SMD PLCC-2 Red LED G67-21S/R3C Datasheet - 3.0x2.8x1.9mm - 1.8-2.9V - 150mA - 435mW - English Technical Document

1. Product Overview

This document details the technical specifications for a surface-mount device (SMD) middle-power LED utilizing a PLCC-2 (Plastic Leaded Chip Carrier) package. The device is engineered with an AlGaInP semiconductor chip to emit red light, encapsulated in a water-clear resin. It is characterized by a compact form factor, high efficacy suitable for its power class, and a wide viewing angle, making it a versatile component for various illumination applications. The product adheres to stringent environmental standards, being lead-free (Pb-free), compliant with the EU REACH regulation, and classified as halogen-free, with bromine and chlorine content kept below specified limits.

2. Technical Parameter Deep-Dive

2.1 Absolute Maximum Ratings

The device's operational limits are defined under a baseline soldering temperature of 25°C. The maximum continuous forward current (I_F) is rated at 150 mA, with a peak forward current (I_FP) of 300 mA permissible under pulsed conditions (duty cycle 1/10, pulse width 10ms). The maximum power dissipation (P_d) is 435 mW. The junction-to-soldering point thermal resistance (R_{th J-S}) is 50 °C/W, which is critical for thermal management design. The maximum allowable junction temperature (T_j) is 115°C. The operating temperature range spans from -40°C to +85°C, with a storage temperature range of -40°C to +100°C. The device has an electrostatic discharge (ESD) withstand capability of 2000V (Human Body Model), though handling with appropriate ESD precautions is mandatory. Soldering parameters are specified for both reflow (260°C for 10 seconds) and hand soldering (350°C for 3 seconds) processes.

2.2 Electro-Optical Characteristics

Measured at T_soldering = 25°C and I_F = 150 mA, the key performance parameters are defined. The luminous flux (Φ_v) has a typical range of 15.0 to 24.0 lumens, with a stated tolerance of ±11%. The forward voltage (V_F) ranges from 1.8V to 2.9V, with a tighter manufacturing tolerance of ±0.1V. The device offers a wide viewing angle (2θ_1/2) of 120 degrees. The maximum reverse current (I_R) is 50 µA when a reverse voltage (V_R) of 5V is applied.

3. Binning System Explanation

The product is classified into bins to ensure consistency in key parameters, allowing for precise design and color matching.

3.1 Radiometric Power (Luminous Flux) Bins

Luminous flux output is categorized into bins denoted by codes such as L6, L7, L8, L9, M3, and M4. Each bin defines a minimum and maximum flux value at I_F=150mA, for example, bin L6 covers 15-16 lm, while bin M4 covers 21-24 lm. The ±11% tolerance applies within each bin.

3.2 Forward Voltage Bins

Forward voltage is binned using two-digit codes from 25 to 35. Each code represents a 0.1V step, for instance, bin 25 covers 1.8-1.9V, bin 26 covers 1.9-2.0V, and so on up to bin 35 covering 2.8-2.9V. The manufacturing tolerance is ±0.1V per bin.

3.3 Dominant Wavelength Bins

The color point is controlled through dominant wavelength bins. The available bins are O54 (615-620 nm), R51 (620-625 nm), and R52 (625-630 nm), defining the specific shade of red emitted. The measurement tolerance for dominant/peak wavelength is ±1 nm.

4. Performance Curve Analysis

The datasheet provides several characteristic curves that illustrate device behavior under varying conditions.

4.1 Spectral Distribution

A graph shows the relative luminous intensity versus wavelength, typical for a red AlGaInP LED, with a peak in the 620-660 nm range and a defined spectral width.

4.2 Forward Voltage vs. Junction Temperature

Figure 1 plots the shift in forward voltage against junction temperature. The curve typically shows a negative coefficient, meaning V_F decreases as T_j increases, which is a critical factor for constant-current driver design.

4.3 Relative Radiometric Power vs. Forward Current

Figure 2 demonstrates the sub-linear relationship between light output (relative radiometric power) and forward current. The output increases with current but with diminishing returns at higher currents due to efficiency droop and thermal effects.

4.4 Relative Luminous Flux vs. Junction Temperature

Figure 3 shows how light output decreases as the junction temperature rises. This thermal derating is essential for predicting performance in real-world applications where heatsinking may be limited.

