SMD LED 16-216/T3D-AQ1R2TY/3T Datasheet - Pure White - 2.6-3.0V - 25mA - English Technical Document

1. Product Overview

The 16-216/T3D-AQ1R2TY/3T is a surface-mount device (SMD) LED designed for modern, compact electronic applications. It is a mono-color type, emitting pure white light, and is constructed using Pb-free materials, ensuring compliance with environmental regulations such as RoHS. Its primary advantage lies in its miniature size, which facilitates smaller printed circuit board (PCB) designs, higher component packing density, and ultimately contributes to the development of more compact and lightweight end-user equipment.

1.1 Core Advantages and Target Market

The key benefits of this LED component stem from its SMD packaging. Compared to traditional lead-frame LEDs, it offers significant space savings on the PCB, reduced storage requirements, and is fully compatible with automated pick-and-place assembly equipment, streamlining high-volume manufacturing processes. It is also compatible with standard infrared and vapor phase reflow soldering techniques. These characteristics make it an ideal choice for applications where miniaturization, weight reduction, and automated production are critical. Its target markets include consumer electronics, automotive interiors, telecommunications, and general indicator/backlighting uses.

2. Technical Specifications: In-Depth Objective Analysis

This section provides a detailed, objective breakdown of the LED's electrical, optical, and thermal parameters as defined in the datasheet. Understanding these limits and typical performance figures is essential for reliable circuit design.

2.1 Absolute Maximum Ratings

The Absolute Maximum Ratings define the stress limits beyond which permanent damage to the device may occur. These are not conditions for normal operation.

• Reverse Voltage (V_R): 5 V. Exceeding this voltage in reverse bias can cause junction breakdown.
• Continuous Forward Current (I_F): 25 mA. This is the maximum DC current that can be applied continuously.
• Peak Forward Current (I_FP): 100 mA. This is permissible only under pulsed conditions (duty cycle 1/10, frequency 1 kHz).
• Power Dissipation (P_d): 110 mW. This is the maximum power the package can dissipate at an ambient temperature (T_a) of 25°C.
• Operating Temperature (T_opr): -40 to +85 °C. The ambient temperature range for reliable operation.
• Storage Temperature (T_stg): -40 to +90 °C.
• Electrostatic Discharge (ESD) Human Body Model (HBM): 150 V. This indicates a moderate sensitivity to static electricity, requiring standard ESD precautions during handling.
• Soldering Temperature: The device can withstand reflow soldering with a peak temperature of 260°C for up to 10 seconds, or hand soldering at 350°C for up to 3 seconds per terminal.

2.2 Electro-Optical Characteristics

These parameters are measured at a standard test condition of T_a = 25°C and represent typical performance.

• Luminous Intensity (I_v): Ranges from a minimum of 72 mcd to a maximum of 180 mcd, with a typical value implied within this range, when driven at I_F = 5 mA. A tolerance of ±11% applies.
• Viewing Angle (2θ_1/2): A typical wide viewing angle of 130 degrees, indicating a diffuse emission pattern suitable for area illumination and backlighting.
• Forward Voltage (V_F): Ranges from 2.6 V (min) to 3.0 V (max) at I_F = 5 mA. A tolerance of ±0.05V is noted. This parameter is crucial for current-limiting resistor calculation.
• Reverse Current (I_R): Maximum of 50 µA when a reverse voltage of 5 V is applied.

3. Binning System Explanation

To ensure consistency in mass production, LEDs are sorted into performance bins. This allows designers to select components that meet specific brightness and voltage requirements for their application.

3.1 Luminous Intensity Binning

The luminous output is categorized into four bin codes (Q1, Q2, R1, R2), each defining a specific millicandela range measured at I_F = 5 mA. For example, bin Q1 covers LEDs with intensity from 72 to 90 mcd, while bin R2 covers 140 to 180 mcd.

3.2 Forward Voltage Binning

The forward voltage is binned into four codes (28, 29, 30, 31), each representing a 0.1 V range from 2.6-2.7V up to 2.9-3.0V at I_F = 5 mA. This helps in designing power supplies and predicting current draw variations.

3.3 Chromaticity Coordinate Binning

The pure white color is defined within the CIE 1931 chromaticity coordinate system. The datasheet specifies six bin codes (1 through 6) within Group "A," each defined by a quadrilateral area on the CIE x,y chart. The coordinates for each bin corner are provided, with a tolerance of ±0.01. This ensures the emitted white light falls within a controlled, consistent color space.

4. Performance Curve Analysis

Graphical data provides insight into the LED's behavior under varying conditions, which is vital for robust design.

4.1 Spectrum Distribution

The relative luminous intensity curve versus wavelength shows the spectral output of this white LED, which is typically generated by a blue LED chip combined with a yellow phosphor. The peak and spectral width influence the perceived color quality and Color Rendering Index (CRI).

4.2 Forward Current vs. Forward Voltage (I-V Curve)

This curve illustrates the non-linear relationship between current and voltage. It shows the turn-on voltage and how V_F increases with I_F. This data is essential for thermal management and driver design, as excess voltage drops across the LED convert to heat.

