SMD Mid-Power LED 67-22ST Datasheet - PLCC-2 Package - 3.0V Max - 150mA - White - English Technical Documentation

1. Product Overview

The 67-22ST is a surface-mount device (SMD) mid-power LED housed in a PLCC-2 package. It is designed as a white LED offering a combination of high luminous efficacy, high color rendering index (CRI), low power consumption, and a wide viewing angle. Its compact form factor makes it suitable for a broad range of lighting applications where reliable performance and energy efficiency are key requirements.

1.1 Core Advantages

• High Luminous Intensity Output: Delivers bright and efficient light output.
• Wide Viewing Angle: Provides uniform illumination over a broad area, typical 120 degrees.
• Environmental Compliance: The product is Pb-free, compliant with RoHS, EU REACH, and Halogen Free standards (Br<900ppm, Cl<900ppm, Br+Cl<1500ppm).
• ANSI Binning: Ensures consistent color and flux output according to standardized bins.
• High CRI Options: Available with a minimum CRI of 80 (Ra), enhancing color accuracy in illuminated objects.

1.2 Target Market and Applications

This LED is an ideal solution for various lighting applications, including but not limited to:

• General Lighting
• Decorative and Entertainment Lighting
• Indicator Lights
• General Illumination
• Switch Lights

2. In-Depth Technical Parameter Analysis

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.

• Forward Current (I_F): 180 mA
• Peak Forward Current (I_FP): 300 mA (Duty 1/10 @ 10ms pulse)
• Power Dissipation (P_d): 594 mW
• Operating Temperature (T_opr): -40°C to +85°C
• Storage Temperature (T_stg): -40°C to +100°C
• Thermal Resistance (R_{th J-S}): 19 °C/W (Junction to Soldering point)
• Junction Temperature (T_j): 115 °C
• Soldering Temperature: Reflow: 260°C for 10 sec. Hand Soldering: 350°C for 3 sec.

Note: The device is sensitive to electrostatic discharge (ESD). Proper ESD handling precautions must be observed.

2.2 Electro-Optical Characteristics

Typical performance parameters measured at a soldering point temperature of 25°C and a forward current of 150mA.

• Luminous Flux (Φ): Minimum 75 lm (Refer to binning tables for specific ranges). Tolerance: ±11%.
• Forward Voltage (V_F): Maximum 3.0 V. Tolerance: ±0.1V.
• Color Rendering Index (Ra): Minimum 80. Tolerance: ±2.
• R9: Minimum 0.
• Viewing Angle (2θ_1/2): Typical 120 degrees.
• Reverse Current (I_R): Maximum 50 µA at V_R = 5V.

3. Binning System Explanation

The product uses a comprehensive binning system to ensure color and performance consistency.

3.1 Color Rendering Index (CRI) Binning

The CRI is indicated by a single letter in the product number. For this series, the primary option is 'N', representing a minimum CRI of 80.

3.2 Luminous Flux Binning

Flux is binned in 5-lumen steps under standard test conditions (I_F=150mA).

• Bin Codes: 75L5 (75-80 lm), 80L5 (80-85 lm), 85L5 (85-90 lm), 90L5 (90-95 lm), 95L5 (95-100 lm).

3.3 Forward Voltage Binning

Forward voltage is grouped and binned to aid in circuit design for current regulation.

• Group 2730 Bin Codes: 27A (2.7-2.8V), 28A (2.8-2.9V), 29A (2.9-3.0V).

3.4 Correlated Color Temperature (CCT) and Chromaticity Binning

The LED is available in multiple CCTs: 2700K, 3000K, 3500K, 4000K, 5000K, 5700K, 6200K, and 6500K. Each CCT has defined chromaticity coordinate bins on the CIE 1931 diagram to ensure tight color consistency. Binning is provided in both 3-step and 5-step MacAdam ellipse systems, as well as detailed 7-step chromaticity coordinate boxes, specifying the x, y coordinates for each corner of the bin area. This allows designers to select the precise color point required for their application.

4. Mass Production List and Product Numbering

4.1 Standard Product List

The datasheet provides a list of standard products in mass production. Example: 67-22ST/KKX-N658530Z15/2T(EMM).

• CCT: 6500K
• CRI (Min.): 80
• R9 (Min.): 0
• Luminous Flux (Min.): 85 lm
• Forward Voltage (Max.): 3.0 V
• Forward Current: 150 mA

Similar listings are provided for other CCTs (2700K, 3000K, etc.) with corresponding minimum flux values.

4.2 Product Number Explanation

The part number structure is: 67-22ST/ K KX – N XX XX 30 Z15 / 2 T

• 67-22ST/: Base package type.
• K: Chip material/type identifier.
• KX: Emitted color (White).
• N: CRI bin code (80 Min.).
• XX XX: Codes for CCT and Luminous Flux bin.
• 30: Forward Voltage index (3.0V max).
• Z15: Forward Current index (150mA).
• /2T: Packing quantity per reel.
• (EMM): Additional product suffix.

5. Performance and Design Considerations

5.1 Thermal Management

With a thermal resistance of 19°C/W from junction to soldering point, effective thermal management on the PCB is crucial. Exceeding the maximum junction temperature of 115°C will reduce luminous output and lifespan. Designers must ensure adequate heat sinking via copper pads and possibly thermal vias, especially when operating at or near the maximum forward current of 180mA.

5.2 Electrical Drive Considerations

The LED should be driven with a constant current source, not a constant voltage. The recommended operating current is 150mA, with a maximum continuous current of 180mA. The forward voltage has a maximum of 3.0V with a ±0.1V tolerance, which must be accounted for in the driver design. The low reverse breakdown characteristic (I_R max 50µA at 5V) means care should be taken to avoid reverse bias conditions.

5.3 Optical Characteristics

The typical 120-degree viewing angle makes this LED suitable for applications requiring wide, diffuse illumination rather than a focused beam. The high CRI (80 min) version is preferable for applications where color accuracy is important, such as retail lighting or task lighting. The R9 value (deep red saturation) is specified as a minimum of 0, which is typical for standard white LEDs; for superior color rendering, especially with red objects, a higher R9 value would be needed.

6. Assembly and Handling Guidelines

6.1 Soldering Process

The LED is compatible with standard reflow soldering processes. The maximum profile is 260°C for 10 seconds. For hand soldering, the iron tip temperature must not exceed 350°C, and contact time should be limited to 3 seconds. It is critical to follow these guidelines to prevent damage to the plastic package and the internal wire bonds.

6.2 Storage and Handling

Devices should be stored in their original moisture-barrier bags in an environment within the specified storage temperature range (-40°C to +100°C). As ESD-sensitive components, they must be handled at ESD-protected workstations using grounded equipment.

7. Application Suggestions and Design Notes

7.1 Typical Application Circuits

In most applications, multiple LEDs will be used. They can be connected in series, parallel, or a series-parallel combination. A series connection is generally preferred as it ensures identical current through each LED, promoting uniform brightness and color. When connecting in series, the driver's output voltage must be sufficient to overcome the sum of the forward voltages of the LED string. Parallel connections require careful matching of V_F bins or the use of individual current-limiting resistors for each LED to prevent current hogging.

7.2 PCB Layout Recommendations

The PCB pad design should match the recommended footprint for the PLCC-2 package to ensure proper soldering and thermal performance. The solder pads should provide adequate thermal relief to conduct heat away from the LED's thermal pad (if present in the package) into the PCB copper layers. Maintaining a sufficient distance from other heat-generating components is also advised.

