SMD5050N Green LED Datasheet - Dimensions 5.0x5.0x1.6mm - Voltage 3.2V - Power 0.306W - English Technical Documentation

1. Product Overview

The SMD5050N series is a high-brightness, surface-mount LED designed for applications requiring reliable and efficient green illumination. This series is characterized by its compact 5.0mm x 5.0mm footprint and robust performance across a range of operating conditions. It is suitable for a variety of lighting applications including backlighting, decorative lighting, and indicator lights where consistent color and brightness are critical.

2. Technical Parameters and Specifications

2.1 Absolute Maximum Ratings (Ts=25°C)

The following table lists the maximum limits beyond which permanent damage to the device may occur. Operation at or near these values is not recommended.

• Forward Current (IF): 90 mA
• Forward Pulse Current (IFP): 120 mA (Pulse width ≤ 10ms, Duty cycle ≤ 1/10)
• Power Dissipation (PD): 306 mW
• Operating Temperature (Topr): -40°C to +80°C
• Storage Temperature (Tstg): -40°C to +80°C
• Junction Temperature (Tj): 125°C
• Soldering Temperature (Tsld): 200°C or 230°C for 10 seconds (Reflow soldering)

2.2 Electro-Optical Characteristics (Ts=25°C, IF=60mA)

Typical performance parameters under standard test conditions.

• Forward Voltage (VF): 3.2 V (Typical), 3.4 V (Maximum)
• Reverse Voltage (VR): 5 V
• Dominant Wavelength (λd): 525 nm (Typical)
• Reverse Current (IR): 10 µA (Maximum)
• Viewing Angle (2θ1/2): 120° (Typical)

3. Binning and Classification System

3.1 Luminous Flux Binning

The LEDs are sorted into bins based on their luminous flux output at a forward current of 60mA. This ensures color and brightness consistency within an application.

• B4: 6.0 - 6.5 lm
• B5: 6.5 - 7.0 lm
• B6: 7.0 - 7.5 lm
• B7: 7.5 - 8.0 lm
• B8: 8.0 - 8.5 lm
• B9: 8.5 - 9.0 lm
• C1: 9.0 - 10.0 lm
• C2: 10.0 - 11.0 lm
• C3: 11.0 - 12.0 lm
• C4: 12.0 - 13.0 lm
• C5: 13.0 - 14.0 lm

3.2 Dominant Wavelength Binning

To maintain precise color output, LEDs are also binned according to their dominant wavelength.

• G5: 519.0 - 522.5 nm
• G6: 522.5 - 526.0 nm
• G7: 526.0 - 530.0 nm

4. Performance Curves and Graphs

The datasheet includes several key performance graphs essential for design engineers.

4.1 Forward Voltage vs. Forward Current (IV Curve)

This graph illustrates the relationship between the applied forward voltage and the resulting forward current. It is crucial for designing the appropriate current-limiting circuitry to ensure stable operation and prevent thermal runaway.

4.2 Forward Current vs. Relative Luminous Flux

This curve shows how the light output scales with increasing drive current. It helps in optimizing the trade-off between brightness and efficiency/power consumption for a specific application.

4.3 Junction Temperature vs. Relative Spectral Power Distribution

This graph demonstrates the effect of junction temperature on the spectral output of the LED. Understanding this relationship is vital for applications where color stability over temperature is important.

4.4 Spectral Energy Distribution Curve

This curve provides a detailed view of the light emitted across the visible spectrum, showing the peak wavelength and spectral width, which defines the purity of the green color.

5. Mechanical and Packaging Information

5.1 Package Dimensions and Outline Drawing

The SMD5050N package has nominal dimensions of 5.0mm (L) x 5.0mm (W) x 1.6mm (H). Detailed mechanical drawings with tolerances (e.g., .X: ±0.10mm, .XX: ±0.05mm) are provided for PCB layout.

5.2 Recommended PCB Land Pattern and Stencil Design

To ensure reliable soldering and optimal thermal performance, specific pad layout and solder paste stencil aperture designs are recommended. Adhering to these guidelines helps prevent tombstoning and ensures proper solder joint formation.

6. Assembly, Handling, and Application Guidelines

6.1 Moisture Sensitivity and Baking Requirements

The SMD5050N series is moisture-sensitive (MSL classified per IPC/JEDEC J-STD-020C). If the original moisture barrier bag is opened and the components are exposed to ambient humidity, they must be baked before reflow soldering to prevent popcorn cracking or other moisture-induced failures.

