SMD5050N Red LED Datasheet - Size 5.0x5.0x1.6mm - Voltage 2.2V - Power 0.234W - English Technical Document

1. Product Overview

The SMD5050N series is a high-brightness, surface-mount LED designed for applications requiring reliable and efficient red light emission. This document provides a comprehensive technical overview of the T5A003RA model, detailing its specifications, performance characteristics, and proper handling procedures to ensure optimal performance and longevity in end-user applications.

2. Technical Parameter Deep Dive

2.1 Absolute Maximum Ratings (Ts=25°C)

The following parameters define the operational limits of the LED. Exceeding these values may cause permanent damage.

• Forward Current (IF): 90 mA (Continuous)
• Forward Pulse Current (IFP): 120 mA (Pulse Width ≤10ms, Duty Cycle ≤1/10)
• Power Dissipation (PD): 234 mW
• Operating Temperature (Topr): -40°C to +80°C
• Storage Temperature (Tstg): -40°C to +80°C
• Junction Temperature (Tj): 125°C
• Soldering Temperature (Tsld): Reflow soldering at 200°C or 230°C for 10 seconds maximum.

2.2 Electrical & Optical Characteristics (Ts=25°C)

These are the typical performance parameters measured under standard test conditions.

• Forward Voltage (VF): 2.2 V (Typical), 2.6 V (Maximum) at IF=60mA
• Reverse Voltage (VR): 5 V
• Dominant Wavelength (λd): 625 nm
• Reverse Current (IR): 10 μA (Maximum)
• Viewing Angle (2θ1/2): 120°

3. Binning System Explanation

3.1 Luminous Flux Binning (at 60mA)

The LEDs are sorted into bins based on their luminous flux output to ensure consistency in application brightness. The available bins for red light are:

• Code A5: Min 2.0 lm, Type 2.5 lm
• Code A6: Min 2.5 lm, Type 3.0 lm
• Code A7: Min 3.0 lm, Type 3.5 lm
• Code A8: Min 3.5 lm, Type 4.0 lm
• Code A9: Min 4.0 lm, Type 4.5 lm
• Code B1: Min 4.5 lm, Type 5.0 lm
• Code B2: Min 5.0 lm, Type 5.5 lm

3.2 Dominant Wavelength Binning

To control the precise shade of red, LEDs are binned by their dominant wavelength.

• Code R1: 620 nm to 625 nm
• Code R2: 625 nm to 630 nm

4. Performance Curve Analysis

The datasheet includes several key performance graphs essential for circuit design and thermal management. While specific curve data points are not provided in the text, the following graphs are standard for analysis:

• Forward Voltage vs. Forward Current (IV Curve): This graph shows the relationship between the voltage across the LED and the current flowing through it. It is crucial for selecting the appropriate current-limiting resistor or designing constant-current drivers.
• Forward Current vs. Relative Luminous Flux: This curve illustrates how the light output changes with increasing drive current. It helps determine the optimal operating point for balancing brightness and efficiency.
• Junction Temperature vs. Relative Spectral Power: This graph demonstrates how the LED's spectral output and overall light intensity can shift with changes in junction temperature, highlighting the importance of thermal management.
• Spectral Power Distribution: This curve shows the intensity of light emitted at each wavelength, defining the color characteristics of the LED.

5. Mechanical & Packaging Information

5.1 Package Dimensions

The SMD5050N LED has standard dimensions of 5.0mm x 5.0mm. The exact height and dimensional tolerances are specified in the mechanical drawing (.X: ±0.10mm, .XX: ±0.05mm).

5.2 Recommended Pad & Stencil Design

For reliable soldering, a specific pad layout and stencil aperture design are recommended. The provided diagrams ensure proper solder joint formation, component alignment, and thermal relief during the reflow process. Adhering to these footprints is critical for manufacturing yield and long-term reliability.

6. Soldering & Assembly Guidelines

6.1 Moisture Sensitivity & Baking

The SMD5050N package is moisture-sensitive (MSL classified per IPC/JEDEC J-STD-020C).

