SMD LED 3014 White Datasheet - Dimensions 3.0x1.4x0.8mm - Voltage 2.4-3.6V - Power 0.093W - English Technical Document

1. Product Overview

This document provides the complete technical specifications for a surface-mount device (SMD) LED in a 3014 package format, configured for top-view emission. The primary emitted color is white, achieved through a combination of InGaN chip material and a yellowish resin encapsulant. The device is designed for general-purpose indicator and illumination applications where reliable performance and ease of assembly are paramount.

The core advantages of this LED include its compact P-LCC-2 package, which facilitates high-density PCB mounting. It features an inner reflector and white package body to enhance light output and directionality. The device is fully compliant with modern environmental and manufacturing standards, being Pb-free, RoHS compliant, REACH compliant, and halogen-free. It is pre-conditioned according to JEDEC J-STD-020D Level 3 for moisture sensitivity, ensuring reliability in reflow soldering processes.

The target market encompasses a wide range of electronic devices requiring status indication, backlighting, or general illumination. Its design makes it suitable for both consumer and industrial electronics.

2. In-Depth Technical Parameter Analysis

2.1 Absolute Maximum Ratings

The device's operational limits are defined under standard ambient conditions (Ta=25°C). Exceeding these ratings may cause permanent damage.

• Reverse Voltage (VR): 5 V. This is the maximum voltage that can be applied in the reverse direction across the LED terminals.
• Forward Current (IF): 30 mA. The maximum continuous DC current recommended for reliable operation.
• Peak Forward Current (IFP): 60 mA. This is permissible only under pulsed conditions with a duty cycle of 1/10 at 1 kHz.
• Power Dissipation (Pd): 93 mW. The maximum power the package can dissipate without exceeding the junction temperature limit.
• Junction Temperature (Tj): 115 °C. The maximum allowable temperature of the semiconductor junction.
• Operating Temperature (Topr): -40 °C to +85 °C. The ambient temperature range over which the device is specified to operate.
• Storage Temperature (Tstg): -40 °C to +90 °C.
• Electrostatic Discharge (ESD): Withstands 2000 V (Human Body Model), indicating moderate handling sensitivity.
• Soldering Temperature: The device can withstand reflow soldering with a peak temperature of 260°C for 10 seconds, or hand soldering at 350°C for 3 seconds per terminal.

2.2 Electro-Optical Characteristics

Key performance parameters are measured at Ta=25°C with a forward current (IF) of 20 mA, which is the standard test condition.

• Luminous Intensity (Iv): Ranges from a minimum of 2240 mcd to a maximum of 3550 mcd, with a typical value implied within this range. A tolerance of ±11% applies to the luminous intensity.
• Viewing Angle (2θ1/2): The full angle at which luminous intensity is half of the peak intensity is typically 120 degrees, indicating a wide viewing pattern suitable for diffuse illumination.
• Forward Voltage (VF): Ranges from 2.40 V to 3.60 V at 20 mA. The tolerance for forward voltage is specified as ±0.1V. This parameter is crucial for designing the current-limiting circuitry.
• Reverse Current (IR): Maximum of 10 μA when a reverse voltage of 5V is applied, indicating good diode characteristics.
• Chromaticity Coordinate Tolerance: The color point on the CIE chart has a tolerance of ±0.01, which is important for color consistency in applications requiring multiple LEDs.

3. Binning System Explanation

To ensure consistency in brightness and color, the LEDs are sorted into bins based on measured performance.

3.1 Luminous Intensity Binning

LEDs are categorized into two primary bins based on their luminous intensity measured at IF=20mA:

• Bin Code BB: Luminous intensity range from 2240 mcd to 2800 mcd.
• Bin Code CA: Luminous intensity range from 2800 mcd to 3550 mcd.

The ±11% tolerance applies within each bin. This binning allows designers to select LEDs appropriate for the required brightness level in their application.

3.2 Chromaticity Coordinate Binning

The white light color is defined by its coordinates on the CIE 1931 chromaticity diagram. The datasheet provides a detailed table of bin codes (e.g., SB, J5, J6, K5, K6, L5, L6, M5, M6) with corresponding minimum and maximum x and y coordinate values. For example, bin code J5 covers coordinates from (0.2800, 0.2566) to (0.2800, 0.2666). This precise binning is essential for applications where color uniformity across multiple LEDs is critical, such as in display backlighting or architectural lighting. The tolerance for these coordinates is ±0.01.

4. Performance Curve Analysis

The datasheet includes several characteristic curves that provide deeper insight into the LED's behavior under varying conditions.

4.1 Spectral Distribution

The typical spectral distribution curve shows the relative intensity of light emitted across different wavelengths. For a white LED, this typically shows a broad peak in the blue region (from the InGaN chip) and a broader secondary peak in the yellow-green region (from the phosphor conversion). The peak wavelength (λp) is a key parameter. The curve is compared to the standard eye response curve V(λ).

