1. Product Overview
The XI3030E is a surface-mount device (SMD) mid-power LED housed in a PLCC-2 package. It is designed as a white LED offering a combination of high luminous efficacy, high color rendering index (CRI), low power consumption, and a wide viewing angle. Its compact form factor makes it a versatile component suitable for a broad range of lighting applications where reliable and efficient light output is required.
1.1 Core Advantages
The key features that define this LED's performance profile include: High luminous intensity output, which ensures bright illumination; a wide viewing angle of 120 degrees, providing uniform light distribution; compliance with RoHS (Restriction of Hazardous Substances) directives, making it environmentally friendly; utilization of ANSI standard binning for consistent color and flux characteristics; and a lead-free (Pb-free) construction.
1.2 Target Market and Applications
This LED is engineered as an ideal solution for various lighting segments. Primary application areas include general lighting for residential and commercial spaces, decorative and entertainment lighting to create ambient effects, indicator lights on electronic devices, illumination for signage and displays, and switch lights.
2. In-Depth Technical Parameter Analysis
This section provides a detailed, objective interpretation of the LED's key performance parameters as defined in the datasheet under standard test conditions (soldering point temperature at 25°C).
2.1 Electro-Optical Characteristics
The primary performance metrics are measured at a forward current (IF) of 150mA. The luminous flux (Φ) has a typical range from 135 lm to 195 lm, depending on the specific product variant and bin code, with a stated tolerance of ±11%. The forward voltage (VF) ranges from a minimum of 5.4V to a maximum of 6.8V, with a tolerance of ±0.1V. The color rendering index (Ra) has a minimum value of 70 (for the standard series listed) with a tolerance of ±2. It is important to note the R9 value (saturated red) is specified with a typical value of -40, which is a critical parameter for applications requiring high-quality color rendering, especially for red tones. The viewing angle (2θ1/2) is typically 120 degrees.
2.2 Absolute Maximum Ratings
These ratings define the limits beyond which permanent damage to the device may occur. The maximum continuous forward current is 180 mA. A peak forward current of 300 mA is permissible under pulsed conditions (duty cycle 1/10, pulse width 10ms). The maximum power dissipation is 1224 mW. The device can operate within an ambient temperature range of -40°C to +85°C and can be stored between -40°C and +100°C. The maximum junction temperature is 125°C. The thermal resistance from the junction to the soldering point is 17 °C/W, which is a key parameter for thermal management design.
2.3 Soldering Conditions
The LED is sensitive to heat during assembly. For reflow soldering, a maximum temperature of 260°C for 10 seconds is specified. For hand soldering, the iron tip temperature should not exceed 350°C, and contact time should be limited to 3 seconds. The device is also sensitive to electrostatic discharge (ESD), necessitating proper ESD precautions during handling.
3. Binning System Explanation
The product uses a comprehensive binning system to ensure consistency in key performance parameters. The product number itself encodes several of these bins.
3.1 Product Number Decoding
The model number XI3030E/LKE-HXXXX68Z15/2T contains specific codes: \"HXX\" represents the CRI code and color temperature, \"XX\" indicates the minimum luminous flux bin, \"68\" denotes the maximum forward voltage (6.8V), and \"Z15\" specifies the forward current (150mA).
3.2 Color Rendering Index (CRI) Binning
The datasheet provides a table mapping single-letter symbols to minimum CRI values, for example: L = 70, Q = 75, K = 80, P = 85, H = 90. The standard mass production list focuses on variants with a minimum CRI of 70 (code L).
3.3 Correlated Color Temperature (CCT) and Luminous Flux Binning
The LED is available in multiple CCTs ranging from 2200K (warm white) to 6500K (cool white). For each CCT, there are specific luminous flux bins. For instance, the \"Series For 4000K 165lm\" includes products with CCTs from 2200K to 6500K, each with a defined minimum flux (e.g., 135 lm for 2200K, 165 lm for 4000K). A higher-output \"175lm\" series is also available for select CCTs (2700K to 6500K). Detailed bin range tables further subdivide the flux output into smaller codes (e.g., 165L5, 170L5) specifying minimum and maximum flux values for precise selection.
