SMD LED 0201 White/Yellow - Package 0.6x0.3x0.3mm - Voltage 2.6-3.2V - Power 96mW - English Datasheet

1. Product Overview

This document details the specifications for a miniature Surface-Mount Device (SMD) Light Emitting Diode (LED) in the 0201 package size. These LEDs are designed for automated printed circuit board (PCB) assembly processes and are ideal for space-constrained applications where component density is critical. The primary emitted color for this specific part number is a white with a yellow lens, offering a specific chromaticity point.

The core advantages of this component include its extremely small footprint, compatibility with high-volume pick-and-place equipment, and suitability for lead-free infrared (IR) reflow soldering processes. It is constructed to meet RoHS (Restriction of Hazardous Substances) compliance standards.

The target markets and applications are broad, encompassing telecommunications equipment, office automation devices, home appliances, industrial control systems, and various consumer electronics. Typical uses include status indicators, backlighting for front panels, and low-level signal or symbol illumination.

2. Technical Parameters Deep Dive

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.

• Power Dissipation (Pd): 96 mW. This is the maximum amount of power the LED package can dissipate as heat without exceeding its thermal limits.
• Peak Forward Current (I_F(peak)): 100 mA. This is the maximum allowable instantaneous forward current, typically specified under pulsed conditions (1/10 duty cycle, 0.1ms pulse width) to prevent overheating.
• DC Forward Current (I_F): 30 mA. This is the maximum continuous forward current recommended for reliable long-term operation.
• Operating Temperature Range (T_opr): -40°C to +85°C. The ambient temperature range over which the LED is designed to function correctly.
• Storage Temperature Range (T_stg): -40°C to +100°C. The temperature range for storing the device when not powered.

2.2 Electro-Optical Characteristics

These parameters are measured at a standard ambient temperature (T_a) of 25°C and a forward current (I_F) of 20 mA, unless otherwise noted.

• Luminous Intensity (I_V): 1500 - 2900 mcd (millicandela). This defines the amount of visible light emitted in the primary viewing direction. The wide range indicates a binning system is used (see Section 3). Measurement uses a sensor filtered to match the CIE standard photopic (human eye) response.
• Viewing Angle (2θ_1/2): 110 degrees (typical). This is the full angle at which the luminous intensity drops to half of its peak axial value. A 110° angle indicates a wide, diffuse emission pattern suitable for area illumination rather than a focused beam.
• Chromaticity Coordinates (x, y): (0.3100, 0.3100) typical. These coordinates on the CIE 1931 chromaticity diagram define the precise color point of the white light emitted. This point corresponds to a white with a specific correlated color temperature (CCT).
• Forward Voltage (V_F): 2.6 V (Min) - 3.2 V (Max) at 20mA. The voltage drop across the LED when conducting the specified current. This range is critical for driver circuit design.
• Reverse Current (I_R): 10 μA (Max) at V_R = 5V. The small leakage current when a reverse voltage is applied. Important: This device is not designed for reverse-bias operation; this parameter is for test purposes only.

3. Binning System Explanation

To ensure consistency in mass production, LEDs are sorted into performance bins. This allows designers to select parts that meet specific voltage, brightness, and color requirements.

3.1 Forward Voltage (V_F) Binning

LEDs are categorized based on their forward voltage drop at 20mA.

• Bin D8: V_F = 2.6V to 2.9V
• Bin D9: V_F = 2.9V to 3.2V
• Tolerance within each bin is ±0.10V.

3.2 Luminous Intensity (I_V) Binning

LEDs are sorted by their optical output power.

• Bin X1: I_V = 1500.0 mcd to 2100.0 mcd
• Bin X2: I_V = 2100.0 mcd to 2900.0 mcd
• Tolerance within each bin is ±11%.

3.3 Color (Chromaticity) Binning

This is the most critical binning for color consistency. LEDs are sorted into specific quadrilaterals on the CIE chromaticity diagram defined by four (x, y) coordinate points.

• Defined Bins: Y2, W1, X1, W2. Each bin code represents a specific region on the color chart.
• The typical chromaticity point (0.3100, 0.3100) falls within these defined regions.
• Tolerance on each hue bin (x, y coordinate) is ±0.01.

This multi-dimensional binning (V_F, I_V, Color) ensures that LEDs from the same production batch have tightly matched electrical and optical properties, which is essential for applications requiring uniform appearance, such as backlighting arrays or status indicator clusters.

4. Performance Curve Analysis

While specific graphical curves are referenced in the datasheet, their implications are standard.

