SMD LED 19-219/T7D-AV1W1E/3T Datasheet - Size 1.6x0.8x0.77mm - Voltage 2.75-3.65V - Power 110mW - Pure White - English Technical Document

1. Product Overview

The 19-219/T7D-AV1W1E/3T is a compact, surface-mount LED designed for modern electronic applications requiring reliable indicator lighting or backlighting in a minimal footprint.

1.1 Core Advantages and Product Positioning

This LED component offers significant advantages over traditional lead-frame type LEDs. Its primary benefit is its extremely small size, which enables the design of smaller printed circuit boards (PCBs), higher component packing density, reduced storage space requirements, and ultimately, the creation of more compact end-user equipment. The lightweight nature of the SMD package makes it particularly suitable for miniature and portable applications where weight and space are critical constraints.

1.2 Target Markets and Applications

The 19-219 SMD LED is versatile and finds use in several key application areas:

• Telecommunications Equipment: Used as status indicators and for backlighting keys or displays in telephones and fax machines.
• Display Technology: Ideal for flat backlighting of liquid crystal displays (LCDs), as well as for illuminating switches and symbols on control panels.
• General Purpose Indication: Suitable for a wide range of consumer and industrial electronics where a small, bright, and reliable indicator light is needed.

2. Technical Specifications Deep Dive

This section provides a detailed, objective analysis of the LED's key technical parameters, which are essential for proper circuit design and reliability assurance.

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation under or at these conditions is not guaranteed and should be avoided for reliable performance.

• Reverse Voltage (V_R): 5 V. Exceeding this voltage in reverse bias can cause junction breakdown.
• Continuous Forward Current (I_F): 25 mA. The maximum DC current that can be continuously applied.
• Peak Forward Current (I_FP): 100 mA. This is permissible only under pulsed conditions with a duty cycle of 1/10 at 1 kHz.
• Power Dissipation (P_d): 110 mW. The maximum power the package can dissipate at an ambient temperature (T_a) of 25\u00b0C.
• Electrostatic Discharge (ESD) Human Body Model (HBM): 1000 V. Indicates a moderate level of ESD sensitivity; proper handling procedures are required.
• Operating Temperature (T_opr): -40 to +85 \u00b0C. The ambient temperature range over which the device is specified to operate.
• Storage Temperature (T_stg): -40 to +90 \u00b0C.
• Soldering Temperature: The device can withstand reflow soldering with a peak temperature of 260\u00b0C for up to 10 seconds, or hand soldering at 350\u00b0C for up to 3 seconds per terminal.

2.2 Electro-Optical Characteristics

These are the typical performance parameters measured at a standard ambient temperature of 25\u00b0C. They are crucial for predicting the LED's behavior in an application.

• Luminous Intensity (I_v): Ranges from a minimum of 715 mcd to a maximum of 1420 mcd when driven at the standard test current of 20 mA. The specific value is determined by the bin code (V1, V2, W1).
• Viewing Angle (2\u03b8_1/2): A wide 130-degree typical viewing angle, providing a broad emission pattern suitable for area illumination and indicators.
• Forward Voltage (V_F): Ranges from 2.75 V to 3.65 V at 20 mA. The exact range is specified by the forward voltage bin code (5, 6, 7). This parameter is critical for designing the current-limiting circuitry.
• Reverse Current (I_R): Maximum of 50 \u00b5A when a reverse bias of 5 V is applied.

Important Notes: The datasheet specifies a tolerance of \u00b111% on luminous intensity and \u00b10.05V on forward voltage for the binned values.

3. Binning System Explanation

To ensure consistency in production, LEDs are sorted into "bins" based on key performance parameters. This allows designers to select parts that meet specific requirements for brightness and electrical characteristics.

