SMD Mid-Power LED 67-22ST Datasheet - PLCC-2 Package - 3.0V Max - 150mA - White LED - English Technical Document

1. Product Overview

The 67-22ST is a surface-mount device (SMD) mid-power LED housed in a PLCC-2 (Plastic Leaded Chip Carrier) package. It is designed as a white LED, offering a combination of high efficacy, high color rendering index (CRI), low power consumption, and a wide viewing angle. Its compact form factor makes it suitable for a broad range of lighting applications where reliable performance and good light quality are required.

1.1 Core Advantages

• High Luminous Intensity Output: Delivers bright, efficient illumination.
• Wide Viewing Angle (120° typical): Provides uniform light distribution over a broad area.
• High CRI Options: Available with a minimum CRI of 80 (Ra), ensuring good color rendition.
• Compact PLCC-2 Package: Facilitates easy integration into various PCB designs.
• Compliance: The product is Pb-free, compliant with RoHS, EU REACH, and halogen-free standards (Br<900ppm, Cl<900ppm, Br+Cl<1500ppm).
• ANSI Binning: Ensures consistent color and flux output according to standardized bins.

1.2 Target Market & Applications

This LED is an ideal solution for numerous lighting applications, including:

• General Lighting
• Decorative and Entertainment Lighting
• Indicator Lights
• General Illumination
• Switch Lights

2. Technical Parameter Deep-Dive

2.1 Absolute Maximum Ratings (T_soldering = 25°C)

These ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.

Note: These LEDs are sensitive to electrostatic discharge (ESD). Proper ESD handling precautions must be observed during assembly and handling.

2.2 Electro-Optical Characteristics (T_soldering = 25°C, I_F=150mA)

These are the typical performance parameters under specified test conditions.

Tolerances: Luminous flux: ±11%; Forward Voltage: ±0.1V; Color Rendering Index: ±2.

2.3 Thermal Characteristics

The thermal resistance from the junction to the soldering point (R_{th J-S}) is 19°C/W. This parameter is critical for thermal management design. Exceeding the maximum junction temperature (T_j = 115°C) will degrade performance and shorten lifespan. Proper PCB layout with adequate thermal relief and, if necessary, additional heatsinking is essential for high-current or high-ambient-temperature operation.

3. Binning System Explanation

The product uses a comprehensive binning system to ensure color and performance consistency.

3.1 Product Number Explanation

The part number 67-22ST/KK9C–HXXXX30Z15/2T encodes key specifications:

• H: Indicates a CRI (Min.) of 80.
• XX XX: Represents Correlated Color Temperature (CCT) and minimum Luminous Flux (in lm).
• 30: Maximum Forward Voltage index (3.0V max).
• Z15: Forward Current index (I_F = 150mA).

3.2 Color Rendering Index (CRI) Binning

Tolerance: ±2.

3.3 Mass Production List & Binning

The available standard products are listed below, showing the correlation between CCT, minimum luminous flux, and forward voltage.

3.4 Luminous Flux Binning

Luminous flux is further subdivided into bins for each CCT to ensure tighter control. For example:

• 2700K: Bins 80L5 (80-85 lm) and 85L5 (85-90 lm).
• 3000K/3500K: Bins 85L5 (85-90 lm) and 90L5 (90-95 lm).
• 4000K/5000K/5700K: Bins 90L5 (90-95 lm) and 95L5 (95-100 lm).
• 6500K: Bins 88L5 (88-93 lm) and 93L5 (93-98 lm).

Tolerance: ±11%.

3.5 Forward Voltage Binning

Forward voltage is grouped under code \"2730\" with sub-bins:

• 27A: 2.7V - 2.8V
• 28A: 2.8V - 2.9V
• 29A: 2.9V - 3.0V

Tolerance: ±0.1V.

3.6 Chromaticity Coordinate Binning

The datasheet provides detailed chromaticity coordinate (CIE x, y) boxes for each CCT (2700K, 3000K, 3500K) on the CIE 1931 diagram. These boxes (e.g., 27K-A, 27K-B, 30K-F) define the allowable color variation within each CCT bin, ensuring the emitted white light falls within a specified, consistent region on the color space. This is crucial for applications requiring uniform color appearance across multiple LEDs.

