SMD PLCC-2 Green LED G67-12S Datasheet - Middle Power - 60mA - 3.2V - 120° Viewing Angle - English Technical Document

1. Product Overview

The G67-12S is a surface-mount device (SMD) LED in a PLCC-2 package format. It is classified as a middle power LED, designed to offer a balance between performance and energy consumption. The primary emitted color is green, achieved using InGaN chip technology with a water-clear resin encapsulation. This combination provides a wide viewing angle, making it suitable for applications requiring broad light distribution.

The core advantages of this LED include its high efficacy, which translates to good light output for the electrical power consumed, and its compact form factor that facilitates integration into modern, space-constrained lighting designs. Its compliance with Pb-free and RoHS directives ensures it meets contemporary environmental and safety standards for electronic components.

The target market for this component spans various lighting applications where reliable, efficient green illumination is required. Its characteristics make it a versatile choice for designers.

2. Technical Parameter Deep Dive

2.1 Absolute Maximum Ratings

The device must not be operated beyond these limits to prevent permanent damage. The absolute maximum ratings are specified at a soldering point temperature (T_Soldering) of 25°C.

• Forward Current (I_F): 60 mA (Continuous)
• Peak Forward Current (I_FP): 100 mA (Allowed at a duty cycle of 1/10 and pulse width of 10ms)
• Power Dissipation (P_d): 230 mW
• Operating Temperature (T_opr): -40°C to +85°C
• Storage Temperature (T_stg): -40°C to +100°C
• Electrostatic Discharge (ESD) Human Body Model (HBM): 2000 V. The component is sensitive to ESD, requiring proper handling procedures.
• Thermal Resistance (R_{th J-S}): 50 °C/W (Junction to Soldering point). This parameter is critical for thermal management design.
• Maximum Junction Temperature (T_j): 115 °C
• Soldering Temperature: For reflow soldering, 260°C for 10 seconds is specified. For hand soldering, 350°C for 3 seconds is the limit.

2.2 Electro-Optical Characteristics

These key performance parameters are measured under standard test conditions (T_Soldering = 25°C, I_F = 60 mA).

• Luminous Flux (I_v): 13.0 lm (Minimum), 18.0 lm (Maximum). The typical value falls within this range. A tolerance of ±11% applies.
• Forward Voltage (V_F): 2.9 V (Minimum), 3.4 V (Maximum). The typical value is around the midpoint. A tolerance of ±0.1V applies.
• Viewing Angle (2θ_1/2): 120 degrees (Typical). This defines the angular span where luminous intensity is at least half of the peak intensity.

3. Binning System Explanation

To ensure consistency in production, LEDs are sorted into bins based on key parameters. The G67-12S uses a multi-code binning system as part of its full product number (e.g., G2C-D1525L4L82934Z6/2T).

3.1 Luminous Flux Bins

Binned by minimum and maximum luminous flux at I_F=60mA. The bin code (e.g., L4, L5) is part of the product number.

• L4: 13.0 lm to 14.0 lm
• L5: 14.0 lm to 15.0 lm
• L6: 15.0 lm to 16.0 lm
• L7: 16.0 lm to 17.0 lm
• L8: 17.0 lm to 18.0 lm

3.2 Forward Voltage Bins

Binned by forward voltage range at I_F=60mA.

• 36: 2.9 V to 3.0 V
• 37: 3.0 V to 3.1 V
• 38: 3.1 V to 3.2 V
• 39: 3.2 V to 3.3 V
• 40: 3.3 V to 3.4 V

3.3 Dominant Wavelength Bins

Defines the primary color (green) wavelength.

• G51: 515 nm to 520 nm
• G52: 520 nm to 525 nm

Measurement tolerance for dominant/peak wavelength is ±1 nm.

4. Performance Curve Analysis

4.1 Spectrum Distribution

The provided spectral graph shows a characteristic narrow-band emission peak in the green region (approximately 515-535 nm), which is typical for InGaN-based green LEDs. The curve allows designers to understand the color purity and potential application in systems sensitive to specific wavelengths.

4.2 Forward Voltage vs. Junction Temperature

Figure 1 illustrates that the forward voltage (V_F) has a negative temperature coefficient. As the junction temperature (T_j) increases from 25°C to 115°C, V_F decreases linearly by approximately 0.25V. This is a critical consideration for constant-current drivers, as a fixed voltage supply could lead to increased current at higher temperatures.