• Baking Condition: 60°C for 24 hours.
• Post-Baking: Components should be soldered within 1 hour or stored in a dry environment (<20% RH).
• Storage (Unopened): Temperature: 5-30°C, Humidity: <85% RH.
• Storage (Opened): Use within 12 hours or store in a dry cabinet (<60% RH, preferably with desiccant or nitrogen).

6.2 Electrostatic Discharge (ESD) Protection

As semiconductor devices, these LEDs are susceptible to damage from electrostatic discharge.

• ESD Sources: Friction, induction, and conduction.
• Potential Damage: Increased leakage current (reduced brightness/lifetime) or catastrophic failure (dead LED).
• Protection Measures: Use grounded anti-static workstations, wrist straps, ionizers, and conductive flooring. Handle with ESD-safe tools and packaging.

6.3 Application Circuit Design

Proper circuit design is critical for longevity and performance.

• Drive Method: Constant current drivers are strongly recommended over constant voltage sources to ensure stable light output and protect the LED from current spikes.
• Current Limiting: Incorporate a series resistor in each LED string for additional current regulation and protection, especially when using constant voltage supplies.
• Polarity: Always verify polarity before connecting power to prevent reverse bias damage.
• Power Sequencing: Connect the LED load to the driver output first, then apply input power to the driver to avoid voltage transients.

6.4 Handling Precautions

Avoid direct handling of the LED lens with bare hands or metal tweezers.

• Hand Contact: Skin oils can contaminate the silicone lens, reducing light output. Excessive finger pressure can damage the wire bonds or die.
• Tweezer Contact: Metal tweezers can scratch the lens or chip if not used carefully. Use vacuum pick-up tools or dedicated plastic tweezers where possible.

7. Product Nomenclature and Ordering Information

The product model number follows a specific coding system that defines key attributes. The code structure is: T [Shape Code] [Chip Count] [Lens Code] [Color Code] - [Flux Bin] [Wavelength Bin].

• Shape Code (5A): Denotes the 5050N package outline.
• Chip Count: Indicates the number of LED chips within the package (e.g., 1, 2, 3).
• Lens Code (00/01): 00 for no secondary lens, 01 with lens.
• Color Code (G): Specifies Green emission.
• Flux Bin: A code (e.g., B4, C1) corresponding to the luminous flux range.
• Wavelength Bin: A code (e.g., G5, G6) corresponding to the dominant wavelength range.

8. Application Notes and Design Considerations

8.1 Thermal Management

While the package offers good thermal performance, effective heat sinking is essential for maintaining LED lifetime and color stability, especially when operating at high currents or in elevated ambient temperatures. Ensure the PCB has adequate thermal vias and copper area connected to the LED's thermal pad.

8.2 Optical Design

The wide 120-degree viewing angle makes this LED suitable for applications requiring broad illumination. For focused beams, secondary optics (reflectors or lenses) will be necessary. The silicone lens material should be considered when selecting compatible adhesives or encapsulants.

8.3 Reliability and Lifetime

LED lifetime is significantly influenced by operating conditions. Driving the LED below its maximum rated current and maintaining a low junction temperature will maximize operational lifespan. The specified storage and operating temperature ranges must be adhered to for reliable performance.

9. Frequently Asked Questions (FAQ)

9.1 What is the difference between the luminous flux bins?

The bins (B4 through C5) represent sorted groups based on measured light output. Using LEDs from the same bin within a product ensures uniform brightness. For critical applications, specify a tighter bin to minimize variation.

9.2 Is baking always required before soldering?

No. Baking is only required if the moisture-sensitive components have been exposed to humid environments after the original sealed bag is opened and before reflow soldering. Components stored correctly in dry conditions do not require baking.

9.3 Can I drive this LED with a 3.3V constant voltage source?

It is not recommended. The forward voltage has a tolerance and varies with temperature. A constant voltage source near the typical Vf (3.2V) could lead to excessive current and rapid failure. Always use a constant current driver or a constant voltage source with a series current-limiting resistor.

9.4 How do I interpret the wavelength bin codes (G5, G6, G7)?

These codes define the range of the LED's dominant wavelength. G5 LEDs emit light with a peak between 519nm and 522.5nm (a slightly bluer green), while G7 LEDs peak between 526nm and 530nm (a yellower green). Choose the bin that matches your target color point.