SMD Reflector LED 67-22/R6BHC-B07/2T Datasheet - P-LCC-4 Package - Red/Blue - 20mA - English Technical Document

1. Product Overview

This document details the technical specifications for the 67-22/R6BHC-B07/2T, a surface-mount device (SMD) LED featuring an integrated reflector within a P-LCC-4 package. This component is engineered to deliver high-brightness output with a wide viewing angle, making it an optimal choice for applications requiring clear visual indicators or uniform backlighting. The product is available in two distinct chip variants: the R6 (Brilliant Red) and the BH (Blue), both encapsulated in a colorless clear resin window. Its design incorporates an inter-reflector to enhance light output efficiency and directionality.

The core advantages of this LED include its compatibility with automated pick-and-place equipment, suitability for vapor-phase reflow soldering processes, and availability on tape and reel for high-volume manufacturing. It is a Pb-free component and complies with relevant environmental regulations. The primary target markets are telecommunications, consumer electronics, and industrial control panels, where it serves as a reliable indicator, backlight for LCDs and switches, or as a light source for light pipe assemblies.

2. Technical Parameter Analysis

2.1 Absolute Maximum Ratings

The device's operational limits are defined under specific ambient conditions (Ta=25°C). Exceeding these ratings may cause permanent damage.

• Reverse Voltage (VR): 5V maximum. This is a critical parameter for circuit protection; applying a reverse bias beyond this value can damage the LED junction.
• Forward Current (IF): The continuous DC forward current rating differs between chips: 50 mA for the R6 (Red) and 25 mA for the BH (Blue). The typical operating condition specified in the datasheet is 20mA.
• Peak Forward Current (IFP): 100 mA for both chips, applicable for pulsed operation under specified duty cycles.
• Power Dissipation (Pd): 120 mW for R6 and 95 mW for BH. This parameter, along with thermal resistance (implied), dictates the maximum allowable power under given thermal conditions.
• Temperature Ranges: Operating temperature (Topr) from -40°C to +85°C; Storage temperature (Tstg) from -40°C to +90°C.
• Soldering Temperature: The component can withstand reflow soldering with a peak temperature of 260°C for up to 10 seconds, or hand soldering at 350°C for up to 3 seconds.

2.2 Electro-Optical Characteristics

Key performance metrics are measured at Ta=25°C and IF=20mA, unless otherwise stated.

• Luminous Intensity (Iv): Ranges from a minimum of 90 mcd to a maximum of 225 mcd for both the R6 and BH chips. The typical value falls within this binning range.
• Viewing Angle (2θ1/2): The full width at half maximum intensity is typically 120 degrees, providing a very broad emission pattern ideal for wide-area illumination.
• Wavelength:
  • R6 (Red): Peak wavelength (λp) is typically 632 nm. Dominant wavelength (λd) ranges from 621 nm to 631 nm.
  • BH (Blue): Peak wavelength (λp) is typically 468 nm. Dominant wavelength (λd) ranges from 466.5 nm to 471.5 nm.
• Spectrum Radiation Bandwidth (Δλ): Approximately 20 nm for R6 and 25 nm for BH, defining the spectral purity of the emitted light.
• Forward Voltage (VF):
  • R6 (Red): Ranges from 1.75V to 2.35V at 20mA.
  • BH (Blue): Ranges from 2.9V to 3.7V at 20mA. This higher forward voltage is characteristic of InGaN-based blue LEDs.
• Reverse Current (IR): Maximum of 10 μA when a reverse bias of 5V is applied.

Note on Tolerances: The datasheet specifies manufacturing tolerances: Luminous Intensity (±11%), Dominant Wavelength (±1nm), and Forward Voltage (±0.1V). These are important for design consistency.

3. Binning System Explanation

To ensure color and brightness consistency in production, the LEDs are sorted into bins based on key parameters.

3.1 Luminous Intensity Binning

Both R6 and BH chips are grouped into four intensity bins (Q2, R1, R2, S1) when measured at IF=20mA. The bins define minimum and maximum values, allowing designers to select the appropriate brightness grade for their application, from standard (Q2: 90-112 mcd) to high-brightness (S1: 180-225 mcd).

3.2 Dominant Wavelength Binning

For the R6 (Red) chip, the dominant wavelength is binned into two codes: FF1 (621-626 nm) and FF2 (626-631 nm). This allows for selection of a specific shade of red. The BH (Blue) chip has a single, tighter specified range (466.5-471.5 nm), indicating higher consistency in the blue wavelength output.

3.3 Forward Voltage Binning

Forward voltage is also binned to aid in circuit design, particularly for current-limiting resistor calculation and power supply design.

• R6 (Red): Bins 0 (1.75-1.95V), 1 (1.95-2.15V), and 2 (2.15-2.35V).
• BH (Blue): Bins 11 (2.90-3.10V), 12 (3.10-3.30V), 13 (3.30-3.50V), and 14 (3.50-3.70V).

4. Performance Curve Analysis

The datasheet provides characteristic curves for both the R6 and BH variants, offering deeper insight into performance under varying conditions.