4.3 Relative Radiometric Power vs. Forward Current

Figure 2 shows the relationship between light output (radiometric power) and drive current. The output is sub-linear, increasing with current but with a tendency to saturate at higher currents (approaching 60-70 mA). This highlights the importance of operating within the recommended current range for optimal efficacy and longevity.

4.4 Relative Luminous Flux vs. Junction Temperature

Figure 3 demonstrates the thermal quenching effect. Luminous output decreases as junction temperature rises. At T_j = 115°C, the output is roughly 80% of its value at 25°C. Effective heat sinking is therefore essential to maintain brightness.

4.5 Forward Current vs. Forward Voltage (IV Curve)

Figure 4 presents the classic diode IV characteristic for the LED at 25°C. The curve shows the exponential relationship, with the device turning on around 2.9V and operating in the 3.0-3.4V range at the nominal 60mA current.

4.6 Maximum Driving Current vs. Soldering Temperature

Figure 5 provides a de-rating guideline. It shows the maximum allowable forward current decreases as the temperature at the soldering point increases. This graph is vital for designing systems that operate in elevated ambient temperatures, ensuring the junction temperature limit is not exceeded.

4.7 Radiation Pattern

Figure 6 is a polar diagram depicting the spatial distribution of light intensity. The pattern confirms the wide 120° viewing angle, showing a near-Lambertian (cosine) distribution typical for PLCC packages with a dome-shaped resin, providing even illumination over a broad area.

5. Mechanical and Package Information

5.1 Package Dimensions

The PLCC-2 package has a standard form factor. The dimensional drawing indicates key measurements including body length, width, and height, as well as pad spacing and size. All unspecified tolerances are ±0.15 mm. The cathode is typically identified by a marker on the package or in the footprint diagram.

6. Soldering and Assembly Guidelines

The datasheet specifies two soldering methods:

• Reflow Soldering: Maximum peak temperature of 260°C for 10 seconds maximum.
• Hand Soldering: Iron tip temperature of 350°C for 3 seconds maximum per lead.

It is crucial to adhere to these profiles to prevent thermal damage to the LED chip, wire bonds, or plastic package. The component is sensitive to electrostatic discharge (ESD), so appropriate ESD-safe handling and workstation practices are mandatory.

7. Packaging and Ordering Information

7.1 Moisture Resistant Packing

The LEDs are supplied in moisture-resistant packaging to prevent damage from ambient humidity, which is critical for components sensitive to moisture-induced stress during reflow (popcorning). The packing includes a carrier tape, reel, desiccant, and a sealed aluminum moisture-proof bag.

7.2 Reel and Tape Dimensions

Detailed drawings are provided for the reel and carrier tape. The standard loaded quantity is 4000 pieces per reel. The carrier tape has pockets designed to hold the PLCC-2 package securely during transportation and automated assembly.

7.3 Label Explanation

The reel label contains several codes: CPN (Customer Part Number), P/N (Product Number), QTY (Quantity), CAT (Luminous Intensity Rank/Bin), HUE (Dominant Wavelength Rank/Bin), REF (Forward Voltage Rank/Bin), and LOT No (Lot Number for traceability).

8. Application Suggestions

8.1 Typical Application Scenarios

• Decorative and Entertainment Lighting: Ideal for signage, architectural accent lighting, and stage lighting due to its vibrant green color and wide angle.
• Agriculture Lighting: Can be used in specialized horticultural lighting systems where specific green wavelengths are required for plant research or supplemental lighting.
• General Indicator and Backlighting: Suitable for status indicators, panel backlights, and consumer electronics where a bright, efficient green source is needed.

8.2 Design Considerations

• Current Limiting: An external current-limiting resistor or constant-current driver is absolutely necessary to prevent over-current damage, as noted in the \"Precautions for Use.\"
• Thermal Management: Given the thermal resistance of 50 °C/W and the sensitivity of light output to temperature, proper PCB layout with adequate thermal relief and, if necessary, a heatsink is recommended for high-power or high-ambient-temperature operation.
• Optical Design: The 120° viewing angle simplifies secondary optics design for applications requiring diffuse light. For focused beams, additional lenses may be required.

