SMD LED 16-213/T7D-AQ1R1QY/3T Datasheet - Pure White - 120° Viewing Angle - 5mA Drive - 3.2V Max - English Technical Documentation

1. Product Overview

The 16-213/T7D-AQ1R1QY/3T is a compact, surface-mount device (SMD) LED designed for modern electronic applications requiring miniaturization and high reliability. This component utilizes InGaN chip technology to produce a pure white light output. Its primary advantages include a significantly reduced footprint compared to traditional lead-frame LEDs, enabling higher packing density on printed circuit boards (PCBs), reduced storage requirements, and ultimately contributing to the development of smaller end-user equipment. The lightweight construction further makes it ideal for miniature and portable applications.

2. Key Features and Compliance

This LED is supplied packaged in 8mm tape on 7-inch diameter reels, making it fully compatible with standard automated pick-and-place assembly equipment. It is designed for use with both infrared and vapor phase reflow soldering processes. The device is a mono-color (pure white) type. It is constructed as a Pb-free product and is compliant with key environmental and safety regulations: the EU RoHS directive, the EU REACH regulation, and halogen-free standards (with Bromine <900 ppm, Chlorine <900 ppm, and their sum <1500 ppm).

3. Absolute Maximum Ratings

The device's operational limits must not be exceeded to ensure reliability and prevent damage. The maximum reverse voltage (V_R) is 5V. The continuous forward current (I_F) rating is 30 mA. For pulsed operation, the peak forward current (I_FP) can reach 100 mA under a duty cycle of 1/10 at 1 kHz. The maximum power dissipation (P_d) is 120 mW. The device can withstand electrostatic discharge (ESD) of up to 1000V (Human Body Model). The operating temperature range (T_opr) is from -40°C to +85°C, while the storage temperature range (T_stg) is slightly wider, from -40°C to +90°C. Soldering temperature guidelines are provided for reflow (260°C for 10 seconds max) and hand soldering (350°C for 3 seconds max).

4. Electro-Optical Characteristics

The following parameters are specified at an ambient temperature (T_a) of 25°C. The luminous intensity (I_v) ranges from a minimum of 72 millicandelas (mcd) to a maximum of 140 mcd, measured at a standard test current of 5 mA. The device features a very wide viewing angle, with a typical 2θ_1/2 of 120 degrees. The forward voltage (V_F) typically falls between 2.7V and 3.2V at 5 mA. The reverse current (I_R) has a maximum value of 50 µA when a reverse voltage of 5V is applied. Tolerances are noted: luminous intensity (±11%), dominant wavelength (±1 nm), and forward voltage (±0.05V).

5. Binning System

The LEDs are sorted into bins based on key performance parameters to ensure consistency in application design.

5.1 Luminous Intensity Binning

Luminous intensity is categorized into three bin codes at I_F=5mA: Q1 (72-90 mcd), Q2 (90-112 mcd), and R1 (112-140 mcd). The tolerance for this parameter within a bin is ±11%.

5.2 Forward Voltage Binning

Forward voltage is binned into five codes, also at I_F=5mA: 29 (2.7-2.8V), 30 (2.8-2.9V), 31 (2.9-3.0V), 32 (3.0-3.1V), and 33 (3.1-3.2V). The tolerance for forward voltage within a bin is ±0.1V.

5.3 Chromaticity Coordinate Binning

The pure white color is defined within the CIE 1931 chromaticity diagram. The specification outlines six groups (A1 through A6), each defining a quadrilateral area on the (x, y) coordinate plane. These coordinates ensure the emitted color falls within a controlled white region. The tolerance for the chromaticity coordinates is ±0.01.

6. Typical Performance Curves Analysis

The datasheet provides several characteristic curves crucial for circuit design. The Forward Current Derating Curve shows how the maximum allowable continuous forward current must be reduced as the ambient temperature increases above 25°C to avoid exceeding the power dissipation limit. The Relative Luminous Intensity vs. Ambient Temperature curve illustrates the typical decrease in light output as temperature rises, which is important for thermal management in applications. The Luminous Intensity vs. Forward Current graph shows the non-linear relationship between drive current and light output. The Forward Current vs. Forward Voltage (I-V Curve) is essential for determining the required driving voltage and series resistor value. The Spectrum Distribution plot characterizes the spectral power distribution of the emitted white light. Finally, the Radiation Diagram visually represents the spatial distribution of light intensity, confirming the 120-degree viewing angle.

7. Mechanical and Package Information

7.1 Package Dimensions

The LED has a compact SMD footprint. Detailed dimensional drawings are provided, including body length, width, height, and lead positions. All unspecified tolerances are ±0.1 mm. A suggested pad layout for PCB design is included for reference, though designers are advised to modify it based on their specific process requirements.

7.2 Polarity Identification and Labeling

The datasheet explains the labeling on the reel and packaging. Key labels include the Customer's Product Number (CPN), the manufacturer's Product Number (P/N), Packing Quantity (QTY), and the binning codes for Luminous Intensity Rank (CAT), Chromaticity Coordinates (HUE), and Forward Voltage Rank (REF). The Lot Number (LOT No.) is also provided for traceability.

8. Soldering, Assembly, and Handling Guidelines

8.1 Circuit Protection

A current-limiting resistor must always be used in series with the LED. The LED's exponential I-V characteristic means a small increase in voltage can cause a large, potentially destructive increase in current.