3.4 Forward Voltage Binning
The forward voltage is binned in 0.2V steps from 5.4V to 6.8V. The bin codes are 54B (5.4-5.6V), 56B (5.6-5.8V), ..., up to 66B (6.6-6.8V). This allows designers to select LEDs with consistent voltage drops for current regulation circuit design.
3.5 Chromaticity Coordinate Binning
The datasheet includes a section on the CIE 1931 chromaticity diagram and provides detailed bin ranges for chromaticity coordinates (x, y) for specific CCTs, such as 2200K. These bins (e.g., 22K-A, 22K-B) define small quadrilaterals on the color space chart to ensure tight color consistency within a batch. The reference range for the 2200K bins, for example, is between 2070K and 2320K.
4. Performance Curve Analysis
While the provided datasheet excerpt does not contain graphical performance curves (such as IV curves, relative flux vs. temperature, or spectral power distribution), these are typically critical for design. Based on the parameters given, one can infer expected behaviors. The forward voltage will increase slightly with junction temperature. The luminous flux will decrease as the junction temperature rises, a characteristic common to all LEDs. The wide 120-degree viewing angle suggests a Lambertian or near-Lambertian radiation pattern. For precise design, consulting the full datasheet from the manufacturer for these graphs is essential.
5. Mechanical and Package Information
The LED uses a standard PLCC-2 (Plastic Leaded Chip Carrier) surface-mount package. The designation \"XI3030E\" suggests a package footprint approximately 3.0mm x 3.0mm. The device features a top-view white LED. The resin material is water-clear. The chip material is InGaN (Indium Gallium Nitride), which is standard for producing white light via a blue chip combined with a phosphor layer.
6. Soldering and Assembly Guidelines
As noted in the Absolute Maximum Ratings, strict thermal profiles must be followed. For reflow soldering, a peak temperature of 260°C should not be exceeded for more than 10 seconds. A recommended reflow profile with preheat, soak, reflow, and cooling stages should be used to minimize thermal stress. Hand soldering should be avoided if possible but, if necessary, must be done quickly and with temperature control. The components are ESD-sensitive and should be handled with appropriate grounding measures. Storage should be in a dry, controlled environment within the specified temperature range.
7. Packaging and Ordering Information
The mass production list serves as the primary ordering guide. Specific product codes like XI3030E/LKE-H4016568Z15/2T can be selected based on the required CCT (4000K), minimum flux (165 lm), CRI (70 min), and forward voltage (6.8V max). The packaging format (tape and reel, quantity per reel) is not specified in the excerpt but is standard for SMD components.
8. Application Recommendations
8.1 Typical Application Scenarios
This LED is well-suited for: LED bulbs and tubes for general lighting, where high efficacy and good CRI are important; architectural accent lighting and stage lighting, benefiting from the wide viewing angle; backlighting for switches and control panels; and illumination for retail displays or signage.
8.2 Design Considerations
Thermal Management: With a thermal resistance (Rth J-S) of 17°C/W, effective heat sinking is crucial. The maximum junction temperature of 125°C must not be exceeded. Design the PCB layout and any external heatsinking to keep the soldering point temperature as low as possible during operation.
Current Drive: A constant current driver is recommended for stable light output and long life. The nominal current is 150mA, with an absolute maximum of 180mA. Operating at or below the nominal current is advised for reliability.
Optical Design: The 120-degree viewing angle is intrinsic to the package. For narrower beam angles, secondary optics (lenses) would be required.
Color Consistency: Utilize the binning information to select LEDs from the same flux, voltage, and chromaticity bins for applications requiring uniform appearance.
9. Technical Comparison and Differentiation
Compared to traditional low-power LEDs, this mid-power LED offers significantly higher luminous flux in a compact package, improving lumen density. The high CRI (with variants up to 90) differentiates it from standard mid-power LEDs that often have CRI in the 70-80 range, making it suitable for applications where color quality is critical. The specified R9 value, though negative in the standard series, is a transparent parameter that allows designers to assess suitability for full-spectrum lighting. The wide 120-degree viewing angle is a key advantage over LEDs with narrower beams for area lighting applications.