9. Reliability Testing

The datasheet lists a comprehensive set of reliability tests performed with a 90% confidence level and 10% Lot Tolerance Percent Defective (LTPD). Tests include:

• Reflow Soldering Resistance
• Thermal Shock (-10°C ↔ +100°C)
• Temperature Cycling (-40°C ↔ +100°C)
• High Temperature/Humidity Storage (85°C/85% RH)
• High Temperature/Humidity Operation (85°C/85% RH, 30mA)
• High/Low Temperature Storage & Operation Life Tests

These tests validate the LED's robustness under various environmental and operational stresses, ensuring long-term performance in field applications.

10. Technical Comparison and Differentiation

As a middle-power green LED in a PLCC-2 package, the G67-12S occupies a specific niche. Compared to low-power indicator LEDs, it offers significantly higher luminous flux (13-18 lm vs. typically <5 lm). Compared to high-power LEDs, it operates at lower current and requires less complex thermal management, simplifying driver design. Its primary advantage is offering a good balance of brightness, efficiency, and ease of use in standard SMD assembly processes. The wide 120° viewing angle is a key differentiator from narrower-beam LEDs, making it preferable for area illumination rather than spot lighting.

11. Frequently Asked Questions (Based on Technical Parameters)

Q: What driver current should I use?
A: The nominal continuous forward current is 60 mA. A constant-current driver set to 60 mA is recommended for optimal performance and lifetime. Do not exceed this value without consulting de-rating curves for temperature.

Q: Why is the forward voltage range so important?
A: The V_F bin (e.g., 38 for 3.1-3.2V) ensures consistency when multiple LEDs are connected in parallel. Matching V_F bins helps achieve uniform current sharing and brightness.

Q: How do I interpret the luminous flux bin code (e.g., L4)?
A: The bin code specifies the guaranteed minimum and maximum light output for that specific group of LEDs. Selecting a higher bin (e.g., L8) guarantees higher brightness but may affect cost and availability.

Q: Can I drive this LED with a 3.3V supply voltage?
A: Possibly, but it is not recommended. The forward voltage can be as high as 3.4V. A 3.3V supply may not fully turn on all units, especially those in higher V_F bins. Always use a current-limiting circuit designed for the LED's V_F range.

12. Design and Usage Case Study

Scenario: Designing a decorative LED strip light.
A designer wants to create a flexible LED strip for architectural cove lighting. They choose the G67-12S for its green color, wide viewing angle (to wash walls evenly), and middle-power rating (simplifying power supply design compared to high-power LEDs).
Implementation: LEDs are placed every 50mm on the strip. They are grouped in series of 3 LEDs plus a current-limiting resistor, designed for a 12V DC input. The resistor value is calculated based on the typical forward voltage (e.g., 3.2V x 3 = 9.6V) and desired 60mA current: R = (12V - 9.6V) / 0.060A = 40 Ohms. The PCB includes sufficient copper area for heat dissipation. The wide viewing angle eliminates the need for secondary diffusers, reducing cost and complexity. The moisture-resistant reel packaging ensures components arrive ready for automated assembly without baking.

13. Operational Principle

The G67-12S is a semiconductor light source. Its core is a chip made of Indium Gallium Nitride (InGaN) materials. When a forward voltage exceeding the diode's turn-on threshold (approx. 2.9V) is applied, electrons and holes recombine within the active region of the semiconductor, releasing energy in the form of photons. The specific composition of the InGaN alloy determines the bandgap energy, which directly corresponds to the wavelength of the emitted light—in this case, green (515-525 nm). The water-clear epoxy resin encapsulant protects the chip, acts as a lens to shape the light output into a wide beam, and may contain phosphors or other materials, though for a monochromatic green LED, it is typically purely transparent.

14. Technology Trends

The middle-power LED segment, exemplified by components like the G67-12S, continues to evolve. General industry trends include:
Increased Efficacy: Ongoing improvements in chip design, epitaxy, and package extraction efficiency lead to higher lumens per watt (lm/W), reducing energy consumption for the same light output.
Improved Color Consistency: Tighter binning tolerances for wavelength and flux are becoming standard, enabling better color matching in multi-LED systems without manual sorting.
Enhanced Reliability: Advancements in packaging materials (e.g., high-temperature silicones) and die-attach technologies are pushing maximum junction temperatures higher and extending operational lifetimes.
Miniaturization: While the PLCC-2 remains popular, there is a trend towards even smaller package footprints (e.g., chip-scale packages) for higher density applications, though often at the expense of thermal performance and viewing angle.