SMD LED Yellow AlInGaP Chip Datasheet - 2.0x1.25x1.1mm - 2.4V - 62.5mW - English Technical Document

1. Product Overview

This document details the specifications for a surface-mount device (SMD) LED lamp utilizing an ultra-bright Aluminum Indium Gallium Phosphide (AlInGaP) chip to produce yellow light. The device is housed in a compact, industry-standard package designed for automated printed circuit board (PCB) assembly processes, including infrared reflow soldering. Its miniature size makes it suitable for space-constrained applications across various electronic sectors.

1.1 Core Advantages and Features

The LED offers several key features that enhance its usability and reliability in modern electronics manufacturing:

• RoHS Compliance: The device is manufactured to meet Restriction of Hazardous Substances directives, ensuring environmental safety.
• High-Brightness AlInGaP Chip: This semiconductor material provides efficient yellow light emission with good luminous intensity.
• Automation-Friendly Packaging: Supplied on 8mm tape wound onto 7-inch diameter reels, compatible with high-speed pick-and-place equipment.
• Standardized Footprint: Conforms to EIA (Electronic Industries Alliance) package standards, ensuring design interoperability.
• Integrated Circuit Compatibility: Can be driven directly by standard logic-level outputs.
• Reflow Solderable: Withstands standard infrared (IR) reflow soldering profiles used in surface-mount technology (SMT) assembly lines.

1.2 Target Applications and Markets

This component is designed for a broad range of indicator and backlighting functions within electronic equipment. Primary application areas include:

• Telecommunications Equipment: Status indicators in cordless phones, cellular phones, and network hardware.
• Computing and Office Automation: Backlighting for keypads and keyboards in notebook computers, status lights on peripherals.
• Consumer and Home Appliances: Power, mode, or function indicators.
• Industrial Equipment: Panel indicators for machinery and control systems.
• Display and Signage: Micro-displays and symbolic luminaries where a compact yellow light source is required.

2. In-Depth Technical Parameter Analysis

This section provides a detailed breakdown of the device's absolute limits and operational characteristics. All parameters are specified at an ambient temperature (Ta) of 25°C unless otherwise stated.

2.1 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. Operation at or near these limits is not recommended for reliable performance.

• Power Dissipation (Pd): 62.5 mW. This is the maximum amount of power the package can dissipate as heat.
• Continuous Forward Current (IF): 25 mA DC. The maximum steady-state current for reliable operation.
• Peak Forward Current: 60 mA, permissible only under pulsed conditions (1/10 duty cycle, 0.1ms pulse width) to handle transient surges.
• Reverse Voltage (VR): 5 V. Exceeding this voltage in reverse bias can cause junction breakdown.
• Operating Temperature Range: -30°C to +85°C. The ambient temperature range for normal device operation.
• Storage Temperature Range: -40°C to +85°C. The safe temperature range for the device when not powered.
• Soldering Temperature: Withstands 260°C for 10 seconds during reflow soldering (Pb-free process).

2.2 Electro-Optical Characteristics

These are the typical performance parameters measured under specified test conditions (IF = 20mA, Ta = 25°C).

• Luminous Intensity (Iv): Ranges from 28.0 to 180.0 millicandelas (mcd). The actual value depends on the specific bin code (see Section 3). Measured using a sensor filtered to the CIE photopic eye-response curve.
• Viewing Angle (2θ1/2): 130 degrees. This is the full angle at which the luminous intensity drops to half of its value measured on-axis, indicating a wide viewing cone.
• Peak Emission Wavelength (λP): 588 nm. The wavelength at the highest point of the emitted light spectrum.
• Dominant Wavelength (λd): Ranges from 584.5 nm to 597.0 nm. This is the single wavelength perceived by the human eye to define the color (yellow), derived from the CIE chromaticity diagram. Specific value is binned.
• Spectral Line Half-Width (Δλ): 15 nm. The width of the emission spectrum at half its maximum intensity, indicating color purity.
• Forward Voltage (VF): Between 1.8V and 2.4V at 20mA. The voltage drop across the LED when conducting current.
• Reverse Current (IR): Maximum of 10 μA when a 5V reverse bias is applied.

2.3 Thermal Considerations

While not explicitly graphed in the provided data, thermal management is implicit in the ratings. The 62.5mW power dissipation limit and the 85°C maximum operating temperature are critical. Exceeding the Pd rating will raise the junction temperature, which can lead to accelerated lumen depreciation, a shift in forward voltage, and ultimately, device failure. Designers must ensure adequate PCB layout and, if necessary, thermal relief to maintain the junction temperature within safe limits during operation.