10. Frequently Asked Questions (Based on Technical Parameters)
Q: What is the actual power consumption of this LED?
A: Power (P) is calculated as Forward Voltage (VF) × Forward Current (IF). With a typical VF around 6V and IF at 150mA, the typical power is approximately 0.9W (6V * 0.15A). The maximum power dissipation rating is 1.224W.
Q: Can I drive this LED with a 12V supply?
A: No, not directly. The LED itself has a forward voltage of ~6V. Connecting it directly to 12V would cause excessive current and immediate failure. You must use a constant current driver or a circuit (like a resistor in series with a voltage source) designed to limit the current to 150mA, accounting for the voltage difference.
Q: What does a negative R9 value mean?
A: R9 measures how well a light source renders a deep red color. A negative value indicates that the light source actually makes that specific red test color appear less saturated or duller compared to a reference illuminant. This is common in some white LED phosphor systems. For applications where vibrant reds are crucial (e.g., meat display, retail), selecting an LED with a high positive R9 value is important.
Q: How do I choose between the 165lm and 175lm series?
A> The choice depends on the required light output and efficacy for your application. The 175lm series provides higher lumen output for the same current (150mA), meaning higher efficacy (lumens per watt). This often comes with a slightly higher cost. Select based on your lumen requirements and cost targets.
11. Practical Design and Usage Case
Case: Designing a retrofit LED module for a downlight.
1. Requirements: The downlight requires 800 lumens, warm white (3000K) light with good color rendering (CRI >80) to replace a 60W halogen bulb.
2. LED Selection: From the mass production list, the XI3030E/LKE-H3016368Z15/2T is chosen (3000K, 163 lm min, CRI 70). However, since CRI >80 is needed, a variant with a CRI code of \"K\" (80 min) or higher would need to be selected from the full product range, likely with a slightly different flux code.
3. Quantity Calculation: To achieve 800 lumens, approximately 5 LEDs (800 lm / 163 lm per LED) of the selected type would be needed, accounting for optical and thermal losses, 6-7 LEDs might be used.
4. Thermal Design: With 6 LEDs at ~0.9W each, total heat is ~5.4W. A metal-core PCB (MCPCB) with adequate thermal vias and connection to the downlight housing as a heatsink would be designed to keep the junction temperature well below 125°C.
5. Electrical Design: A constant current driver capable of supplying 150mA to a string of 6 LEDs (total Vf ~ 36V) would be selected. Alternatively, two parallel strings of 3 LEDs each could be used with a different driver configuration.
12. Operating Principle
The XI3030E is a phosphor-converted white LED. The core is a semiconductor chip made of InGaN that emits blue light when electrical current passes through it in the forward direction (electroluminescence). This blue light is partially absorbed by a layer of yellow (and often red/green) phosphor coating deposited on or around the chip. The phosphor re-emits light at longer wavelengths (yellow, red). The mixture of the unabsorbed blue light and the phosphor-emitted yellow/red light combines to produce the perception of white light. The exact proportions of blue and phosphor emissions determine the correlated color temperature (CCT) of the white light.
13. Technology Trends
The mid-power LED segment, represented by packages like the PLCC-2 (3030), continues to evolve. Key industry trends include the continuous improvement of luminous efficacy (lumens per watt), driven by better chip technology and phosphor efficiency. There is a strong focus on enhancing color quality, pushing for higher CRI values (90+) and improved R9 and other saturated color indices (R12, R13, etc.) for full-spectrum lighting. Another trend is the improvement of reliability and lifetime under higher drive currents and operating temperatures. Furthermore, packaging technology is advancing to allow for higher flux density and better thermal management from the same footprint. The development of more precise and consistent binning systems also remains a priority to enable mass production of lighting products with excellent color uniformity.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |