SMD RGB LED with Embedded IC - 5.0x5.0x1.6mm - 4.2-5.5V - 358mW - White Diffused Lens - English Datasheet

1. Product Overview

This document details the specifications for a surface-mount device (SMD) LED component that integrates red, green, and blue (RGB) semiconductor chips along with a dedicated driver integrated circuit (IC) within a single, compact package. This integrated solution is designed to simplify constant current applications for designers, eliminating the need for external current-limiting resistors or complex driver circuitry for each color channel. The device is housed in a white diffused lens package, which helps to blend the light from the individual color chips to create a more uniform and diffuse color output, suitable for indicator and decorative lighting applications.

1.1 Core Advantages and Target Market

The primary advantage of this component is its high level of integration. By embedding an 8-bit constant current PWM (Pulse Width Modulation) driver IC, it provides precise digital control over the brightness of each RGB color with 256 distinct steps, enabling the creation of over 16.7 million color combinations. The single-wire cascade data transmission protocol allows multiple units to be daisy-chained and controlled from a single microcontroller pin, significantly reducing wiring complexity and controller I/O requirements in multi-LED applications.

This makes the component particularly suitable for space-constrained and cost-sensitive applications requiring multi-color or full-color lighting effects. Its target markets include, but are not limited to, status indicators in consumer electronics and networking equipment, front panel backlighting, decorative lighting strips, full-color modules, and elements of indoor LED video displays or signage. The package is compatible with automated pick-and-place assembly equipment and standard infrared (IR) reflow soldering processes, facilitating high-volume manufacturing.

2. Technical Parameters: In-Depth Objective Interpretation

2.1 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. Operation under or at these limits is not guaranteed.

• Power Dissipation (P_D): 358 mW. This is the maximum total power the package can dissipate as heat. Exceeding this limit risks overheating the internal IC and LED chips.
• Supply Voltage Range (V_DD): +4.2V to +5.5V. The embedded IC is designed for a nominal 5V logic supply. Applying voltage outside this range can damage the control circuitry.
• Total Forward Current (I_F): 65 mA. This is the maximum sum of currents through the Red, Green, and Blue channels combined.
• Operating Temperature (T_a): -40°C to +85°C. The device is guaranteed to function within this ambient temperature range.
• Storage Temperature: -40°C to +100°C. The device can be stored without applied power within this wider range.

2.2 Optical Characteristics

Measured at an ambient temperature (T_a) of 25°C and a supply voltage (V_DD) of 5V with all color channels set to maximum brightness (data = 8'b11111111).

• Luminous Intensity (I_V):
  • Red (AlInGaP): 600 - 1200 mcd (Typical)
  • Green (InGaN): 1100 - 2200 mcd (Typical)
  • Blue (InGaN): 270 - 540 mcd (Typical)
  The green chip typically exhibits the highest output, followed by red, then blue. This imbalance is common in RGB LEDs and must be accounted for in color mixing algorithms to achieve a desired white point or specific hue.
• Viewing Angle (2θ_1/2): 120 degrees. This wide viewing angle, defined as the angle where intensity drops to half its on-axis value, is characteristic of the white diffused lens, providing a broad, soft light emission pattern suitable for area illumination.
• Dominant Wavelength (λ_d):
  • Red: 615 - 630 nm
  • Green: 515 - 530 nm
  • Blue: 455 - 470 nm
  These ranges define the primary color of light emitted by each chip. The specific bin within these ranges for a given unit determines its precise color coordinates.

2.3 Electrical Characteristics

Specified over the full operating temperature range (-40°C to +85°C) and supply voltage range (4.2V to 5.5V).

• IC Output Current per Channel (I_F): 20 mA (Typical). The embedded driver IC regulates the current supplied to each individual Red, Green, and Blue LED chip to this constant value, ensuring stable brightness and color consistency regardless of forward voltage variations.
• Input Logic Levels:
  • High-Level Input Voltage (V_IH): 2.7V min to V_DD. Compatible with 3.3V and 5V microcontroller outputs.
  • Low-Level Input Voltage (V_IL): 0V to 1.0V max.
• IC Quiescent Current (I_DD): 1.5 mA (Typical). This is the current consumed by the embedded driver IC itself when all LED outputs are off (all data bits are '0').