4.2 Radiation Pattern

The diagram of radiation characteristics (relative intensity vs. angle) visually represents the 120-degree viewing angle, showing how light intensity decreases from the center (0-degree axis) to the edges.

4.3 Forward Current vs. Forward Voltage

This curve illustrates the non-linear relationship between the current flowing through the LED and the voltage drop across it. It is essential for designing the driver circuit, as a small change in voltage can lead to a large change in current. The curve typically shows an exponential rise.

4.4 Chromaticity vs. Forward Current

This graph shows how the color coordinates (x, y) may shift with changes in the operating current. Understanding this relationship is important for applications where dimming or current modulation is used, as it can affect color consistency.

4.5 Relative Luminous Intensity vs. Forward Current

This curve demonstrates how light output increases with drive current. It is generally linear over a range but will saturate at higher currents. Operating beyond the linear region is inefficient and increases heat.

4.6 Maximum Permissible Forward Current vs. Temperature

This derating curve is critically important for reliability. It shows the maximum forward current the LED can handle as a function of the ambient (or case) temperature. As temperature increases, the maximum allowable current decreases to prevent overheating the junction beyond its 115°C limit. This graph must be consulted for any design operating in elevated temperature environments.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED comes in a standard 3014 package. The key dimensions (in mm, with a typical tolerance of ±0.1mm unless specified) include:

• Overall length: 3.0 mm
• Overall width: 1.4 mm
• Overall height: 0.8 mm
• Pad dimensions and spacing for PCB land pattern design.

The dimensioned drawing is essential for creating the correct PCB footprint to ensure proper soldering and alignment.

5.2 Polarity Identification

The top-view diagram typically indicates the cathode mark, which is essential for correct orientation during assembly. Incorrect polarity will prevent the LED from illuminating and may subject it to reverse voltage.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

The recommended Pb-free reflow soldering temperature profile is provided. Key phases include:

• Pre-heating: Ramp from ambient to 150-200°C at a maximum rate of 3°C/sec, held for 60-120 seconds.
• Reflow: Temperature above 217°C should be maintained for 60-150 seconds, with a peak temperature not exceeding 260°C held for a maximum of 10 seconds.
• Cooling: Cool down from above 255°C at a maximum rate of 6°C/sec.

Reflow soldering should not be performed more than two times on the same device.

6.2 Hand Soldering

If hand soldering is necessary, the iron tip temperature must be less than 350°C, and contact time per terminal must not exceed 3 seconds. A low-power iron (≤25W) is recommended, with an interval of at least 2 seconds between soldering each terminal to allow cooling.

6.3 Storage and Handling

• The LEDs are packaged in moisture-resistant bags. The bag should only be opened immediately prior to use.
• The recommended environment upon opening is <30°C and <60% Relative Humidity.
• If the Moisture Sensitivity Level (MSL) conditions are exceeded, or if the humidity indicator card shows excessive moisture, the components must be baked at 60°C ±5°C for 24 hours before use.
• Stress should not be applied to the LED body during heating or after soldering, and circuit boards should not be warped.

7. Packaging and Ordering Information

7.1 Reel and Tape Specifications

The LEDs are supplied on embossed carrier tape wound onto reels. Standard loaded quantities per reel are 250, 500, 1000, or 2000 pieces. Detailed dimensions for the carrier tape pocket, pitch, and reel are provided to ensure compatibility with automated pick-and-place equipment.

7.2 Label Explanation

The reel label contains key information: Customer's Product Number (CPN), Product Number (P/N), Packing Quantity (QTY), Luminous Intensity Rank (CAT), Dominant Wavelength/Hue Rank (HUE), Forward Voltage Rank (REF), and Lot Number (LOT No).

8. Application Recommendations

8.1 Typical Application Scenarios

• Status Indicators: Ideal for switches, symbols, and optical indicators in consumer electronics, appliances, and industrial control panels.
• Backlighting: Suitable for mobile phones, keypads, and illuminated advertising signs due to its thin profile and wide viewing angle.
• General Illumination: Can be used as a substitute for traditional indicator lamps in indoor and outdoor applications.
• Light Guide Coupling: The package design is well-suited for coupling light into edge-lit light guides for panel illumination.

8.2 Critical Design Considerations

• Current Limiting: An external current-limiting resistor is absolutely mandatory. The exponential I-V characteristic means a small voltage change causes a large current change, which can instantly destroy the LED ("burn out"). The resistor value must be calculated based on the supply voltage and the LED's forward voltage at the desired operating current.
• Thermal Management: Although power dissipation is low, proper PCB layout to dissipate heat is important, especially when operating at high ambient temperatures or near the maximum current. Consult the derating curve.
• ESD Protection: While rated for 2000V HBM, standard ESD precautions during handling and assembly should be observed.