3. Binning System Explanation

To ensure consistency in mass production, LEDs are sorted into bins based on key parameters. This allows designers to select parts that meet specific requirements for color, brightness, and electrical characteristics.

3.1 Forward Voltage (Vf) Binning

LEDs are categorized by their forward voltage drop at a test current of 20mA. This is crucial for designing current-limiting circuits and ensuring uniform brightness in multi-LED arrays powered by a constant voltage source.

• Bin Code F2: VF = 1.80V to 2.10V (±0.1V tolerance per bin).
• Bin Code F3: VF = 2.10V to 2.40V (±0.1V tolerance per bin).

3.2 Luminous Intensity (Iv) Binning

This binning sorts LEDs based on their light output intensity, measured in millicandelas (mcd) at 20mA.

• Bin Code N: 28.0 - 45.0 mcd
• Bin Code P: 45.0 - 71.0 mcd
• Bin Code Q: 71.0 - 112.0 mcd
• Bin Code R: 112.0 - 180.0 mcd

A tolerance of ±15% applies to each intensity bin.

3.3 Hue (Dominant Wavelength) Binning

This classification ensures color consistency by sorting LEDs according to their dominant wavelength, which defines the perceived shade of yellow.

• Bin Code H: 584.5 - 587.0 nm
• Bin Code J: 587.0 - 589.5 nm
• Bin Code K: 589.5 - 592.0 nm
• Bin Code L: 592.0 - 594.5 nm
• Bin Code M: 594.5 - 597.0 nm

A tight tolerance of ±1nm is maintained for each wavelength bin.

4. Performance Curve Analysis

While specific graphical data is referenced in the document, typical curves for such a device provide essential insights into its behavior under varying conditions.

4.1 Current vs. Voltage (I-V) Characteristic

The I-V curve for an AlInGaP LED is non-linear, similar to a standard diode. Below the forward voltage (VF), very little current flows. Once VF is reached, the current increases rapidly with a small increase in voltage. This underscores the importance of driving LEDs with a constant current source rather than a constant voltage to prevent thermal runaway and ensure stable light output. The typical VF range of 1.8V to 2.4V at 20mA is a key design parameter for the driver circuit.

4.2 Luminous Intensity vs. Forward Current

The light output (luminous intensity) is approximately proportional to the forward current over a significant range. However, efficiency (lumens per watt) may peak at a certain current and then decrease at higher currents due to increased thermal effects and droop. Operating at or below the recommended 20mA test current ensures optimal efficiency and longevity.

4.3 Temperature Dependence

LED performance is temperature-sensitive. As the junction temperature increases:

• Forward Voltage (VF): Decreases. This can affect current regulation in simple resistor-limited circuits.
• Luminous Intensity (Iv): Decreases. Light output drops as temperature rises.
• Dominant Wavelength (λd): May shift slightly, potentially causing a subtle color change.

These effects highlight the need for good thermal design, especially in high-power or high-ambient-temperature applications.

4.4 Spectral Distribution

The emission spectrum is characterized by a peak at 588 nm (yellow) with a relatively narrow half-width of 15 nm. This indicates good color saturation. The dominant wavelength (λd), which defines the perceived color, is carefully binned to ensure visual consistency between different production lots.

5. Mechanical and Package Information

5.1 Device Dimensions and Polarity

The LED package has nominal dimensions. The cathode is typically marked by a green tint on the corresponding side of the device or a notch in the package. Correct polarity must be observed during assembly to ensure proper function. The lens is water clear, allowing the native yellow light from the AlInGaP chip to be emitted without color filtering.

5.2 Recommended PCB Attachment Pad Layout

A recommended land pattern (footprint) for the PCB is provided to ensure reliable soldering. This pattern includes appropriate pad sizes and spacing to achieve a good solder fillet, ensure mechanical stability, and facilitate proper reflow soldering. Adhering to this recommended layout helps prevent tombstoning (component standing up on one end) and other soldering defects.

6. Soldering and Assembly Guidelines

6.1 Infrared Reflow Soldering Parameters

The device is compatible with lead-free (Pb-free) infrared reflow soldering processes. A suggested profile is critical for successful assembly without damaging the LED.

