SMD Middle Power Yellow LED 67-21S Datasheet - PLCC-2 Package - 2.1-2.8V - 70mA - English Technical Document

1. Product Overview

This document details the specifications for a surface-mount device (SMD) Middle Power LED in a PLCC-2 package, emitting yellow light. Designed for general lighting applications, it offers a balance of performance, efficiency, and compact size. The device features a wide viewing angle, is constructed with lead-free materials, and complies with RoHS environmental standards, making it suitable for modern electronic assembly processes.

1.1 Core Features and Advantages

The primary advantages of this LED include its high luminous efficacy and middle power consumption profile, which allows for efficient operation in various lighting scenarios. The compact PLCC-2 form factor facilitates easy integration into PCB designs, while the wide 120-degree viewing angle ensures uniform light distribution. Its compliance with Pb-free and RoHS directives aligns with global environmental regulations.

1.2 Target Applications and Markets

This LED is engineered as a versatile component suitable for multiple lighting segments. Its key application areas include decorative and entertainment lighting, where consistent color and brightness are crucial. It is also applicable in agricultural lighting systems. Furthermore, its general-use designation makes it a reliable choice for indicator lights, backlighting, and other common illumination tasks in consumer and industrial electronics.

2. Technical Parameters: In-Depth Objective Analysis

This section provides a detailed, objective breakdown of the device's operational limits and performance characteristics under defined test conditions.

2.1 Absolute Maximum Ratings

The Absolute Maximum Ratings define the stress limits beyond which permanent damage to the device may occur. These ratings are specified at a soldering point temperature (T_Soldering) of 25°C. The continuous forward current (I_F) must not exceed 70 mA. For pulsed operation, a peak forward current (I_FP) of 140 mA is permissible under a duty cycle of 1/10 and a pulse width of 10 ms. The maximum power dissipation (P_d) is 200 mW. The device can operate within an ambient temperature (T_opr) range of -40°C to +85°C and be stored (T_stg) between -40°C and +100°C. The thermal resistance from the junction to the soldering point (R_th J-S) is 50 °C/W, and the maximum allowable junction temperature (T_j) is 115°C. Soldering must adhere to strict thermal profiles: reflow soldering at 260°C for a maximum of 10 seconds, or hand soldering at 350°C for a maximum of 3 seconds. A critical note emphasizes that the product is sensitive to electrostatic discharge (ESD), requiring appropriate handling precautions.

2.2 Electro-Optical Characteristics

The Electro-Optical Characteristics are measured at T_Soldering = 25°C and a test current (I_F) of 60 mA, representing a typical operating point. The luminous flux (I_v) has a typical range from 8.5 lm (minimum) to 13.0 lm (maximum). The forward voltage (V_F) typically falls between 2.1 V and 2.8 V. The viewing angle (2θ_1/2), defined as the full angle at half intensity, is 120 degrees. The reverse current (I_R) is guaranteed to be a maximum of 50 µA when a reverse voltage (V_R) of 5V is applied. Important tolerances are noted: the luminous flux has a ±11% tolerance, and the forward voltage has a ±0.1V tolerance around its binned value.

3. Binning System Explanation

To ensure consistency in production runs, LEDs are sorted into bins based on key performance parameters. This allows designers to select components that meet specific application requirements for brightness and electrical characteristics.

3.1 Luminous Flux Binning

The luminous output is categorized into several bin codes (B7, B8, B9, L1, L2, L3), each defining a specific range of minimum and maximum luminous flux values measured at I_F=60mA. For example, bin B7 covers 8.5 to 9.0 lm, while bin L3 covers 12.0 to 13.0 lm. The overall tolerance for luminous flux is ±11%.

3.2 Forward Voltage Binning

The forward voltage is binned into codes from 28 to 34, each representing a 0.1V step. Bin 28 covers 2.1V to 2.2V, and bin 34 covers 2.7V to 2.8V. The tolerance for forward voltage is ±0.1V from the binned range.

3.3 Dominant Wavelength Binning

The yellow color is defined by its dominant wavelength. Two bin codes are specified: Y52 for a dominant wavelength range of 585 nm to 590 nm, and Y53 for 590 nm to 595 nm. The measurement tolerance for dominant/peak wavelength is ±1 nm.

4. Performance Curve Analysis

Graphical data provides insight into how the LED behaves under varying operational conditions, which is crucial for robust circuit design and thermal management.

4.1 Spectrum Distribution

The provided spectrum curve shows the relative luminous intensity across wavelengths from approximately 540 nm to 640 nm. The curve peaks in the yellow region (around 585-595 nm), confirming the dominant wavelength bins, with minimal emission in other parts of the visible spectrum.

4.2 Typical Electro-Optical Characteristic Curves

Several key relationships are illustrated: Figure 1 shows the forward voltage shift decreasing linearly as junction temperature increases from 25°C to 115°C. Figure 2 depicts the relative radiometric power increasing in a sub-linear fashion with forward current. Figure 3 indicates that relative luminous flux decreases as junction temperature rises, a common thermal characteristic of LEDs. Figure 4 shows the forward current versus forward voltage relationship, which is essential for driver design. Figure 5 provides a derating curve, showing the maximum allowable forward current decreasing as the soldering point temperature increases, which is critical for thermal design. Figure 6 is a polar radiation diagram illustrating the spatial intensity distribution, confirming the wide 120-degree viewing angle.