9. Technical Comparison and Differentiation

Compared to traditional through-hole LEDs, this 3014 SMD LED offers significant advantages:

• Size and Density: The compact 3.0x1.4mm footprint allows for much higher mounting density on PCBs.
• Assembly Cost: Enables fully automated pick-and-place and reflow soldering, reducing assembly time and cost compared to manual insertion.
• Performance: Typically offers higher luminous efficacy and more consistent optical characteristics due to automated manufacturing and binning.
• Reliability: The solid-state construction and surface-mount design generally lead to higher shock and vibration resistance.

Within the SMD LED family, the 3014 package offers a balance between light output, size, and cost, positioning it between smaller packages like 0402/0603 (lower output) and larger packages like 2835/5050 (higher output).

10. Frequently Asked Questions (Based on Technical Parameters)

Q: What resistor value do I need for a 5V supply?
A: Using Ohm's Law: R = (Vsupply - Vf) / If. Assuming a typical Vf of 3.0V and desired If of 20mA: R = (5V - 3.0V) / 0.020A = 100 Ohms. Always use the maximum Vf from the datasheet (3.6V) for a conservative design to ensure current does not exceed limits: R_min = (5V - 3.6V) / 0.030A ≈ 47 Ohms. A value between 68-100 Ohms is common.

Q: Can I drive this LED with a 3.3V supply?
A: Yes, but carefully. The forward voltage range (2.4V-3.6V) means some LEDs may not light at 3.3V if their Vf is higher. Even if they do, the current will be poorly regulated without a driver circuit. A constant-current driver or a very low-value resistor is recommended for 3.3V operation.

Q: How do I interpret the luminous intensity bin codes BB and CA?
A> Bin BB contains LEDs with lower brightness (2240-2800 mcd), and Bin CA contains brighter LEDs (2800-3550 mcd). For uniform appearance in an array, specify and use LEDs from the same bin code.

Q: The datasheet mentions \"Colored Slightly green dotted resin.\" Does this affect the light color?
A: The yellowish/greenish tint of the resin is part of the color conversion system. The InGaN chip emits blue light, which excites phosphors within the resin to produce yellow light. The combination results in white light. The resin color itself is not the color of the emitted light.

11. Practical Design and Usage Examples

Example 1: Multi-LED Status Indicator Panel
A control panel requires 10 uniform white indicators. To ensure consistency, the designer should:
1. Specify all LEDs from the same luminous intensity bin (e.g., CA) and the same chromaticity bin (e.g., K5).
2. Use identical current-limiting resistors for each LED, calculated using the maximum Vf.
3. Layout the PCB to provide equal trace lengths and thermal relief to each LED pad to minimize variations.

Example 2: Backlighting a Small Display
Four LEDs are placed along the edge of a light guide to illuminate a LCD. Key steps:
1. Choose the LED placement and viewing angle (120° is suitable) to ensure even coupling into the guide.
2. Consider using a constant-current LED driver IC instead of individual resistors to ensure identical brightness and enable dimming via PWM.
3. Verify that the operating temperature inside the device enclosure does not require derating the forward current using the \"Max. Permissible Forward Current vs. Temperature\" curve.

12. Operational Principle

This is a solid-state light-emitting diode. When a forward voltage exceeding its characteristic forward voltage (Vf) is applied, electrons and holes recombine within the InGaN semiconductor material, releasing energy in the form of photons (light). The primary emission from the chip is in the blue spectrum. This blue light then strikes phosphor particles embedded in the encapsulating resin. The phosphors absorb the blue light and re-emit light across a broader spectrum, predominantly in the yellow region. The human eye perceives the mix of direct blue light and phosphor-converted yellow light as white. The inner reflector and white package help to direct more of this emitted light out of the top of the device, increasing overall luminous intensity.

13. Technology Trends

The evolution of SMD LEDs like the 3014 follows several clear industry trends:
Increased Efficiency: Ongoing improvements in semiconductor epitaxy and phosphor technology continue to raise luminous efficacy (lumens per watt), allowing brighter light or lower power consumption from the same package size.
Color Quality: Advancements in multi-phosphor blends and chip designs are improving Color Rendering Index (CRI) and allowing more precise tuning of white color temperature (CCT).
Miniaturization and Integration: While the 3014 remains popular, there is a trend towards even smaller packages with comparable output, as well as integrated LED modules that combine the LED, driver, and control circuitry into a single package.
Smart Lighting: The broader market is moving towards LEDs that are addressable and tunable (CCT and dimming), though this typically requires more complex packages than the basic indicator LED described here.
Reliability and Standardization: Continued adherence and development of standards for testing, binning, and reliability (like LM-80 for lumen maintenance) provide designers with more predictable long-term performance data.