4.5 Forward Current vs. Forward Voltage & Thermal Derating

Figure 4 depicts the standard I-V curve. Figure 5 is crucial for reliability, showing the maximum allowable driving forward current as a function of the soldering temperature, ensuring the device is not overstressed during operation after assembly.

4.6 Radiation Pattern

Figure 6 presents a polar radiation diagram, confirming the 120° viewing angle (where intensity drops to 50% of the axial value) and the symmetrical Lambertian-like emission pattern typical of top-view PLCC packages.

5. Mechanical & Package Information

5.1 Package Dimensions

The PLCC-2 package has nominal dimensions of 3.0 mm in length, 2.8 mm in width, and a height of 1.9 mm. A detailed dimensioned drawing specifies pad locations, overall tolerances (±0.1 mm unless noted), and the lens structure. The top-view design indicates the light is emitted perpendicular to the mounting plane.

5.2 Polarity Identification

The cathode is typically identified by a visual marker on the package, such as a notch, a dot, or a cut corner on the lens or body, as indicated in the dimension drawing. Correct polarity orientation is essential during assembly.

6. Soldering & Assembly Guidelines

6.1 Reflow Soldering Parameters

The recommended reflow soldering profile peaks at 260°C for a duration of 10 seconds. This is a standard lead-free (SnAgCu) process requirement. Hand soldering, if necessary, should be limited to 350°C for no more than 3 seconds per lead, using a grounded iron.

6.2 Storage Conditions

The components are packaged in moisture-sensitive barrier bags with desiccant. Before the bag is opened, LEDs must be stored at 30°C or less and 90% relative humidity or less. Once opened, components should be used within a specified timeframe or baked according to MSL (Moisture Sensitivity Level) procedures to prevent popcorning during reflow.

6.3 Precautions for Use

Over-current Protection: LEDs are current-driven devices. An external current-limiting resistor or constant-current driver is mandatory. A small increase in forward voltage can cause a large, potentially destructive increase in current due to the diode's exponential I-V characteristic.
ESD Precautions: The device is sensitive to electrostatic discharge. Use ESD-safe workstations, wrist straps, and packaging during handling and assembly.

7. Packaging & Ordering Information

7.1 Tape and Reel Specifications

The LEDs are supplied on embossed carrier tape for automated pick-and-place assembly. The tape width, pocket dimensions, and sprocket hole pitch are specified. Each reel contains 4000 pieces. Reel dimensions (diameter, width, hub size) are provided for compatibility with automated equipment.

7.2 Moisture-Resistant Packing

The full packing process involves placing the reeled components into an aluminum laminate moisture-proof bag along with desiccant and a humidity indicator card. The bag is then sealed.

7.3 Label Explanation

Reel labels include several codes: P/N (Product Number), QTY (Packing Quantity), CAT (Luminous Intensity Rank/bin), HUE (Dominant Wavelength Rank/bin), REF (Forward Voltage Rank/bin), and LOT No (Traceable Lot Number).

8. Application Suggestions

8.1 Typical Application Scenarios

The combination of medium power, good efficiency, wide angle, and compact size makes this LED suitable for:
• Decorative and Entertainment Lighting: Architectural accent lighting, signage, stage lighting effects where red color is required.
• Agriculture Lighting: Supplemental lighting in horticulture, potentially influencing plant photomorphogenesis in the red spectrum.
• General Lighting: Indicator lights, status lights, backlighting for panels or switches, and other applications requiring a reliable red indicator.

8.2 Design Considerations

• Thermal Management: With an R_{th J-S} of 50 °C/W, effective thermal path design on the PCB (using thermal vias, copper pours) is important to maintain low junction temperature, ensuring long-term reliability and stable light output.
• Current Drive: Always use a constant current source or a voltage source with a series resistor calculated based on the maximum V_F from the binning table and the target operating current.
• Optical Design: The 120° viewing angle and Lambertian pattern simplify secondary optics design for beam shaping if required.

9. Reliability & Quality Assurance

A comprehensive set of reliability tests is performed with a 90% confidence level and an LTPD (Lot Tolerance Percent Defective) of 10%. The test matrix includes:
• Reflow Soldering Resistance
• Thermal Shock (-10°C to +100°C)
• Temperature Cycling (-40°C to +100°C)
• High Temperature/Humidity Storage (85°C/85% RH)
• High/Low Temperature Operation and Storage Life tests at various conditions and currents (e.g., 90mA, 180mA).
Each test uses a sample size of 22 pieces with an accept/reject criterion of 0/1, indicating high reliability standards.