4. Performance Curve Analysis & Design Considerations

4.1 Current-Voltage (I-V) Relationship

While a specific I-V curve is not provided in the excerpt, the key parameters are the maximum forward voltage (3.0V at 150mA) and the voltage bins. Designers must ensure the driving circuit can provide sufficient voltage to overcome the V_F of the LED, which will vary slightly within its bin. A constant current driver is highly recommended over a constant voltage source to ensure stable light output and prevent thermal runaway.

4.2 Thermal Derating

The luminous flux and forward voltage characteristics are specified at a soldering point temperature of 25°C. In real-world applications, the LED junction temperature will be higher. As temperature increases, luminous efficacy typically decreases, and the forward voltage may slightly drop. The 19°C/W thermal resistance figure must be used to model the junction temperature rise (ΔT_j = R_{th J-S} * P_d) based on the actual power dissipation (P_d ≈ V_F * I_F). Operating at or near the absolute maximum current (180mA) requires excellent thermal management to keep T_j within safe limits.

4.3 Spectral Distribution

The LED uses an InGaN chip with a water-clear resin for cool white, neutral white, and warm white color temperatures. The specific spectral power distribution (SPD) curve is not shown, but the high CRI (≥80) indicates a fuller spectrum with better representation of reds and other colors compared to low-CRI LEDs, which is important for retail lighting, museums, and applications where color accuracy matters.

5. Application Suggestions & Design Notes

5.1 Typical Application Circuits

For optimal performance, drive the LED with a constant current source. A simple series resistor can be used with a stable voltage supply, but this is less efficient and provides no compensation for V_F variation with temperature. For multiple LEDs, connect them in series with a constant current driver to ensure identical current through each unit. Parallel connection is not recommended due to potential current imbalance caused by minor V_F differences.

5.2 PCB Design Considerations

• Thermal Pad: The PLCC-2 package likely has thermal pads underneath. Connect these to a sufficiently large copper pour on the PCB to act as a heatsink. Use multiple thermal vias to transfer heat to inner or bottom layers if needed.
• Trace Width: Ensure power traces are wide enough to handle the operating current (150mA typical) without excessive heating or voltage drop.
• Spacing: Maintain adequate electrical clearance and creepage distances according to safety standards for the intended application voltage.

5.3 Optical Design

The 120° viewing angle is suitable for applications requiring broad, diffuse illumination. For more focused beams, secondary optics (lenses or reflectors) will be necessary. The water-clear resin minimizes light absorption within the package.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

The recommended reflow soldering profile has a peak temperature of 260°C, which should not be exceeded for more than 10 seconds. It is critical to follow the ramp-up and cool-down rates specified in the full assembly guidelines (not in the excerpt) to prevent thermal shock to the component, which can cause cracking or delamination.

6.2 Hand Soldering

If hand soldering is unavoidable, limit the iron tip temperature to 350°C and the contact time to a maximum of 3 seconds per lead. Use a low-thermal-mass tip and avoid applying excessive mechanical pressure.

6.3 Cleaning and Storage

If cleaning is required after soldering, use compatible solvents that do not damage the LED resin. Store components in their original moisture-barrier bags at temperatures between -40°C and 100°C, in a low-humidity environment, and follow standard ESD precautions.

7. Frequently Asked Questions (Based on Technical Parameters)

7.1 What is the actual power consumption?

At the typical operating point of 150mA and a maximum V_F of 3.0V, the maximum power dissipation is 450mW (0.45W). The actual power will depend on the specific V_F bin of the LED used.

7.2 Can I drive this LED at 180mA continuously?

While the absolute maximum rating is 180mA, continuous operation at this level will generate more heat (P_d ≈ V_F*180mA). This requires exceptional thermal management to keep the junction temperature below 115°C. For reliability and longevity, operating at or below the recommended 150mA is advised.

7.3 How do I select the right CCT and CRI?

Choose CCT based on the desired \"warmth\" of the light: 2700K-3000K for warm white (similar to incandescent), 3500K-4500K for neutral white, and 5000K-6500K for cool white (similar to daylight). A CRI of 80 (Ra) is good for general lighting. For applications where color discrimination is critical (e.g., art galleries, makeup mirrors), seek versions with CRI 90 or higher if available in this series.

7.4 What causes the luminous flux tolerance of ±11%?

This tolerance accounts for normal manufacturing variations in the LED chip, phosphor application, and packaging. The binning system (e.g., 80L5, 85L5) provides a tighter range within this overall tolerance for production consistency.