidity. They should be stored at ≤30°C and ≤60% RH.
• Floor Life: It is recommended that devices removed from their original packaging undergo IR reflow soldering within 168 hours (7 days). For longer storage outside the original bag, they should be placed in a sealed container with appropriate desiccant or baked according to the appropriate moisture sensitivity level (MSL) procedures before use.

7. Packaging and Ordering Information

7.1 Tape and Reel Specifications

The device is supplied in embossed carrier tape for automated assembly.

• Tape width: 8 mm.
• Reel diameter: 7 inches.
• Pocket pitch and dimensions are specified to ensure compatibility with standard placement equipment.
• Packing quantity: 3000 pieces per full reel.
• Minimum order quantity for remnants: 500 pieces.
• The packaging conforms to ANSI/EIA-481 specifications.

8. Application Suggestions and Design Considerations

8.1 Current Limiting

LEDs are current-driven devices. A series current-limiting resistor is mandatory for each color channel when driving from a voltage source. The resistor value (R) can be calculated using Ohm's Law: R = (V_supply - V_F) / I_F, where V_F is the forward voltage of the specific color chip at the desired current I_F. Always use the maximum V_F from the datasheet for a conservative design to prevent overcurrent.

8.2 Thermal Management

While this is a low-power device, proper thermal design extends lifetime and maintains stable light output. Ensure the PCB has adequate copper area connected to the LED's thermal pad (if present) or pads to dissipate heat. Avoid operating at absolute maximum ratings for extended periods in high ambient temperatures.

8.3 Color Mixing and Control

For applications requiring specific colors (e.g., white, amber, purple) through additive mixing of the Red, Green, and Blue chips, independent pulse-width modulation (PWM) control of each channel is the most effective method. This allows for precise color and intensity control without the color shift associated with analog dimming (current reduction).

9. Technical Comparison and Differentiation

The LTSN-N213EGBW offers specific advantages in its class:

• Integrated Tri-Color Solution: Combines three discrete colors in one 4-pin package, saving PCB space and simplifying assembly compared to using three separate SMD LEDs.
• Wide Viewing Angle (120°): The diffused lens provides a broad, even illumination pattern suitable for front-panel indicators that need to be visible from various angles.
• Standardized Packaging: Compatibility with 8mm tape and reels, and a standard EIA footprint, ensures seamless integration into high-volume automated manufacturing lines.
• Comprehensive Binning: The detailed intensity and wavelength binning allows designers to select consistency levels appropriate for their application, from general indication to color-critical displays.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I drive the Red, Green, and Blue LEDs simultaneously at their maximum DC current (30mA, 20mA, 20mA)?

A: No. The Absolute Maximum Rating for total power dissipation (75-76 mW per chip) must be considered. Simultaneously driving all three at max current would likely exceed the package's total thermal capacity, leading to overheating, reduced lifetime, and potential failure. Derate currents based on thermal analysis of your specific application.

Q: What is the difference between Peak Wavelength and Dominant Wavelength?

A> Peak Wavelength (λ_P) is the physical wavelength where the LED emits the most optical power. Dominant Wavelength (λ_d) is a calculated value based on human eye sensitivity (CIE chromaticity) that represents the perceived color. For LEDs with a narrow spectrum (like these), they are often close, but λ_d is the relevant parameter for color specification.

Q: The Reverse Current is specified as 10μA max at 5V. Can I use this LED in a reverse-biased multiplexing circuit?

A: Strongly discouraged. The datasheet explicitly states the device is not designed for reverse operation. The I_R parameter is for test purposes only. Applying reverse bias in circuit operation can lead to unpredictable behavior and premature degradation.

Q: How critical is it to adhere to the 168-hour floor life after opening the moisture barrier bag?

A> It is a critical reliability guideline. SMD components absorb moisture from the air. During reflow, this moisture can turn to steam rapidly, causing internal delamination or \"popcorning,\" which cracks the package. If the exposure time is exceeded, the components must be baked according to the MSL3 profile before soldering to drive out the moisture.

11. Practical Application Case Study

Scenario: Designing a status indicator for a network switch.

The device requires a single multi-color indicator to show link status (Green = 1Gbps, Amber = 100Mbps, Red = No Link/Error) and activity (blinking).

• Component Selection: The LTSN-N213EGBW is ideal, replacing three separate LEDs.
• Circuit Design: Three GPIO pins from the switch's management controller, each connected to a color channel via a current-limiting resistor. The values are calculated separately for Red (V_F~2.5V), Green (V_F~3.8V), and Blue (not used for Amber; Amber is created by driving Red and Green simultaneously at specific ratios).
• Software Control: The controller drives the pins to create solid Green, solid Red, or a PWM mix of Red and Green for Amber. Activity blinking is implemented by toggling the relevant GPIO(s).
• Layout: The recommended PCB pad layout is followed. A small thermal relief on the ground connection pad aids soldering without creating a large heat sink that might affect reflow.
• Result: A compact, reliable, and visually clear status indicator that simplifies assembly (one part instead of three) and reduces Bill of Materials (BOM) complexity.

12. Operating Principle Introduction

Light Emitting Diodes (LEDs) are semiconductor devices that emit light through electroluminescence. When a forward voltage is applied across the p-n junction, electrons from the n-type material recombine with holes from the p-type material in the active region. This recombination releases energy in the form of photons (light). The specific wavelength (color) of the emitted light is determined by the energy bandgap of the semiconductor materials used:

• Red LED: Typically uses Aluminum Indium Gallium Phosphide (AlInGaP) material, which has a lower bandgap corresponding to longer wavelengths (red/orange).
• Green and Blue LEDs: Typically use Indium Gallium Nitride (InGaN) material. By varying the indium/gallium ratio, the bandgap can be tuned to emit green or blue light (blue requires a wider bandgap).

The diffused lens over the chip scatters the light, creating a wider, more uniform viewing angle compared to a clear lens which produces a more focused beam.

13. Technology Trends

The field of SMD LEDs continues to evolve with several observable trends:

• Increased Efficiency: Ongoing material science and epitaxial growth improvements yield higher luminous efficacy (more light output per electrical watt), allowing for brighter indicators or lower power consumption.
• Miniaturization: Packages continue to shrink (e.g., from 0603 to 0402 metric sizes) to fit ever-smaller consumer electronics, while maintaining or improving optical performance.
• Enhanced Color Rendering and Consistency: Tighter binning tolerances and improved manufacturing processes provide better color uniformity across production batches, which is critical for display and lighting applications.
• Integrated Solutions: Beyond multi-color, there is a trend towards LEDs with integrated drivers (IC-in-package) or built-in current regulation, simplifying circuit design further.
• Reliability Focus: Improved packaging materials and designs enhance resistance to thermal cycling, humidity, and other environmental stresses, extending operational lifetime in demanding applications.