4.3 Luminous Intensity vs. Forward Current

This plot shows how light output increases with drive current. It is generally non-linear, and operating above the recommended current may yield diminishing returns in efficiency and accelerate lumen depreciation.

4.4 Luminous Intensity vs. Ambient Temperature

This curve demonstrates the thermal quenching effect: as the junction temperature rises, the luminous output typically decreases. Understanding this derating is critical for applications operating in high-temperature environments.

4.5 Forward Current Derating Curve

This graph defines the maximum allowable continuous forward current as a function of the ambient temperature. As T_a increases, the maximum permissible I_F must be reduced to prevent exceeding the device's maximum junction temperature and power dissipation rating.

4.6 Radiation Diagram

The polar radiation pattern visually confirms the 130-degree viewing angle, showing the angular distribution of light intensity.

5. Mechanical and Package Information

5.1 Package Dimensions

The datasheet provides a detailed dimensional drawing of the LED package. Key measurements include the overall length, width, and height, as well as the electrode pad sizes and spacing. All tolerances are typically ±0.1 mm unless otherwise specified. A suggested PCB land pattern (pad layout) is provided for reference, but designers are advised to modify it based on their specific manufacturing process and reliability requirements.

5.2 Polarity Identification

The cathode (negative) terminal is typically identified on the package, often by a marking such as a notch, dot, or green tint. Correct polarity orientation during assembly is mandatory for proper function.

6. Soldering and Assembly Guidelines

Proper handling and soldering are critical to maintaining device reliability and performance.

6.1 Current Limiting

An external current-limiting resistor is mandatory. The LED's exponential I-V characteristic means a small increase in voltage can cause a large, potentially destructive increase in current. The resistor value must be calculated based on the supply voltage, the LED's forward voltage (considering binning), and the desired operating current (not to exceed 25 mA continuous).

6.2 Storage and Moisture Sensitivity

The LEDs are packaged in a moisture-resistant bag with desiccant. The bag should not be opened until the components are ready for use. If the bag is opened, the components have a "floor life" of 1 year under controlled conditions (30°C/60% RH max). Exceeding this or if the desiccant indicator changes color requires a bake-out at 60 ± 5°C for 24 hours before reflow soldering to prevent "popcorn" damage from moisture vaporization.

6.3 Reflow Soldering Profile

A detailed Pb-free reflow temperature profile is provided:

• Pre-heating: 150-200°C for 60-120 seconds.
• Time Above Liquidus (217°C): 60-150 seconds.
• Peak Temperature: 260°C maximum, held for no more than 10 seconds.
• Heating/Cooling Rates: Maximum 6°C/sec heating and 3°C/sec cooling above 255°C.

Reflow soldering should not be performed more than two times. Avoid mechanical stress on the package during heating and cooling.

6.4 Hand Soldering and Rework

If hand soldering is necessary, use a soldering iron with a tip temperature below 350°C and apply heat to each terminal for no more than 3 seconds. Use a low-power iron (25W max) and allow a cooling interval of at least 2 seconds between terminals. Rework is strongly discouraged. If unavoidable, a specialized double-head soldering iron must be used to simultaneously heat both terminals for removal, and the effect on LED characteristics must be evaluated beforehand.

7. Packaging and Ordering Information

7.1 Tape and Reel Specifications

The components are supplied on 8mm wide embossed carrier tape wound onto a 7-inch (178mm) diameter reel. Each reel contains 3000 pieces. Detailed dimensions for the carrier tape pockets and the reel are provided in the datasheet.

7.2 Label Explanation

The reel label contains several key identifiers:

• P/N: The full product number.
• QTY: The quantity of pieces on the reel.
• CAT: The Luminous Intensity bin code (e.g., Q1, R2).
• HUE: The Chromaticity Coordinate bin code (e.g., 1, 4).
• REF: The Forward Voltage bin code (e.g., 28, 30).
• LOT No: Traceability lot number.

This information allows for precise traceability and selection of binned components for production.

8. Application Suggestions and Design Considerations

8.1 Typical Application Scenarios

• Automotive Interiors: Backlighting for dashboard instruments, switches, and control panels.
• Telecommunications: Status indicators and keypad backlighting in phones and fax machines.
• Consumer Electronics: Flat backlighting for small LCD displays, switch illumination, and symbolic indicators.
• General Purpose Indication: Power status, mode indicators, and decorative lighting in various electronic devices.

8.2 Design Considerations

• Thermal Management: Although small, the LED generates heat. Ensure adequate PCB copper area or thermal vias, especially when driving near maximum current or in high ambient temperatures. Adhere to the current derating curve.
• Optical Design: The wide 130-degree viewing angle provides good off-axis visibility. For focused light, external lenses or light guides may be required.
• ESD Protection: Implement standard ESD controls in the assembly area. Consider adding transient voltage suppression on sensitive lines if the application environment is prone to static.
• Application Restrictions: The datasheet notes that this standard commercial-grade component may not be suitable for high-reliability applications without additional qualification. These include military/aerospace, automotive safety/security systems (e.g., airbags, brakes), and life-critical medical equipment. For such uses, consult the manufacturer for product variants designed and tested to meet the relevant stringent standards.