3.1 Luminous Intensity Binning

The LEDs are categorized into three bins based on their measured luminous intensity at 20 mA:

• Bin V1: 715 mcd (Min) to 900 mcd (Max)
• Bin V2: 900 mcd (Min) to 1120 mcd (Max)
• Bin W1: 1120 mcd (Min) to 1420 mcd (Max)

3.2 Forward Voltage Binning

The LEDs are also binned according to their forward voltage drop at 20 mA:

• Bin 5: 2.75 V (Min) to 3.05 V (Max)
• Bin 6: 3.05 V (Min) to 3.35 V (Max)
• Bin 7: 3.35 V (Min) to 3.65 V (Max)

3.3 Chromaticity Coordinate Binning

For color consistency, the white light output is defined by chromaticity coordinates on the CIE 1931 diagram. The datasheet defines six bins (1 through 6), each specifying a quadrilateral area on the color chart defined by four (x, y) coordinate pairs. This ensures the emitted white light falls within a controlled color space. The tolerance for these coordinates is \u00b10.01.

4. Performance Curve Analysis

The datasheet includes several typical characteristic curves that illustrate how the LED's performance varies with operating conditions.

4.1 Spectrum Distribution

A graph shows the relative luminous intensity as a function of wavelength (\u03bb). For a white LED based on InGaN with a yellow phosphor (as indicated in the Device Selection Guide), this curve would typically show a blue peak from the LED chip and a broader yellow peak from the phosphor, combining to produce white light.

4.2 Forward Current vs. Forward Voltage (I-V Curve)

This fundamental curve shows the exponential relationship between the current flowing through the LED and the voltage across it. It highlights why a current-limiting device (like a resistor or constant-current driver) is mandatory, as a small increase in voltage beyond the knee point causes a large, potentially destructive, increase in current.

4.3 Luminous Intensity vs. Forward Current

This curve demonstrates that light output is generally proportional to forward current, but the relationship may become sub-linear at very high currents due to efficiency droop and thermal effects.

4.4 Luminous Intensity vs. Ambient Temperature

This graph is critical for understanding thermal performance. It shows how luminous intensity decreases as the ambient temperature (T_a) increases. Designers must account for this derating in applications with high ambient temperatures.

4.5 Forward Current Derating Curve

This curve defines the maximum allowable continuous forward current as a function of ambient temperature. As temperature rises, the maximum safe current must be reduced to prevent exceeding the device's power dissipation limits and to ensure long-term reliability.

4.6 Radiation Diagram

A polar plot illustrating the spatial distribution of light intensity, confirming the 130-degree typical viewing angle.

5. Mechanical and Package Information

5.1 Package Dimensions

The 19-219 LED has a compact SMD footprint. Key dimensions (in mm) include:

• Length: 1.6 \u00b1 0.1
• Width: 0.8 \u00b1 0.1
• Height: 0.77 \u00b1 0.1

The drawing provides top, side, and bottom views with detailed measurements for the lens, leads, and internal structure.

5.2 Pad Design and Polarity Identification

A recommended solder pad layout is provided to ensure reliable soldering and proper thermal management. The cathode pad is clearly identified in the diagram (typically marked by a notch, a green triangle in the tape, or a different pad shape). The suggested pad dimensions are 0.8mm x 0.55mm but are noted as a reference that can be modified based on specific PCB design requirements.

6. Soldering and Assembly Guidelines

Proper handling and soldering are vital for the reliability of SMD components.

6.1 Reflow Soldering Profile

A detailed Pb-free reflow temperature profile is specified:

• Pre-heating: 150\u2013200\u00b0C for 60\u2013120 seconds.
• Time Above Liquidus (217\u00b0C): 60\u2013150 seconds.
• Peak Temperature: Maximum of 260\u00b0C, held for a maximum of 10 seconds.
• Heating Rate: Maximum 6\u00b0C/second.
• Cooling Rate: Maximum 3\u00b0C/second.

Critical Note: Reflow soldering should not be performed more than two times on the same device.

6.2 Hand Soldering

If hand soldering is necessary, the iron tip temperature must be below 350\u00b0C, and contact time per terminal must not exceed 3 seconds. A soldering iron with a power rating of 25W or less is recommended. A minimum interval of 2 seconds should be left between soldering each terminal to prevent thermal shock.