5. Mechanical and Package Information

5.1 Package Dimensions

A detailed dimensioned drawing of the PLCC-2 package is provided. Key dimensions include the overall length, width, and height, as well as the pad spacing and size. The drawing specifies that the default tolerance for unspecified dimensions is ±0.15 mm. This information is vital for PCB footprint design and ensuring proper placement during assembly.

5.2 Polarity Identification

While not explicitly detailed in the text, standard PLCC-2 packages typically have a marked cathode (often a notch, dot, or chamfered corner) for polarity identification. Designers must consult the package drawing to confirm the exact marking scheme for this specific component.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Parameters

The datasheet explicitly states the maximum thermal profile for soldering: the component can withstand a peak temperature of 260°C for a maximum of 10 seconds during reflow soldering. For hand soldering, the limit is 350°C for 3 seconds. Exceeding these limits may damage the LED's internal structure or the plastic package.

6.2 Storage and Handling Precautions

The device is moisture-sensitive. The moisture-resistant bag should not be opened until the components are ready for use. Before opening, storage conditions should be ≤ 30°C and ≤ 90% RH. After opening, the components have a "floor life" of 168 hours (7 days) under conditions of ≤ 30°C and ≤ 60% RH. Any unused LEDs must be resealed in a moisture-proof package with desiccant. If the specified storage time is exceeded or the desiccant indicator has changed color, a baking treatment is required before use to remove absorbed moisture and prevent "popcorning" during reflow.

7. Packaging and Ordering Information

7.1 Moisture Resistant Packing

The LEDs are supplied on embossed carrier tapes, which are then wound onto reels. Standard loaded quantities per reel are 250, 500, 1000, 2000, 3000, or 4000 pieces. The reel, with the tape inside, is sealed within an aluminum moisture-proof bag along with desiccant.

7.2 Label Explanation

The packaging label contains several codes: CPN (Customer's Product Number), P/N (Product Number), QTY (Packing Quantity), CAT (Luminous Intensity Rank, corresponding to flux bin), HUE (Dominant Wavelength Rank), REF (Forward Voltage Rank), and LOT No (Lot Number for traceability).

7.3 Reel and Tape Dimensions

Detailed drawings specify the dimensions of the reel (diameter, width, hub size) and the carrier tape (pocket pitch, width, depth). These are important for automated pick-and-place machine setup. Tolerances for these dimensions are typically ±0.1 mm unless otherwise noted.

8. Application Suggestions and Design Considerations

8.1 Current Limiting and Driver Design

A critical design note is the requirement for an external current-limiting resistor or a constant-current driver. The forward voltage has a range and a negative temperature coefficient (as shown in Fig. 1). A slight increase in supply voltage or a decrease in V_F due to heating can cause a large, potentially destructive increase in forward current if driven directly from a voltage source. The driver must be designed to operate within the Absolute Maximum Ratings, considering the derating curve (Fig. 5) for elevated ambient temperatures.

8.2 Thermal Management

With a thermal resistance (R_th J-S) of 50 °C/W, effective heat sinking through the soldering pads is essential for maintaining performance and longevity. The PCB layout should provide adequate copper area connected to the LED pads to dissipate heat. Operating at high junction temperatures will reduce luminous output (Fig. 3) and accelerate long-term degradation.

9. Reliability and Quality Assurance

The datasheet lists a comprehensive set of reliability tests performed with a 90% confidence level and 10% Lot Tolerance Percent Defective (LTPD). Test items include reflow soldering resistance, thermal shock, temperature cycling, high temperature/humidity storage and operation, low temperature storage and operation, and high temperature operation life tests under various conditions. Each test has specific conditions (temperature, humidity, current, duration) and sample size (22 pieces) with defined acceptance criteria (0 failures allowed, 1 failure rejects the lot). This data provides assurance of the component's robustness under typical environmental and operational stresses.

10. Frequently Asked Questions (Based on Technical Parameters)

10.1 What is the difference between luminous flux and dominant wavelength bins?

Luminous flux bins (B7, L1, etc.) categorize the total visible light output (brightness) of the LED. Dominant wavelength bins (Y52, Y53) categorize the perceived color or hue of the yellow light. A designer must specify both to ensure consistency in both brightness and color across multiple units in an application.

10.2 How do I interpret the Forward Current vs. Soldering Temperature graph (Fig. 5)?

This is a derating curve. It shows that the maximum safe continuous forward current the LED can handle decreases as the temperature at its soldering points increases. For example, if the PCB design causes the LED's solder joints to reach 85°C, the maximum drive current is significantly lower than the 70 mA Absolute Maximum Rating specified at 25°C. This graph must be used for thermal design to prevent overheating.

10.3 What does \"floor life\" mean and why is it important?

Floor life is the maximum time the moisture-sensitive LEDs can be exposed to ambient factory conditions (after the sealed bag is opened) before they must be soldered or rebaked. Exceeding this time can allow moisture to absorb into the plastic package. During the high heat of reflow soldering, this trapped moisture can vaporize rapidly, causing internal delamination or cracks (\"popcorning\"), leading to immediate or latent failure.