9. Technical Comparison and Differentiation

Compared to larger, through-hole LEDs, the primary differentiation of this 16-216 SMD LED is its form factor and compatibility with automated assembly. It enables significant miniaturization. Within the SMD LED category, its key parameters—such as its specific luminous intensity bins, wide viewing angle, and defined chromaticity bins for pure white—allow designers to select a component with predictable performance for consistent end-product quality. The detailed binning system is a particular advantage for applications requiring tight brightness and color matching across multiple units.

10. Frequently Asked Questions (Based on Technical Parameters)

10.1 What resistor value should I use?

The resistor value (R) is calculated using Ohm's Law: R = (V_supply - V_F) / I_F. Use the maximum V_F from the datasheet (3.0V) for a conservative design that ensures the current never exceeds your target I_F (e.g., 20 mA for a safety margin below the 25 mA max). For a 5V supply: R = (5V - 3.0V) / 0.020 A = 100 Ω. Always calculate power dissipation in the resistor as well: P = I_F² * R.

10.2 Why is the light output lower when the board gets hot?

This is due to "thermal quenching," a fundamental property of LED semiconductors. As the junction temperature increases, the internal quantum efficiency decreases, resulting in lower luminous output. This is graphically shown in the "Luminous Intensity vs. Ambient Temperature" curve. Proper thermal design mitigates this effect.

10.3 Can I drive it with a 3.3V supply without a resistor?

No. Even if the supply voltage is close to the LED's typical V_F, the lack of a current-limiting resistor is dangerous. Manufacturing tolerances and temperature variations mean the actual V_F could be lower than 3.3V, causing excessive current. A resistor (or a constant-current driver) is always required for reliable and safe operation.

10.4 What do the bin codes (CAT, HUE, REF) mean on the label?

These codes specify the exact performance subgroup of the LEDs on that reel. CAT is the brightness (Luminous Intensity) bin. HUE is the color (Chromaticity) bin. REF is the forward voltage bin. Ordering by specific bin codes ensures consistency in brightness, color, and electrical behavior across your production run.

11. Practical Design and Usage Case

Scenario: Designing a status indicator panel for a consumer router. The panel has 5 LEDs showing power, internet, Wi-Fi, and two Ethernet port activities. Using the 16-216 LED in pure white provides a clean, modern look. The designer selects bin R1 for intensity (112-140 mcd) to ensure good visibility, and bin 29 for voltage (2.7-2.8V) for predictable current draw. A 5V rail is available on the PCB. Using the max V_F of 2.8V and a target I_F of 15 mA for long life and low heat, the resistor value is (5V - 2.8V) / 0.015A = 147 Ω (a standard 150 Ω resistor is chosen). The PCB layout uses the suggested pad dimensions with a small thermal relief connection to a ground plane for heat dissipation. The LEDs are placed after all high-temperature reflow processes for other components to minimize thermal exposure.

12. Operating Principle Introduction

Light Emitting Diodes (LEDs) are semiconductor devices that emit light through electroluminescence. When a forward voltage is applied across the p-n junction, electrons recombine with holes, releasing energy in the form of photons. The color of the light is determined by the energy bandgap of the semiconductor material. This particular "pure white" LED is almost certainly a phosphor-converted white LED. It uses a semiconductor chip that emits blue light (typically InGaN). This blue light partially excites a yellow-emitting phosphor coating on the chip. The combination of the remaining blue light and the emitted yellow light mixes to produce light perceived as white by the human eye. The specific ratios and phosphor composition determine the exact chromaticity coordinates ("color point") on the CIE diagram.

13. Technology Trends

The development of SMD LEDs like the 16-216 follows broader trends in electronics: miniaturization, increased efficiency, and enhanced manufacturability. Ongoing trends in the LED industry include:

• Increased Efficiency (lm/W): Continuous improvements in internal quantum efficiency and light extraction techniques lead to brighter LEDs at the same or lower drive currents.
• Improved Color Quality: Advancements in phosphor technology enable LEDs with higher Color Rendering Index (CRI) and more consistent color temperature bins, providing better light quality for displays and illumination.
• Higher Reliability and Lifetime: Improvements in packaging materials and thermal management structures are increasing the operational lifetime and stability of LEDs, especially under high-temperature and high-current conditions.
• Further Miniaturization: The drive for smaller devices continues, leading to even smaller package footprints and lower profile heights while maintaining or improving optical performance.
• Integrated Solutions: A trend towards LEDs with built-in current-limiting resistors, protection diodes, or even driver ICs within the package, simplifying circuit design for end-users.

These trends aim to provide designers with more capable, reliable, and easier-to-use components for an ever-widening range of applications.