6.3 Storage and Moisture Sensitivity

The LEDs are packaged in a moisture-resistant barrier bag with desiccant.

• Before Opening: Store at \u2264 30\u00b0C and \u2264 90% Relative Humidity (RH).
• After Opening (Floor Life): 1 year at \u2264 30\u00b0C and \u2264 60% RH. Unused parts should be resealed in a moisture-proof package.
• Baking: If the desiccant indicator shows moisture absorption or the storage time is exceeded, bake at 60 \u00b1 5\u00b0C for 24 hours before use.

6.4 Critical Precautions

• Over-current Protection: An external current-limiting resistor or circuit is absolutely mandatory. The LED's exponential I-V characteristic means a small voltage change causes a large current change, leading to immediate burnout without protection.
• Mechanical Stress: Avoid applying stress to the LED body during soldering or in the final assembly. Do not warp the PCB after soldering.
• Repairing: Repair after soldering is strongly discouraged. If unavoidable, a specialized double-head soldering iron must be used to simultaneously heat both terminals, preventing mechanical stress on the solder joints.
• ESD Precautions: The product is sensitive to electrostatic discharge. Use appropriate ESD-safe handling procedures throughout manufacturing.

7. Packaging and Ordering Information

7.1 Tape and Reel Specifications

The LEDs are supplied in industry-standard 8mm wide embossed carrier tape wound on a 7-inch diameter reel. Each reel contains 3000 pieces. Detailed dimensions for the carrier tape pockets and the reel are provided.

7.2 Label Explanation

The reel label contains several codes essential for traceability and verification:

• CPN: Customer's Product Number
• P/N: Manufacturer's Product Number (e.g., 19-219/T7D-AV1W1E/3T)
• QTY: Packing Quantity
• CAT: Luminous Intensity Rank (e.g., V1, W1)
• HUE: Chromaticity Coordinates & Dominant Wavelength Rank (e.g., Bin 1-6)
• REF: Forward Voltage Rank (e.g., Bin 5-7)
• LOT No: Manufacturing Lot Number for traceability.

8. Application Design Considerations

8.1 Circuit Design

When integrating this LED, the most critical step is the calculation of the series current-limiting resistor. The resistor value (R_s) can be approximated using Ohm's Law: R_s = (V_supply - V_F) / I_F. Use the maximum V_F from the selected bin (or the absolute max of 3.65V for a conservative design) and the desired drive current (not to exceed 25 mA continuous). Always calculate the resistor's power rating as well: P_R = (I_F)² * R_s.

8.2 Thermal Management

Although small, the LED generates heat. For optimal longevity and stable light output:

• Adhere to the forward current derating curve at high ambient temperatures.
• Ensure the PCB has adequate copper area connected to the thermal pads (if any) or the cathode/anode traces to act as a heat sink.
• Avoid placing the LED near other heat-generating components.

8.3 Optical Integration

The wide 130-degree viewing angle makes it suitable for applications requiring broad, even illumination. For more focused light, external lenses or light guides may be necessary. The yellow diffused resin helps in achieving a more uniform appearance.

9. Technical Comparison and Differentiation

The 19-219 LED differentiates itself primarily through its combination of a very small form factor (1.6x0.8mm footprint) and relatively high luminous intensity (up to 1420 mcd). Compared to larger SMD LEDs (e.g., 3528, 5050), it offers superior space savings. Compared to even smaller chip LEDs, it may offer easier handling and soldering due to its defined package. Its compliance with RoHS, REACH, and Halogen-Free standards makes it suitable for global markets with strict environmental regulations.

10. Frequently Asked Questions (Based on Technical Parameters)

10.1 Why is a current-limiting resistor absolutely necessary?

The forward voltage (V_F) of an LED is not a fixed value like a battery; it has a tolerance and a negative temperature coefficient (it decreases as the junction heats up). Connecting an LED directly to a voltage source even slightly above its V_F will cause current to rise uncontrollably (thermal runaway), instantly destroying the device. The resistor provides a linear, predictable relationship between supply voltage and current.