• Forward Current vs. Forward Voltage (I-V Curve): This curve is exponential. The specified V_F at 20mA is the operating point. Small increases in voltage lead to large increases in current, necessitating current-limiting circuitry (e.g., a series resistor or constant-current driver) to prevent thermal runaway.
• Luminous Intensity vs. Forward Current: Light output is generally proportional to forward current within the operating range. However, efficiency may drop at very high currents due to increased heat.
• Luminous Intensity vs. Ambient Temperature: LED light output typically decreases as the junction temperature increases. Operating at the upper limit of the temperature range (85°C) will result in lower luminous intensity than at 25°C. This derating must be considered in thermal design.

5. Mechanical and Package Information

5.1 Package Dimensions

The device conforms to the EIA standard 0201 package outline. Key dimensions (in millimeters) are:

• Package Length: 0.6 mm (tolerance ±0.2 mm)
• Package Width: 0.3 mm (tolerance ±0.2 mm)
• Package Height: 0.3 mm (tolerance ±0.2 mm)

The lens color is yellow, which filters the emitted white light to achieve the final chromaticity. The cathode is typically identified by a marking or a specific pad geometry on the tape and reel.

5.2 Recommended PCB Land Pattern

A suggested solder pad layout is provided for infrared or vapor phase reflow soldering. This pattern is designed to ensure reliable solder joint formation, proper self-alignment during reflow, and sufficient mechanical strength. Following the recommended land pattern is crucial to prevent tombstoning (component standing on end) or poor solder joints, especially with such miniature components.

6. Soldering and Assembly Guide

6.1 IR Reflow Soldering Profile

The component is compatible with lead-free (Pb-free) IR reflow processes according to J-STD-020B. A generic profile is suggested:

• Pre-heat: 150-200°C for a maximum of 120 seconds to slowly ramp temperature and activate flux.
• Peak Temperature: Maximum of 260°C. The time above liquidus (typically ~217°C for Pb-free solder) should be controlled.
• Total Soldering Time: Maximum 10 seconds at peak temperature, with a maximum of two reflow cycles allowed.

Note: The optimal profile depends on the specific PCB assembly (board thickness, number of layers, other components, solder paste). The provided profile is a target; process characterization is required.

6.2 Hand Soldering (If Necessary)

If manual rework is required, extreme care is needed:

• Soldering Iron Temperature: Maximum 300°C.
• Contact Time: Maximum 3 seconds per joint.
• Limit: One soldering cycle only. The thermal mass is very low, making it susceptible to overheating.

6.3 Cleaning

If post-solder cleaning is required, only specified solvents should be used to avoid damaging the plastic package or lens.

• Recommended: Ethyl alcohol or isopropyl alcohol.
• Process: Immerse at normal temperature for less than one minute. Do not use ultrasonic cleaning unless verified to be safe for the package.
• Avoid: Unspecified or aggressive chemical cleaners.

7. Packaging and Handling

7.1 Tape and Reel Specifications

The components are supplied in industry-standard embossed carrier tape for automated handling.

• Reel Size: 7-inch (178 mm) diameter.
• Tape Width: 12 mm.
• Quantity per Reel: 4000 pieces (full reel).
• Minimum Order Quantity (MOQ): 500 pieces for partial reels.
• The packaging conforms to ANSI/EIA-481 specifications. The tape has a cover to protect components.

7.2 Moisture Sensitivity and Storage

The plastic package is moisture-sensitive (MSL).

• Sealed Bag (with desiccant): Store at ≤30°C and ≤70% RH. Shelf life is one year from the bag seal date.
• After Bag Opening: The \"floor life\" begins. Store at ≤30°C and ≤60% RH.
• Critical Time Limit: Components must be subjected to IR reflow soldering within 168 hours (7 days) of exposure to ambient factory conditions after bag opening.
• Extended Storage (Opened): Store in a sealed container with desiccant or in a nitrogen desiccator.
• Exceeded Floor Life: If components are exposed for more than 168 hrs, they must be baked at approximately 60°C for at least 48 hours before soldering to remove absorbed moisture and prevent \"popcorning\" (package cracking during reflow).

8. Application Guidelines and Design Considerations

8.1 Driver Circuit Design

Due to the exponential I-V characteristic, a simple series resistor is the most common driving method for indicator applications. The resistor value (R_series) is calculated as: R_series = (V_supply - V_F) / I_F. Use the maximum V_F from the datasheet (3.2V) to ensure the current does not exceed 20mA even with a low-V_F part. For applications requiring constant brightness or driving multiple LEDs in series, a constant-current driver is recommended.