4.1 Relative Luminous Intensity vs. Forward Current

This curve shows a near-linear relationship between forward current and light output up to the rated current. It confirms that 20mA is a standard operating point well within the linear region for both colors. Driving the LED at higher currents increases output but also increases junction temperature and accelerates lumen depreciation.

4.2 Forward Current Derating Curve

This graph is crucial for thermal management. It illustrates the maximum allowable continuous forward current as a function of the ambient temperature (Ta). As Ta increases, the maximum permissible current decreases linearly. For reliable operation at high ambient temperatures (e.g., +85°C), the forward current must be significantly derated from its 25°C rating.

4.3 Spectrum Distribution

The spectral plots show the normalized radiant power versus wavelength. The R6 curve centers around 632 nm with a typical bandwidth, while the BH curve is centered around 468 nm. These plots are useful for applications sensitive to specific spectral content.

4.4 Forward Voltage vs. Forward Current

This IV characteristic curve demonstrates the exponential relationship typical of diodes. The voltage increases logarithmically with current. The curve helps in understanding the dynamic resistance of the LED and is essential for designing efficient driver circuits.

4.5 Radiation Diagram

The polar plot visually represents the 120° typical viewing angle. The intensity is normalized to the peak (on-axis) value. The diagram shows a Lambertian-like distribution, which is common for LEDs with a diffused lens or reflector, providing wide, even illumination.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED is housed in a P-LCC-4 (Plastic Leaded Chip Carrier, 4-pin) package. The detailed dimensioned drawing specifies the overall size, lead spacing, and cavity details. Key dimensions include the footprint, which is critical for PCB pad design. The package incorporates a built-in reflector cup that surrounds the LED chip, which serves to collimate the light and increase the forward luminous intensity. The anode and cathode are clearly marked on the package diagram.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

A detailed Pb-free reflow soldering temperature profile is provided. Key phases include:

• Pre-heating: 150-200°C for 60-120 seconds, with a maximum ramp rate of 3°C/sec.
• Reflow (Above Liquidus): Time above 217°C should be 60-150 seconds. The peak temperature must not exceed 260°C, and the time within 5°C of the peak should be a maximum of 10 seconds.
• Cooling: Maximum cooling rate of 6°C/sec.

Critical Note: Reflow soldering should not be performed more than two times to prevent thermal stress damage to the package and wire bonds.

6.2 Storage and Handling Precautions

• Moisture Sensitivity: The component is packaged in a moisture-resistant bag with desiccant. The bag must not be opened until the parts are ready for use. The floor life after opening is 168 hours at conditions of ≤30°C and ≤60% RH.
• Baking: If the storage time is exceeded or the desiccant indicator changes, a baking treatment at 60 ±5°C for 24 hours is required before reflow to prevent "popcorning" (package cracking due to vapor pressure).
• Current Protection: An external current-limiting resistor is mandatory. LEDs are current-driven devices; a small change in forward voltage can cause a large change in current, potentially leading to instantaneous failure.
• Mechanical Stress: Avoid applying mechanical stress to the LED body during the soldering process.

7. Packaging and Ordering Information

7.1 Tape and Reel Specifications

The product is supplied on 8mm carrier tape, wound onto standard reels. Each reel contains 2000 pieces. Detailed drawings for the carrier tape pocket dimensions and the reel dimensions are provided to ensure compatibility with automated assembly equipment feeders.

7.2 Label Explanation

The reel label contains several codes:

• P/N: The manufacturer's part number (67-22/R6BHC-B07/2T).
• QTY: The quantity of parts on the reel.
• CAT, HUE, REF: Codes corresponding to the Luminous Intensity bin, Dominant Wavelength bin, and Forward Voltage bin, respectively.
• LOT No: Traceability lot number.

8. Application Suggestions

8.1 Typical Application Scenarios

• Telecommunications Equipment: Status indicators on routers, modems, phones, and fax machines.
• LCD Backlighting: Edge-lit or direct-lit backlighting for small monochrome or color LCD displays in appliances, instruments, and handheld devices.
• Switch and Symbol Illumination: Backlighting for membrane switches, keypads, and panel legends.
• Light Pipe Applications: Acting as the light source for acrylic or PC light guides that transport light from the PCB to a front panel or display.
• General Status Indicators: Power, activity, alarm, or mode indicators in a wide range of electronic products.

8.2 Design Considerations

• Current Limiting: Always use a series resistor. Calculate the resistor value using R = (Vsupply - Vf) / If, where Vf should be chosen from the maximum bin value (e.g., 2.35V for R6, 3.7V for BH) for a conservative design that ensures the current never exceeds 20mA even with supply voltage tolerances and Vf variation.
• Thermal Management: For continuous operation at high ambient temperatures or near maximum current, consider the PCB layout. Use adequate copper pours connected to the LED's thermal pad (if applicable) or cathode leads to act as a heat sink.
• Optical Design: The wide 120° viewing angle may require light guides, diffusers, or lenses to shape the beam for specific applications. The integrated reflector provides good forward intensity but may not be suitable for extremely narrow beam requirements.
• ESD Protection: While not explicitly rated for ESD, standard ESD handling precautions should be observed during assembly to prevent latent damage to the semiconductor junction.