10.2 Can I drive this LED with a 3.3V supply?

Possibly, but careful design is required. Since the V_F range is 2.75V to 3.65V, an LED from Bin 7 (V_F 3.35-3.65V) may not light up at all at 3.3V, or will be very dim. An LED from Bin 5 (V_F 2.75-3.05V) will work, but the voltage headroom (3.3V - V_F) is very small, making the current highly sensitive to variations in V_F and the supply voltage. A constant-current driver is highly recommended for stable performance when the supply voltage is close to V_F.

10.3 What do the bin codes (e.g., W1, 6) mean for my application?

Bin codes ensure consistency within a production batch. If your design requires uniform brightness across multiple LEDs, you should specify LEDs from the same luminous intensity bin (e.g., all W1). If your circuit design has tight voltage margins, specifying a forward voltage bin (e.g., all Bin 6) ensures similar electrical behavior. For color-critical applications, specifying the chromaticity bin is essential.

11. Design and Usage Case Study

Scenario: Designing a status indicator panel for a compact IoT sensor module.

The module has limited PCB space and is powered by a 5V USB connection. It requires three status LEDs: Power (steady), Data Transmission (blinking), and Error (blinking).

1. Component Selection: The 19-219 LED is chosen for its tiny footprint, allowing all three LEDs to fit in a row on the edge of the small PCB.
2. Circuit Design: The supply is 5V. Targeting a standard 20mA drive current and using the maximum V_F of 3.65V for a conservative design: R_s = (5V - 3.65V) / 0.020A = 67.5\u03a9. The nearest standard 1% resistor value is 68\u03a9. Power dissipation: P = (0.020^2)*68 = 0.0272W, so a standard 1/10W (0.1W) resistor is more than sufficient.
3. PCB Layout: The recommended solder pad layout is used. A small keep-out area is maintained around each LED to prevent light bleeding. The cathode pads are connected to the ground plane for slight thermal improvement.
4. Software Control: The LEDs are driven by GPIO pins of a microcontroller. The blinking functions are implemented in firmware with appropriate delays.
5. Result: A reliable, bright, and space-efficient indicator system is achieved. By ordering all LEDs from the same luminous bin (e.g., V2), visual consistency is guaranteed.

12. Technology Principle Introduction

The 19-219 LED generates white light using a common and efficient method for SMD LEDs. The core of the device is a semiconductor chip made of Indium Gallium Nitride (InGaN), which emits light in the blue region of the spectrum when electrical current passes through it (electroluminescence). This blue LED chip is encapsulated within a package filled with a transparent epoxy resin that is doped with a yellow-emitting phosphor material. Part of the blue light from the chip is absorbed by the phosphor, which then re-emits it as yellow light. The remaining unabsorbed blue light mixes with the emitted yellow light, and the human eye perceives this combination as white light. The specific ratios of the phosphor and the properties of the blue chip determine the exact color temperature (cool white, pure white, warm white) and chromaticity coordinates of the emitted light.

13. Industry Trends and Developments

The market for SMD LEDs like the 19-219 continues to evolve. Key trends include:

• Increased Efficiency (Lumens per Watt): Ongoing improvements in InGaN chip technology and phosphor formulations are leading to higher luminous efficacy, meaning brighter light output for the same electrical input power.
• Miniaturization: The drive for smaller end products pushes the development of LEDs with even smaller footprints and lower profiles while maintaining or improving optical performance.
• Improved Color Rendering and Consistency: Advances in phosphor technology and tighter binning processes allow for LEDs with higher Color Rendering Index (CRI) values and more consistent color from batch to batch, which is critical for display backlighting and architectural lighting.
• Integration and Smart Features: While this is a discrete component, the broader industry trend is towards integrated LED modules that may include drivers, controllers, and communication interfaces (like I2C) within a single package.
• Sustainability Focus: Compliance with environmental regulations (RoHS, REACH, Halogen-Free) is now a standard requirement, and there is increasing focus on the recyclability of materials and reducing the use of rare-earth elements in phosphors.