• Pre-heat Zone: 150°C to 200°C.
• Pre-heat Time: Maximum 120 seconds to gradually raise temperature and activate flux.
• Peak Temperature: Maximum 260°C. The device can withstand this temperature for a limited time.
• Time Above Liquidus (at peak): Maximum 10 seconds. The device should not be subjected to peak temperature for more than this duration, and reflow should not be performed more than twice.

These parameters align with JEDEC standards. The actual profile must be characterized for the specific PCB assembly, considering board thickness, component density, and solder paste specifications.

6.2 Hand Soldering (If Necessary)

If manual repair is required, extreme caution is needed:

• Soldering Iron Temperature: Maximum 300°C.
• Soldering Time: Maximum 3 seconds per solder joint.
• Frequency: Hand soldering should be performed only once to minimize thermal stress.

6.3 Cleaning

If post-solder cleaning is required, only specified solvents should be used to avoid damaging the plastic package. Recommended agents include ethyl alcohol or isopropyl alcohol. The LED should be immersed at normal temperature for less than one minute. Unspecified chemical liquids must not be used.

6.4 Storage and Handling Conditions

Electrostatic Discharge (ESD) Sensitivity: Although not explicitly rated as highly sensitive, caution is advised. Handling with a grounded wrist strap or anti-static gloves is recommended. All equipment and workstations must be properly grounded to prevent damage from static electricity or surges.

Moisture Sensitivity: The device has a Moisture Sensitivity Level (MSL) rating. For packages that have been opened and exposed to ambient humidity:

• Reflow should be completed within one week (indicative of MSL 3).
• For storage beyond one week, devices should be kept in a sealed container with desiccant or in a nitrogen environment.
• If stored out of the original packaging for more than a week, a bake-out at approximately 60°C for at least 20 hours is required before soldering to remove absorbed moisture and prevent \"popcorning\" during reflow.
• Unopened, moisture-proof bags with desiccant have a shelf life of one year when stored at ≤30°C and ≤90% relative humidity.

7. Packaging and Ordering Information

7.1 Tape and Reel Specifications

The LEDs are supplied in a packaging format optimized for automated assembly:

• Tape Width: 8 mm.
• Reel Diameter: 7 inches (178 mm).
• Quantity per Reel: 3000 pieces.
• Minimum Order Quantity: 500 pieces for remainder quantities.
• Pocket Sealing: Empty component pockets are sealed with cover tape.
• Missing Components: A maximum of two consecutive missing LEDs is allowed per specification.
• Standard: Packaging complies with ANSI/EIA-481 specifications.

8. Application Design Recommendations

8.1 Circuit Design Considerations

Current Limiting: An LED is a current-driven device. A series current-limiting resistor or a dedicated constant-current driver circuit is mandatory when connecting to a voltage source. The resistor value can be calculated using Ohm's Law: R = (Vsource - VF) / IF, where VF is the forward voltage (use max value from bin for safety) and IF is the desired forward current (e.g., 20mA).

Parallel Connections: Connecting multiple LEDs in parallel directly to a single current source is generally not recommended due to variations in forward voltage (Vf binning). Slight differences in Vf can cause one LED to draw significantly more current than others, leading to uneven brightness and potential overstress. A series connection or individual current control for each LED is preferred.

Reverse Voltage Protection: Although the LED can tolerate up to 5V in reverse, it is good practice to avoid exposing it to reverse bias. In AC or bipolar circuits, a protection diode in parallel (reverse-biased relative to the LED) may be necessary.

8.2 Thermal Management in Application

For applications operating at high ambient temperatures or at currents near the maximum rating, consider the following:

• Use a PCB with thermal vias under the LED's thermal pad (if applicable) to conduct heat to other layers or a heatsink.
• Provide adequate copper area on the PCB connected to the LED's solder pads to act as a heatsink.
• Derate the maximum operating current as ambient temperature increases above 25°C to keep the junction temperature within limits.

8.3 Optical Integration

The wide 130-degree viewing angle makes this LED suitable for applications requiring broad visibility. For focused or directed light, external lenses or light guides may be employed. The water-clear lens ensures minimal absorption of the emitted yellow light.

9. Reliability and Application Scope Disclaimer

The device is intended for use in standard commercial and industrial electronic equipment, including office, communication, and home appliances. For applications requiring exceptional reliability where failure could jeopardize safety, health, or life—such as in aviation, transportation, medical, or critical safety systems—specific consultation and qualification with the component manufacturer are essential prior to design-in. The standard product specifications may not be sufficient for such high-reliability applications.