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SMD LED 15-11/T1D-AQRHY/2T Datasheet - Package 1.6x0.8x0.6mm - Voltage 2.7-3.15V - Power 40mW - White Color - English Technical Document

Complete technical datasheet for the 15-11 SMD LED in Pure White. Includes features, absolute maximum ratings, electro-optical characteristics, binning information, package dimensions, and handling precautions.
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PDF Document Cover - SMD LED 15-11/T1D-AQRHY/2T Datasheet - Package 1.6x0.8x0.6mm - Voltage 2.7-3.15V - Power 40mW - White Color - English Technical Document

1. Product Overview

The 15-11/T1D-AQRHY/2T is a compact, surface-mount LED designed for modern electronic applications requiring reliable indicator or backlighting functionality. This mono-color, pure white LED offers a balance of performance and miniaturization, enabling designers to achieve higher packing density and reduce overall equipment size.

1.1 Core Advantages

The primary advantages of this component stem from its SMD (Surface Mount Device) package. It is significantly smaller than traditional lead-frame type LEDs, which directly translates to smaller PCB footprints, reduced storage space requirements, and ultimately, more compact end products. Its lightweight construction further makes it ideal for miniature and portable applications.

1.2 Target Market and Applications

This LED is well-suited for a variety of applications across different industries. Common uses include backlighting for instrument panel dashboards and switches in automotive or industrial settings. In telecommunications, it serves as an indicator or backlight in devices like telephones and fax machines. It is also applicable for flat backlighting of LCDs, general switch and symbol illumination, and other general-purpose indicator needs.

2. Technical Specifications Deep Dive

This section provides a detailed, objective analysis of the key technical parameters defined in the datasheet.

2.1 Absolute Maximum Ratings

The Absolute Maximum Ratings define the stress limits beyond which permanent damage to the device may occur. These are not recommended operating conditions.

2.2 Electro-Optical Characteristics

These parameters are measured at a standard test condition of 25°C ambient temperature and a forward current (IF) of 5mA.

Critical Note on Reverse Voltage: The datasheet explicitly states that the reverse voltage condition is applied for infrared (IR) test purposes only. The device is not designed for operation in reverse bias. Applying a reverse voltage in circuit operation is not supported.

3. Binning System Explanation

To ensure consistency in mass production, LEDs are sorted into performance bins. The 15-11 LED uses a three-dimensional binning system for luminous intensity, forward voltage, and chromaticity.

3.1 Luminous Intensity Binning

Luminous intensity is sorted into two primary bins, labeled Q and R, based on measurements at IF = 5mA.

A general tolerance of ±11% is also noted for luminous intensity.

3.2 Forward Voltage Binning

Forward voltage is sorted into three bins (15, 16, 17) to aid in circuit design for current regulation.

3.3 Chromaticity Coordinate Binning

The pure white color is defined by chromaticity coordinates (CIE x, y) on the 1931 CIE diagram. The datasheet defines six bins (1 through 6), each specifying a quadrilateral area on the color chart. The coordinates for the corners of each bin are provided. The tolerance for the chromaticity coordinates is ±0.01. This binning ensures color consistency across different production lots.

4. Mechanical and Package Information

4.1 Package Dimensions

The LED comes in a very small surface-mount package. Key dimensions (in mm, tolerance ±0.1mm unless noted) include a body size of approximately 1.6mm in length, 0.8mm in width, and 0.6mm in height. The package drawing clearly indicates the cathode mark for correct polarity orientation during assembly.

4.2 Polarity Identification

Correct polarity is crucial for LED operation. The package features a distinct cathode mark. Designers must align this mark with the corresponding cathode pad on the PCB layout to ensure proper electrical connection.

5. Soldering and Assembly Guidelines

Proper handling and soldering are critical to maintaining LED performance and reliability.

5.1 Reflow Soldering Profile

The component is compatible with infrared and vapor phase reflow processes. A recommended Pb-free reflow profile is provided:

Important: Reflow soldering should not be performed more than two times on the same LED.

5.2 Hand Soldering

If hand soldering is necessary, extreme care must be taken. The soldering iron tip temperature should be less than 350°C, and contact time per terminal should not exceed 3 seconds. A low-power iron (≤25W) is recommended. Allow an interval of at least 2 seconds between soldering each terminal to prevent thermal damage.

5.3 Storage and Moisture Sensitivity

The LEDs are packaged in moisture-resistant bags with desiccant.