8.2 Thermal Management

Although power dissipation is low (96mW max), the tiny package has limited ability to shed heat. Ensure adequate copper area on the PCB connected to the thermal pads (if any) or the solder joints to act as a heat sink. Avoid operating at the absolute maximum current (30mA DC) in high ambient temperatures without thermal analysis.

8.3 Optical Integration

The wide 110° viewing angle makes this LED suitable for illuminating small areas or light pipes. For optimal light coupling into a light guide, consider the LED's emission pattern and the acceptance angle of the guide. The yellow lens acts as a built-in diffuser/color filter.

9. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I drive this LED directly from a 5V or 3.3V logic output?
A: No. You must use a series current-limiting resistor. Connecting 5V directly would cause catastrophic overcurrent. For a 5V supply and a target of 20mA, using the max V_F of 3.2V, R = (5V - 3.2V) / 0.02A = 90Ω (use a standard 91Ω or 100Ω resistor).

Q: Why is the color binning so important?
A: Human eyes are very sensitive to slight differences in white point, especially when multiple LEDs are viewed side-by-side. Using LEDs from different color bins can result in a visibly patchy or uneven appearance in an array.

Q: What happens if I exceed the 168-hour floor life before soldering?
A: The absorbed moisture can turn to steam during the rapid heating of reflow, potentially causing internal delamination or cracking of the plastic package (\"popcorning\"), leading to immediate or latent failure. Baking is mandatory to drive out this moisture.

Q: Is this LED suitable for outdoor or automotive applications?
A: The operating temperature range (-40°C to +85°C) covers many environments. However, the datasheet specifies it is for \"ordinary electronic equipment.\" For applications with high reliability requirements, extreme environmental stress (UV, humidity, thermal cycling), or safety-critical functions (automotive, medical, aviation), consultation with the manufacturer and additional qualification testing are essential. This standard commercial-grade LED may not have the necessary reliability certifications for such uses.

10. Design and Use Case Example

Scenario: Status Indicator on a Portable Bluetooth Module
A designer is creating a compact Bluetooth audio module. Board space is extremely limited. They need a small, low-power LED to indicate \"power on\" and \"pairing\" status.

• Component Choice: This 0201 LED is selected for its minimal footprint (0.6x0.3mm).
• Circuit Design: The module runs on a 3.7V Li-ion battery. A GPIO pin on the microcontroller, capable of sourcing 20mA, will drive the LED. A series resistor is calculated: R = (3.7V - 2.9V_typ) / 0.02A = 40Ω. A 39Ω resistor is chosen, resulting in a current of ~20.5mA, which is within spec.
• PCB Layout: The recommended land pattern is used. Small thermal relief connections are used on the pads to aid soldering but maintain some thermal connection to a ground plane for heat dissipation.
• Assembly: The full PCB assembly uses lead-free solder paste and follows the JEDEC reflow profile. The LEDs are kept in their sealed bag until the production line is ready, ensuring the floor life is not exceeded.
• Result: A reliable, bright status indicator that consumes minimal board area and power, meeting all design requirements.

11. Technical Principle Introduction

An LED is a semiconductor diode. When a forward voltage is applied across its terminals (anode positive relative to cathode), electrons from the n-type semiconductor material recombine with holes from the p-type material within the active region. This recombination releases energy in the form of photons (light). The specific wavelength (color) of the light is determined by the energy bandgap of the semiconductor materials used.

A \"white\" LED, as in this component, is typically created using a blue or ultraviolet LED chip coated with a phosphor layer. The primary light from the chip excites the phosphor, which then re-emits light across a broader spectrum, combining to produce white light. The yellow lens further modifies this output to achieve the specified chromaticity coordinates on the white light spectrum.

12. Industry Trends and Context

The 0201 package represents the ongoing trend in electronics towards miniaturization and increased functional density on PCBs. As consumer devices like smartphones, wearables, and IoT sensors become smaller, the demand for ultra-small passive and active components grows.

Key trends influencing such components include:

• Advanced Packaging: Improving thermal performance and reliability in ever-smaller footprints.
• Higher Efficiency: Delivering more luminous output (lumens) per unit of electrical input power (watts), reducing energy consumption and heat generation.
• Tighter Binning: As display and lighting applications demand higher color uniformity, the tolerances on chromaticity and intensity bins continue to tighten.
• Automation Compatibility: Components must be designed for high-speed, high-precision pick-and-place machines, with reliable tape-and-reel packaging being a critical part of the supply chain.

This component sits within this ecosystem, enabling compact designs while providing the necessary performance parameters for a wide range of indicator and low-level lighting applications.