10. Technical Comparison & Positioning

This middle-power PLCC-2 LED occupies a specific niche. Compared to low-power SMD LEDs (e.g., 0603, 0805), it offers significantly higher luminous flux, making it suitable for illumination rather than just indication. Compared to high-power LEDs, it requires less complex thermal management and driving circuitry while still delivering useful light output for many applications. The AlGaInP technology provides high efficiency in the red/orange/amber spectrum compared to phosphor-converted white LEDs of similar size. The wide 120° viewing angle is a key differentiator from LEDs with narrower, more focused beams.

11. Frequently Asked Questions (Based on Technical Parameters)

Q: What driver current should I use?
A: The absolute maximum continuous current is 150 mA. For optimal balance of efficiency, lifetime, and light output, operating between 60-120 mA is typical, but always refer to the derating curves (Fig. 5) based on your board's thermal performance.
Q: How do I interpret the binning codes in my order?
A: The label codes CAT, HUE, and REF correspond directly to the Luminous Flux, Dominant Wavelength, and Forward Voltage bin tables in sections 3.1, 3.2, and 3.3. This allows you to know the precise performance range of the LEDs you received.
Q: Can I drive this LED directly from a 3.3V or 5V logic supply?
A: No. You must use a series current-limiting resistor. Calculate the resistor value as R = (V_supply - V_F) / I_F. Use the maximum V_F from your voltage bin to ensure enough voltage drop across the resistor at all times.
Q: What is the impact of junction temperature on performance?
A: As shown in Fig. 3, light output decreases as T_j increases. Furthermore, higher temperatures accelerate lumen depreciation and can reduce device lifetime. Maintaining a low T_j through good heatsinking is critical for consistent, long-term performance.

12. Design-in Case Study Example

Scenario: Designing a low-cost, battery-powered red safety beacon.
Requirements: Visible from all angles, low power consumption, simple drive circuit, compact.
Design Choices:
1. LED Selection: This PLCC-2 red LED is chosen for its 120° viewing angle (good omnidirectionality), medium power (good brightness vs. battery life), and SMD package (small, easy assembly).
2. Drive Circuit: A simple circuit using a 3V coin cell battery, a MOSFET for switching, and a series resistor. The resistor value is calculated for I_F = 100 mA using R = (3.0V - 2.5V_typ) / 0.1A = 5Ω. A 5.1Ω, 1/4W resistor is selected.
3. Thermal & PCB Design: The beacon operates in short pulses (10% duty cycle), reducing average power and thermal load. The PCB uses a simple two-layer design with the LED pad connected to a small copper pour on the bottom layer for slight heatsinking.
4. Result: A functional, reliable beacon meeting size, cost, and performance targets, leveraging the LED's specified characteristics.

13. Operating Principle

This is a semiconductor photonic device based on an AlGaInP (Aluminum Gallium Indium Phosphide) heterostructure. When a forward voltage exceeding the diode's turn-on voltage is applied, electrons and holes are injected into the active region from the n-type and p-type layers, respectively. These charge carriers recombine radiatively within the quantum wells of the active region, releasing energy in the form of photons. The specific composition of the AlGaInP alloy determines the bandgap energy, which directly defines the wavelength (color) of the emitted light—in this case, in the red spectrum (615-630 nm). The water-clear epoxy resin encapsulant protects the semiconductor chip, provides mechanical stability, and shapes the light output beam.

14. Technology Trends

Middle-power SMD LEDs like this PLCC-2 type continue to evolve. General industry trends include:
• Increased Efficacy: Ongoing improvements in internal quantum efficiency, light extraction, and package design lead to higher lumens per watt (lm/W), reducing energy consumption for the same light output.
• Improved Color Consistency: Tighter binning tolerances for wavelength and flux, enabled by advanced manufacturing process control, allow for better color matching in multi-LED arrays without manual sorting.
• Enhanced Reliability: Development of more robust package materials (mold compounds, leadframes) and improved chip-level reliability lead to longer operational lifetimes (L70, L90 metrics) under higher drive currents and temperatures.
• Miniaturization with Performance: The drive for smaller, denser LED arrays pushes package sizes down while maintaining or increasing light output, though this intensifies thermal management challenges.
• Smart & Integrated Solutions: The broader market sees growth in LEDs with integrated drivers, controllers, or sensors, though this is more prevalent in high-power or specialty segments.