8. Technical Comparison and Positioning

The 67-22ST positions itself as a reliable, general-purpose mid-power LED. Its key differentiators in the market are its combination of ANSI-standard binning for color consistency, compliance with major environmental regulations (RoHS, REACH, Halogen-Free), and a balanced set of electro-optical characteristics. Compared to entry-level LEDs, it offers better CRI and tighter binning. Compared to high-end LEDs, it provides a cost-effective solution for applications that require good performance but may not need ultra-high efficacy or extreme CRI values above 90.

9. Frequently Asked Questions (Based on Technical Parameters)

9.1 What is the actual power consumption of this LED?

At the typical operating current of 150mA and a maximum forward voltage of 3.0V, the maximum power consumption is 450mW (0.15A * 3.0V). The actual power will depend on the specific V_F bin of the LED used.

9.2 Can I drive this LED with a 3.3V power supply?

Directly connecting to a 3.3V source is not recommended and is likely to destroy the LED due to overcurrent. The forward voltage is specified as a maximum of 3.0V at 150mA. A constant-voltage source slightly above the LED's V_F will cause an uncontrolled and potentially damaging high current to flow. Always use a constant-current driver or an appropriate current-limiting circuit.

9.3 How do I select the right CCT and flux bin for my project?

Refer to the Mass Production List and the binning tables. Choose the CCT (e.g., 3000K for warm white, 6500K for cool white) based on the desired ambiance. Select the flux bin (e.g., 85L5) based on the required light output. For color-critical applications, also consider the chromaticity binning (3-step, 5-step, or 7-step) to ensure minimal color variation between units.

9.4 What does \"R9 minimum 0\" mean?

R9 is a specific measure of how accurately a light source renders deep red colors. A value of 0 is the minimum specified, meaning it could be zero or a positive number. Many standard white LEDs have a low or negative R9. If rendering red objects vividly is crucial for your application (e.g., meat display, textile shops), you should look for LEDs with a specified high R9 value (e.g., R9 > 50).

10. Practical Use Case Example

Scenario: Designing an LED panel light for office illumination.

A designer is creating a 600x600mm LED panel light. The goal is to achieve uniform, flicker-free light with good color rendering for a comfortable office environment. They decide to use the 67-22ST LED in the 4000K CCT with a CRI of 80 (N bin). They select the 85L5 flux bin to meet the target lumen output for the panel. Hundreds of LEDs will be arranged on a metal-core PCB (MCPCB) in a series-parallel configuration. A constant-current driver capable of delivering the total required current at the summed forward voltage of the series strings is selected. The wide 120-degree viewing angle of the LED helps achieve a uniform appearance without visible hotspots when combined with a diffuser. The MCPCB effectively dissipates heat, keeping the junction temperature well below the maximum, ensuring long-term reliability and stable light output.

11. Operating Principle Introduction

This LED is a solid-state light source based on semiconductor technology. The core component is a semiconductor chip, typically made of indium gallium nitride (InGaN) for white LEDs. When a forward voltage is applied and current flows across the p-n junction of this chip, electrons and holes recombine, releasing energy in the form of photons (light). The specific materials and structure of the chip determine the primary wavelength of light emitted. To create white light, the primary blue or ultraviolet light from the chip is partially converted to longer wavelengths (yellow, red) by a phosphor coating inside the package. The mixture of the primary and converted light results in the perceived white light, with its CCT determined by the phosphor composition.

12. Technology Trends and Context

Mid-power LEDs like the 67-22ST represent a mature and highly optimized segment of the LED market. The current trends in this area focus on several key improvements: increasing luminous efficacy (more lumens per watt) to enhance energy savings, improving color rendering (higher Ra and R9 values) for better light quality, and achieving even tighter color consistency (smaller MacAdam ellipses like 2-step or 1-step) to eliminate visible color differences in large installations. Furthermore, there is a continuous drive for higher reliability and longer lifetimes under various operating conditions. The widespread adoption of standards like ANSI binning and strict environmental compliance (Halogen-Free, lower blue light hazard considerations) are also defining characteristics of modern, responsibly manufactured LED components.