8.2 Storage and Moisture Sensitivity

The LEDs are packaged in a moisture-resistant bag with desiccant. The bag should not be opened until the components are ready for use. Before opening, storage conditions should be 30°C or less and 90% Relative Humidity (RH) or less. After opening, the components have a "floor life" of 1 year under conditions of 30°C/60%RH or less. Unused parts should be resealed in a moisture-proof package. If the desiccant indicator changes color or the storage time is exceeded, a baking treatment at 60 ±5°C for 24 hours is recommended before reflow soldering.

8.3 Soldering Process

A detailed temperature profile for Pb-free reflow soldering is provided. Key parameters include a pre-heating stage between 150-200°C for 60-120 seconds, a time above liquidus (217°C) of 60-150 seconds, and a peak temperature not exceeding 260°C for a maximum of 10 seconds. Maximum ramp-up and cool-down rates are specified. Reflow soldering should not be performed more than two times. Mechanical stress should not be applied to the LED during heating, and the PCB should not be warped after soldering.

9. Packaging and Ordering Information

9.1 Tape and Reel Specifications

The components are supplied on embossed carrier tape wound onto a 7-inch (178 mm) diameter reel. The reel load quantity is 3000 pieces. Detailed dimensions for the carrier tape, including pocket spacing and tape width, are provided.

9.2 Moisture-Resistant Packaging

The full packaging stack consists of the reel placed inside an aluminum moisture-proof bag along with a desiccant packet. The bag is labeled with relevant product information.

10. Application Notes and Design Considerations

10.1 Typical Applications

This LED is well-suited for a variety of indicator and backlighting tasks. Common applications include backlighting for instrument panel dashboards and switches, status indicators and keypad backlighting in telecommunication devices (phones, fax machines), flat backlighting units for small LCDs, and general-purpose indicator use.

10.2 Design Considerations

Designers must select an appropriate current-limiting resistor based on the supply voltage and the desired forward current (considering derating if needed). The wide 120-degree viewing angle makes it excellent for applications requiring broad visibility, but it may reduce perceived brightness in a narrow beam compared to a narrower-angle LED. The binning information (CAT, HUE, REF) should be carefully considered for applications requiring consistent brightness or color across multiple units. Thermal management on the PCB should be considered for designs operating at high ambient temperatures or high drive currents to maintain performance and longevity.

11. Technical Comparison and Positioning

Compared to larger through-hole LEDs, the primary advantage of this SMD type is its minimal space requirement and suitability for automated, high-volume assembly. The 120-degree viewing angle is notably wider than many standard LEDs, providing more uniform illumination in diffuser-based applications. Its low forward voltage range (2.7-3.2V) makes it compatible with common 3.3V and 5V logic supplies with a simple series resistor. The comprehensive environmental compliance (RoHS, REACH, Halogen-Free) positions it for use in global markets with strict regulatory requirements.

12. Frequently Asked Questions (FAQ)

Q: What is the purpose of the binning codes?
A: Binning ensures electrical and optical consistency. Using LEDs from the same luminous intensity (CAT) and forward voltage (REF) bins simplifies circuit design and ensures uniform brightness in an array. Using the same chromaticity (HUE) bin guarantees color consistency.

Q: Why is a current-limiting resistor mandatory?
A: LEDs are diodes with a very steep I-V curve. Without a resistor to limit current, even a small variation in supply voltage can cause the current to exceed the maximum rating, leading to immediate failure or reduced lifespan.

Q: Can I use this LED for continuous operation at 30mA?
A: The 30mA rating is the absolute maximum at 25°C. For reliable long-term operation, especially at elevated ambient temperatures, the current should be derated as shown in the Forward Current Derating Curve. Operating at 5-20mA is typical for most indicator applications.

Q: What does the "floor life" of 1 year mean?
A: After the moisture-proof bag is opened, the components can be exposed to factory ambient conditions (30°C/60%RH max) for up to one year before they require a baking treatment prior to reflow soldering. This prevents "popcorning" or package cracking during soldering due to absorbed moisture.

13. Operational Principle

This LED is based on a semiconductor chip made from Indium Gallium Nitride (InGaN). When a forward voltage exceeding the diode's threshold is applied, electrons and holes recombine within the semiconductor's active region, releasing energy in the form of photons (light). The specific composition of the InGaN layers is engineered to produce photons in the blue spectrum. A phosphor coating, typically a yellow-diffused resin as indicated in the device selection guide, then absorbs a portion of this blue light and re-emits it as yellow light. The combination of the remaining blue light and the converted yellow light results in the perception of white light by the human eye, a method known as phosphor-converted white LED technology.

14. Industry Trends and Context

Components like the 16-213 LED represent the ongoing trend in electronics towards miniaturization, increased functionality per unit area, and automated manufacturing. The move to Pb-free, halogen-free, and RoHS/REACH compliant materials reflects the industry-wide response to environmental and health regulations. The demand for efficient, reliable, and compact light sources continues to grow across consumer electronics, automotive interiors, and industrial control panels. The performance of such SMD LEDs, including their efficacy, color rendering, and thermal stability, continues to improve with advancements in semiconductor epitaxy and phosphor technology.