SMD LED 0201 Yellow AlInGaP Datasheet - Dimensions 1.6x0.8x0.6mm - Voltage 1.8-2.4V - Power 72mW - English Technical Document

1. Product Overview

This document details the specifications for a miniature Surface-Mount Device (SMD) Light Emitting Diode (LED). The component is designed in an ultra-compact 0201 footprint, making it ideal for space-constrained applications on printed circuit boards (PCBs). Its primary function is to serve as a visual indicator, backlight, or signal luminary in a wide array of modern electronic equipment.

1.1 Core Advantages and Target Market

The LED offers several key advantages for automated manufacturing and high-density designs. It is fully compatible with automatic pick-and-place equipment and standard infrared (IR) reflow soldering processes, facilitating high-volume production. The package is supplied on industry-standard 12mm tape mounted on 7-inch reels. Its primary target markets include telecommunications equipment (e.g., cordless and cellular phones), portable computing devices (notebook computers), network systems, home appliances, and various indoor signage applications where a reliable, small-form-factor indicator is required.

2. Technical Parameters: In-Depth Objective Interpretation

This section provides a detailed analysis of the LED's electrical, optical, and environmental specifications.

2.1 Absolute Maximum Ratings

The device must not be operated beyond these limits to prevent permanent damage. Key ratings include a maximum power dissipation of 72mW, a DC forward current of 30mA, and a peak forward current of 80mA (under pulsed conditions with a 1/10 duty cycle and 0.1ms pulse width). The operational temperature range is specified from -40°C to +85°C, with a storage temperature range of -40°C to +100°C, ensuring reliability across harsh environments.

2.2 Electrical and Optical Characteristics

Measured at a standard test condition of 25°C ambient temperature and a forward current (I_F) of 20mA, the device exhibits the following typical performance. The luminous intensity (I_V) ranges from a minimum of 140.0 mcd to a maximum of 450.0 mcd, with the exact value determined by the bin rank. It features a wide viewing angle (2θ_1/2) of 110 degrees, providing broad visibility. The emitted light is in the yellow spectrum, with a peak emission wavelength (λ_p) of 591 nm and a dominant wavelength (λ_d) range defined by its wavelength bin. The forward voltage (V_F) typically falls between 1.8V and 2.4V at the test current.

3. Binning System Explanation

To ensure consistency in production and design, LEDs are sorted into bins based on key parameters. This allows designers to select components that meet specific circuit and brightness requirements.

3.1 Forward Voltage (V_F) Rank

LEDs are categorized into three voltage bins: D2 (1.8V - 2.0V), D3 (2.0V - 2.2V), and D4 (2.2V - 2.4V). Each bin has a tolerance of ±0.10V. Selecting the appropriate bin helps in designing stable current-limiting circuits.

3.2 Luminous Intensity (I_V) Rank

The brightness is classified into five intensity bins: R2 (140.0-180.0 mcd), S1 (180.0-224.0 mcd), S2 (224.0-280.0 mcd), T1 (280.0-355.0 mcd), and T2 (355.0-450.0 mcd). Tolerance on each intensity bin is ±11%. This binning is crucial for applications requiring uniform brightness across multiple indicators.

3.3 Dominant Wavelength (WD) Rank

The color (hue) of the yellow light is controlled through wavelength binning. The four bins are H (584.5-587.0 nm), J (587.0-589.5 nm), K (589.5-592.0 nm), and L (592.0-594.5 nm), each with a tolerance of ±1 nm. This ensures color consistency within a defined range.

4. Performance Curve Analysis

While specific graphical curves are referenced in the datasheet, they typically illustrate the relationship between forward current and forward voltage (I-V curve), the variation of luminous intensity with forward current, and the effect of ambient temperature on light output. These curves are essential for understanding the device's behavior under non-standard operating conditions and for optimizing drive circuitry for efficiency and longevity.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED is housed in an industry-standard 0201 package. The key dimensions are approximately 1.6mm in length, 0.8mm in width, and 0.6mm in height. All dimensional tolerances are typically ±0.1mm unless otherwise specified. The lens is water clear, and the emitted color from the AlInGaP chip is yellow.