3. Binning System Explanation

3.1 CIE Chromaticity Coordinate Binning

The document provides a color bin table based on the CIE 1931 (x, y) chromaticity coordinates. The emitted light from each LED is tested and categorized into specific bins (e.g., A1, A2, A3, B1, B2, B3, C1, C2, C3). Each bin is defined by a quadrilateral area on the chromaticity diagram, specified by four (x, y) coordinate points. The tolerance for placement within a bin is +/- 0.01 in both x and y coordinates. This binning ensures color consistency between different production lots. Designers can specify a bin code when ordering to achieve tighter color matching in their application, which is critical for displays or multi-LED installations where color uniformity is paramount.

4. Performance Curve Analysis

4.1 Relative Intensity vs. Wavelength (Spectral Distribution)

The provided graph (Fig. 1) shows the relative spectral power distribution for the Red, Green, and Blue chips. Each curve displays a distinct peak corresponding to its dominant wavelength range. The Red curve is centered around ~625nm, the Green around ~525nm, and the Blue around ~465nm. The width of these peaks (Full Width at Half Maximum) influences color purity; narrower peaks generally yield more saturated colors. The overlap between the Green and Red spectra is minimal, which is beneficial for achieving a wide color gamut.

4.2 Forward Current vs. Ambient Temperature Derating Curve

The graph (Fig. 2) illustrates the relationship between the maximum allowable total forward current (I_F) and the ambient operating temperature (T_A). As temperature increases, the maximum permissible current decreases linearly. This derating is necessary to prevent the junction temperature of the LED chips and the driver IC from exceeding safe limits, which would accelerate degradation and reduce lifespan. At the maximum operating temperature of 85°C, the allowable total current is significantly lower than the 65mA absolute maximum rating specified at 25°C. This curve must be consulted for reliable thermal design.

4.3 Spatial Distribution (Luminous Intensity Pattern)

The polar diagram (Fig. 3) maps the normalized relative luminous intensity as a function of viewing angle. The plot confirms the 120-degree viewing angle, showing a smooth, approximately Lambertian-like distribution typical of a diffused lens. The intensity is highest at 0 degrees (on-axis) and decreases symmetrically to 50% of its peak at +/-60 degrees from the axis.

5. Mechanical and Package Information

5.1 Package Dimensions and Configuration

The component is housed in a surface-mount package with overall dimensions of approximately 5.0mm in length, 5.0mm in width, and 1.6mm in height (tolerance ±0.2mm). The package features a white, diffused plastic lens. The pin configuration consists of four pads:

1. VSS: Ground (0V reference).
2. DIN: Control Data Signal Input. Receives the serial data stream for this specific LED.
3. DOUT: Control Data Signal Output. Forwards the received data stream to the DIN pin of the next LED in a daisy-chain.
4. VDD: DC Power Input (+4.2V to +5.5V).

5.2 Recommended PCB Attachment Pad Layout

A land pattern diagram is provided to guide printed circuit board (PCB) design. Adhering to these recommended pad dimensions and spacing ensures proper solder joint formation during reflow, reliable electrical connection, and adequate mechanical strength. The design typically includes thermal relief connections and appropriate solder mask openings.

6. Soldering and Assembly Guidelines

6.1 IR Reflow Soldering Profile

A suggested infrared (IR) reflow profile is provided, compliant with the J-STD-020B standard for lead-free soldering processes. The profile graph shows key parameters: preheat, soak, reflow peak temperature, and cooling rates. The peak temperature typically must not exceed the maximum storage temperature of the component (100°C) by a significant margin for more than a specified time to avoid plastic package damage or internal stress. Following this profile is critical for achieving reliable solder joints without subjecting the LED and embedded IC to thermal shock.

6.2 Cleaning

If post-solder cleaning is required, the component can be immersed in ethyl alcohol or isopropyl alcohol at room temperature for less than one minute. The use of unspecified or aggressive chemical cleaners is prohibited as they may damage the plastic lens or package material.

7. Packaging and Ordering Information

7.1 Tape and Reel Specifications

The components are supplied packaged in embossed carrier tape with a protective cover tape, wound onto 7-inch (178mm) diameter reels. The tape width is 12mm. Standard packing quantity is 1000 pieces per reel, with a minimum order quantity of 500 pieces for partial reels. Detailed dimensions for the tape pockets and the reel are provided to ensure compatibility with automated assembly equipment feeders.

8. Application Suggestions

8.1 Typical Application Scenarios

• Status and Indicator Lighting: Multi-color status indicators in telecom, networking, and industrial equipment.
• Decorative and Architectural Lighting: LED strips, mood lighting, and color-changing accents in consumer products.
• Backlighting: Front panel or logo backlighting with dynamic color effects.
• Full-Color Displays: As individual pixels in low-resolution indoor full-color LED displays, message boards, or soft light panels.