6. Packaging and Ordering Information

6.1 Tape and Reel Specifications

The product is supplied in 8mm wide carrier tape on 7-inch diameter reels. Each reel contains 2000 pieces. Detailed dimensions for the carrier tape pockets and the reel are provided in the datasheet to ensure compatibility with automated pick-and-place equipment.

6.2 Label Explanation

The reel label contains key information for traceability and verification:

7. Application Suggestions and Design Considerations

7.1 Current Limiting is Mandatory

LEDs are current-driven devices. The datasheet strongly emphasizes that an external current-limiting resistor must be used in series with the LED. The forward voltage has a range (2.7-3.15V), and its negative temperature coefficient means it decreases as the junction heats up. Without a resistor, even a small increase in supply voltage can cause a large, potentially destructive increase in forward current. The absolute maximum continuous current is 10mA.

7.2 Thermal Management

While the package is small, attention to thermal management is still important. The maximum power dissipation is 40mW. Ensuring adequate PCB copper area around the LED pads can help sink heat and maintain lower junction temperatures, which promotes longer lifespan and stable light output.

7.3 ESD Precautions

Although the LED has a 2000V HBM ESD rating, standard ESD handling precautions should be observed during assembly and handling to prevent latent damage.

8. Technical Comparison and Differentiation

The 15-11 LED differentiates itself primarily through its miniature size (1.6x0.8x0.6mm), which is smaller than many common LED packages like 0603 or 0402. Its wide 140-degree viewing angle makes it suitable for applications requiring broad illumination rather than a focused beam. The comprehensive binning system for intensity, voltage, and color provides designers with predictable performance, which is critical for applications requiring visual consistency across multiple units.

9. Frequently Asked Questions (Based on Technical Parameters)

9.1 What resistor value should I use for a 5V supply?

Using Ohm's Law (R = (Vsupply - VF) / IF) and considering the worst-case VF to ensure current never exceeds 10mA: For Vsupply=5V and the lowest VF=2.7V (Bin 15), target IF=8mA for margin. R = (5 - 2.7) / 0.008 = 287.5Ω. A standard 270Ω or 300Ω resistor would be appropriate. Always verify current with the actual VF of your specific bin.

9.2 Can I drive this LED without a resistor using a constant current source?

Yes, a constant current driver set to a maximum of 10mA (continuous) is an excellent alternative to a series resistor and provides more stable performance over voltage and temperature variations.

9.3 How do I interpret the chromaticity bin codes (1-6)?

The bin codes (1-6) represent specific regions on the CIE 1931 color space diagram defined by four (x,y) coordinate pairs. These bins ensure the white light emitted falls within a controlled color range. For most general applications, any bin within the specified range is acceptable. For applications requiring precise color matching (e.g., multi-LED backlights), specifying a single bin or adjacent bins is necessary.

10. Practical Use Case Example

Scenario: Designing a status indicator panel for a portable medical device.

The device requires small, reliable, color-consistent white LEDs to backlight several membrane switches and indicate power/status. The 15-11 LED is selected for its miniature size, allowing tight placement on a crowded PCB. The designer specifies Bin R for higher brightness and Bin 16 for forward voltage to simplify the single current-limiting resistor calculation for all LEDs in parallel from a 3.3V rail. The LEDs are placed on the PCB layout according to the package drawing, ensuring the cathode mark aligns with the designated pad. The assembly house uses the provided reflow profile. The final product benefits from a clean, uniformly lit interface with minimal board space consumption.

11. Operational Principle

This LED is a semiconductor photonic device. It is constructed using InGaN (Indium Gallium Nitride) chip material, which is known for producing light in the blue to green spectrum. To achieve white light, the chip is coated with a yellow phosphor-filled, diffused resin. When a forward voltage is applied, electrons and holes recombine within the InGaN semiconductor junction, emitting blue light. This blue light then excites the yellow phosphor, which re-emits yellow light. The combination of blue and yellow light is perceived by the human eye as white light. The diffused resin helps scatter the light, contributing to the wide 140-degree viewing angle.

12. Industry Trends and Context

The 15-11 LED represents ongoing trends in the optoelectronics industry towards miniaturization, increased efficiency, and enhanced reliability. The move to Pb-free soldering compliance and halogen-free materials (Br <900ppm, Cl <900ppm) aligns with global environmental regulations like RoHS, REACH, and various green initiatives. The integration of basic ESD protection (2000V HBM) is becoming standard even in small-signal components to improve yield and robustness in automated manufacturing environments. The detailed binning systems reflect the industry's focus on providing predictable performance for high-volume, quality-sensitive applications, moving beyond simple functional components to engineered light sources.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.