5.2 Recommended PCB Attachment Pad

A land pattern design is provided to ensure proper soldering and mechanical stability. The recommended pad layout accounts for the component's size and is optimized for infrared or vapor phase reflow soldering processes, preventing tombstoning and ensuring a reliable solder fillet.

6. Soldering and Assembly Guidelines

6.1 IR Reflow Soldering Condition

For lead-free (Pb-free) soldering processes, a specific IR reflow profile compliant with J-STD-020B is recommended. Key parameters include a pre-heat temperature between 150-200°C, a pre-heat time up to 120 seconds maximum, a peak body temperature not exceeding 260°C, and a time above liquidus (TAL) as defined by the solder paste. The total soldering time at peak temperature should be limited to 10 seconds maximum, and reflow should not be performed more than twice.

6.2 Storage Conditions

To prevent moisture absorption (which can cause \"popcorning\" during reflow), strict storage guidelines are provided. Unopened, moisture-barrier bags should be stored at ≤30°C and ≤70% RH, with a shelf life of one year. Once opened, components should be stored at ≤30°C and ≤60% RH. It is strongly recommended to complete IR reflow within 168 hours (7 days) of opening the bag. Components exposed beyond this period require a baking procedure (e.g., 60°C for 48 hours) before soldering.

6.3 Cleaning

If cleaning after soldering is necessary, only specified alcohol-based solvents like ethyl alcohol or isopropyl alcohol should be used. The LED should be immersed at normal temperature for less than one minute. Unspecified chemical cleaners may damage the package epoxy.

7. Packaging and Ordering Information

7.1 Tape and Reel Specifications

The components are supplied on embossed carrier tape with a width of 12mm, wound onto 7-inch (178mm) diameter reels. Each reel contains 4000 pieces. The tape uses a top cover to seal empty pockets. Packaging follows ANSI/EIA-481 standards. A minimum order quantity of 500 pieces may apply for remainder quantities.

8. Application Suggestions

8.1 Typical Application Scenarios

This LED is suitable for status indication in consumer electronics (power on/off, battery charging), backlighting for front panel buttons or symbols, and as signal luminaries in networking equipment and home appliances. Its small size makes it perfect for modern, miniaturized devices.

8.2 Design Considerations

Designers must implement a proper current-limiting resistor in series with the LED. The resistor value should be calculated based on the supply voltage, the forward voltage (V_F) from the selected bin, and the desired operating current (not to exceed 30mA DC). For uniform brightness in multi-LED arrays, selecting LEDs from the same luminous intensity (I_V) bin is critical. Attention must also be paid to the PCB layout's thermal management to avoid exceeding the junction temperature limits.

9. Frequently Asked Questions (Based on Technical Parameters)

Q: What is the difference between peak wavelength and dominant wavelength?

A: Peak wavelength (λ_p) is the single wavelength at which the emission spectrum is strongest. Dominant wavelength (λ_d) is derived from the CIE chromaticity diagram and represents the perceived color of the light; it is the single wavelength that would match the LED's color. For monochromatic LEDs like this yellow one, they are typically very close.

Q: Can I drive this LED with a voltage source directly?

A: No. LEDs are current-driven devices. Their forward voltage has a tolerance and varies with temperature. Connecting directly to a voltage source will cause uncontrolled current flow, likely exceeding the maximum rating and destroying the device. Always use a series current-limiting resistor or a constant-current driver.

Q: Why is the storage humidity condition so important?

A>SMD packages can absorb moisture from the air. During the high-temperature reflow soldering process, this trapped moisture can vaporize rapidly, creating internal pressure that may crack the package epoxy (\"popcorning\" or \"delamination\"). Adhering to the storage and baking guidelines prevents this failure mode.

10. Operating Principle Introduction

This LED is based on an Aluminum Indium Gallium Phosphide (AlInGaP) semiconductor material. When a forward bias voltage is applied across the LED's anode and cathode, electrons and holes are injected into the active region of the semiconductor. These charge carriers recombine, releasing energy in the form of photons (light). The specific composition of the AlInGaP alloy determines the bandgap energy, which directly corresponds to the wavelength (color) of the emitted light—in this case, in the yellow spectrum (~590 nm). The water-clear epoxy lens encapsulates the semiconductor chip, provides mechanical protection, and shapes the light output beam.