9. Technical Comparison and Differentiation

Compared to standard SMD LEDs without an integrated reflector, this component offers significantly higher forward luminous intensity for the same drive current due to the light-collecting effect of the reflector cup. The P-LCC-4 package provides a more robust mechanical structure than chip-scale packages, often offering better thermal performance via its leads. The availability of detailed binning information for intensity, wavelength, and voltage allows for tighter system design and better end-product consistency compared to unbinned or broadly binned LEDs. The combination of wide viewing angle and good intensity makes it a versatile choice where both visibility from off-axis angles and bright on-axis performance are needed.

10. Frequently Asked Questions (Based on Technical Parameters)

10.1 What is the difference between peak wavelength and dominant wavelength?

Peak wavelength (λp) is the wavelength at which the spectral power distribution is maximum. Dominant wavelength (λd) is the single wavelength of monochromatic light that matches the perceived color of the LED light most closely. For design purposes, especially in color-sensitive applications, the dominant wavelength and its binning are more relevant.

10.2 Can I drive this LED at 30mA instead of 20mA?

While the Absolute Maximum Rating for continuous forward current is 50mA (R6) or 25mA (BH), the Electro-Optical Characteristics are specified at 20mA. Driving at 30mA will produce more light but will also increase power dissipation, junction temperature, and potentially accelerate lumen depreciation. It is essential to consult the derating curve and ensure the junction temperature remains within safe limits. For reliable long-term operation, adhering to the 20mA typical condition is recommended.

10.3 Why is the forward voltage of the blue LED higher than the red?

This is due to the fundamental semiconductor materials. The R6 red LED uses AlGaInP (Aluminum Gallium Indium Phosphide), which has a lower bandgap energy. The BH blue LED uses InGaN (Indium Gallium Nitride), which has a wider bandgap. A wider bandgap requires more energy for electrons to cross, which translates to a higher forward voltage for the same current.

10.4 How do I interpret the bin codes when ordering?

When placing an order, you can specify the desired bin codes for CAT (Intensity), HUE (Wavelength), and REF (Voltage) to ensure you receive LEDs with performance parameters within your specific design window. For example, for a consistent bright red output, you might specify CAT=S1 and HUE=FF2. If not specified, you will receive parts from standard production bins.

11. Design and Usage Case Study

Scenario: Designing a multi-status indicator panel for a network switch. The panel requires red LEDs for "Critical Alarm," blue LEDs for "System Active," and needs to be visible from various angles in a rack-mounted unit. The 67-22/R6BHC-B07/2T is selected.

Implementation: The R6 (Red) and BH (Blue) variants are used. The designer selects the S1 intensity bin for maximum brightness and specifies tight wavelength bins (e.g., FF2 for red) for color consistency across all units. A simple driver circuit is designed using a 5V supply. For the blue LED (max Vf=3.7V @20mA), the current-limiting resistor is calculated: R = (5V - 3.7V) / 0.02A = 65 Ohms. A standard 68 Ohm resistor is chosen. For the red LED (max Vf=2.35V), R = (5V - 2.35V) / 0.02A = 132.5 Ohms; a 130 Ohm resistor is used. The wide 120° viewing angle ensures the indicators are clearly visible even when the technician is not directly in front of the panel. The components are placed using automated equipment from the provided tape and reel.

12. Operating Principle

Light Emitting Diodes (LEDs) are semiconductor devices that emit light through electroluminescence. When a forward voltage is applied across the p-n junction, electrons from the n-type material recombine with holes from the p-type material in the active region. This recombination process releases energy in the form of photons (light). The specific wavelength (color) of the emitted light is determined by the bandgap energy of the semiconductor material used in the active region. The AlGaInP material system produces red, orange, and yellow light, while the InGaN system produces blue, green, and white (when combined with a phosphor). The integrated reflector in this package is a shaped cavity, typically made of a highly reflective material, that surrounds the chip. It redirects light that would otherwise be emitted sideways or backwards towards the front of the package, thereby increasing the useful forward luminous intensity and controlling the beam pattern.

13. Technology Trends

The development of SMD LEDs like this one follows broader industry trends towards miniaturization, increased efficiency (lumens per watt), and higher reliability. The use of reflector technology within a standard package footprint is a cost-effective method to boost performance without moving to more expensive chip-on-board (COB) or advanced package types. There is a continuous drive to improve the efficiency of both AlGaInP (red) and InGaN (blue/green) materials, leading to higher brightness from the same current or the same brightness at lower power. Packaging innovations focus on better thermal management to handle increased power densities and on improving color consistency and angular color uniformity (ACU) across the emission pattern. The emphasis on Pb-free and RoHS compliance, as seen in this datasheet, reflects the industry-wide shift towards environmentally sustainable manufacturing.