8.2 Design Considerations

• Power Supply: Ensure a clean, regulated 5V supply with adequate current capacity for the number of LEDs used. Consider inrush current when many LEDs power on simultaneously.
• Data Signal Integrity: For long daisy-chains or high data rates, consider signal buffering or level shifting if the microcontroller operates at 3.3V, as the V_IH minimum is 2.7V.
• Thermal Management: Adhere to the current derating curve (Fig. 2). Provide adequate copper area on the PCB under and around the LED pads to act as a heat sink, especially in high-brightness or high-ambient-temperature applications.
• Color Mixing: Software or firmware must account for the different luminous intensities of the R, G, and B channels (as per typical values in section 2.2) to achieve accurate color mixing and a neutral white point.

9. Technical Comparison and Differentiation

The key differentiator of this component compared to a standard discrete RGB LED is the integrated constant current driver with digital PWM control. A discrete RGB LED requires three separate current-limiting resistors (or a more complex constant current sink) and three microcontroller PWM channels for control. This integrated solution consolidates the driver circuitry, reduces component count on the PCB, simplifies firmware (using a serial protocol instead of multiple PWM timers), and enables easy daisy-chaining for scalable installations. The trade-off is a slightly higher unit cost and a fixed current setting (typically 20mA).

10. Frequently Asked Questions (Based on Technical Parameters)

10.1 How many of these LEDs can I daisy-chain?

Theoretically, a very large number, as each LED regenerates and retransmits the data signal. The practical limit is determined by the desired refresh rate and data signal integrity. The total data transmission time for N LEDs is N * 24 bits * (1.2 µs ± 300ns) plus a reset pulse. For a 30 fps refresh, this limits the chain to several hundred LEDs. Signal degradation over long chains may require periodic signal boosting.

10.2 Can I drive this LED with a 3.3V microcontroller?

Yes, the input high voltage (V_IH) specification of 2.7V minimum is compatible with a 3.3V logic high output (~3.3V). Ensure the microcontroller's GPIO pin can source/sink sufficient current for the DIN input. The power supply (V_DD) must still be between 4.2V and 5.5V.

10.3 Why is the maximum total current 65mA if each channel is 20mA?

The 20mA per channel is a typical operating current set by the internal driver. The 65mA absolute maximum rating is a stress limit for the entire package, considering the combined heat generated by all three LEDs and the driver IC operating simultaneously at maximum brightness. The derating curve (Fig. 2) shows that at elevated temperatures, the safe operating current is much lower than 65mA.

11. Practical Use Case Example

Scenario: Designing a 16-LED color-changing decorative light ring. The LEDs would be arranged in a circle and daisy-chained. A single 5V, 1A power supply would be sufficient (16 LEDs * ~1.5mA IC quiescent current + 16 LEDs * 3 channels * 20mA max * duty cycle). A microcontroller (e.g., an Arduino or ESP32) would need only one GPIO pin connected to the DIN of the first LED. The firmware would create a data stream containing 24-bit color values (8 bits each for R, G, B) for all 16 LEDs, followed by a reset pulse. This stream is sent continuously to create animations. The white diffused lens ensures the individual LED points blend into a smooth ring of light.

12. Operating Principle Introduction

The device operates on a digital serial communication principle. The embedded IC contains shift registers and latches for each color channel. A serial data stream is clocked into the IC via the DIN pin. Each data bit is represented by the timing of a high pulse within a fixed period of 1.2µs. A '0' bit is a short high pulse (~300ns), and a '1' bit is a long high pulse (~900ns). The first 24 bits received correspond to the 8-bit brightness values for Green, Red, and Blue (typically in that order, GRB). After receiving its 24 bits, the IC retransmits all subsequent bits from its DOUT pin, allowing the data to cascade. A low signal on DIN lasting longer than 250µs (RESET) causes all ICs in the chain to latch their received data into the output drivers, updating the LED brightness simultaneously.

13. Technology Trends

The integration of driver ICs directly into LED packages represents a significant trend in LED component design, moving towards \"smart LED\" solutions. This trend reduces system complexity, improves reliability by minimizing external connections, and enables more sophisticated control (like individual addressability). Future developments may include higher integration (incorporating microcontrollers or wireless controllers), improved color consistency through on-chip calibration, higher PWM resolution (10-bit, 12-bit, 16-bit) for finer color control, and enhanced communication protocols with higher data rates and error correction for more robust large-scale installations.