• Storage: Store unopened bags below 30°C and 85% RH. After opening, store below 30°C and 60% RH, preferably in a dry cabinet or sealed container with desiccant.
• Floor Life: Use within 12 hours after opening the moisture barrier bag.
• Baking: If the components have been exposed to ambient conditions beyond the floor life or if the desiccant indicator shows high humidity, baking is required. Bake at 60°C for 24 hours. Do not exceed 60°C. Reflow should occur within 1 hour after baking or the parts must be returned to dry storage.

6.2 ESD (Electrostatic Discharge) Protection

LEDs are semiconductor devices susceptible to damage from electrostatic discharge.

• Sources: ESD can be generated by friction, induction, or conduction.
• Damage: ESD can cause immediate failure (dead LED) or latent damage leading to reduced brightness, color shift (in white LEDs), and shortened lifespan.
• Precautions: Implement a full ESD control program: use grounded anti-static workstations, floor mats, wrist straps, and ionizers. Personnel should wear anti-static garments. Use conductive or dissipative packaging materials.

7. Application Design Considerations

7.1 Circuit Design

Proper drive is essential for LED performance and reliability.

• Drive Method: A constant current source is highly recommended for stable light output and longevity. If using a voltage source with a series resistor, ensure the resistor value is calculated based on the LED's maximum forward voltage and the desired current.
• Circuit Configuration: It is advisable to include a current-limiting resistor in each series string of LEDs for better stability and individual string protection, as opposed to a single resistor for a parallel array.
• Polarity: Always verify and respect the anode/cathode polarity when connecting the LED to the power source to prevent reverse bias damage.

7.2 Handling Precautions

Avoid direct handling of the LED lens with bare hands or metal tweezers.

• Hand Contact: Oils and salts from skin can contaminate the silicone lens, causing optical degradation and reduced light output. Physical pressure can damage the wire bonds or the chip itself.
• Tool Contact: Metal tweezers can scratch the lens or exert excessive point pressure. Use vacuum pick-up tools or dedicated, non-marring plastic tweezers whenever possible.

8. Model Numbering Rule

The product naming convention follows a structured code: T□□ □□ □ □ □ – □□□ □□. The key elements decoded from the document are:

• Color Code: R (Red), Y (Yellow), B (Blue), G (Green), U (Violet), A (Orange), I (IR), L (Warm White <3700K), C (Neutral White 3700-5000K), W (Cool White >5000K), F (Full Color).
• Chip Count: S (1 low-power chip), P (1 high-power chip), 2 (2 chips), 3 (3 chips), etc.
• Optics Code: 00 (No lens), 01 (With lens).
• Package Code: 5A (5050N), 32 (3528), 3B (3014), 3C (3030), 19 (Ceramic 3535), 15 (Ceramic 5050), 12 (Ceramic 9292).
• Luminous Flux Code & Color Temperature Code: Defined by specific alphanumeric bins (e.g., A5, R1).

9. Typical Application Scenarios

The SMD5050N red LED is suitable for a wide range of applications requiring vibrant red indication, signage, or illumination, including:

• Backlighting for indicators and displays.
• Architectural and decorative lighting.
• Automotive interior lighting (non-critical).
• Consumer electronics status indicators.
• Retail and advertising signage.

10. Reliability & Quality Assurance

While specific MTBF or lifetime L70/B50 data is not provided in the excerpt, the defined maximum ratings (junction temperature, current) and handling procedures (MSL, ESD) form the foundation for reliable operation. Adherence to the specified operating conditions and assembly guidelines is paramount to achieving the expected product lifetime. Proper thermal management to keep the junction temperature well below the 125°C maximum is especially critical for long-term lumen maintenance.

11. Technical Comparison & Differentiation

The SMD5050N format offers a balance between light output and package size. Compared to smaller packages like 3528 or 3014, the 5050 typically houses multiple chips or a larger single chip, allowing for higher luminous flux. The 120-degree viewing angle provides a wide, even illumination pattern suitable for many general lighting and signage applications. The inclusion of detailed moisture sensitivity and ESD handling guidelines indicates a product designed for modern, automated assembly processes where reliability is key.

12. Frequently Asked Questions (FAQ)

12.1 What is the recommended operating current?

The technical parameters are tested at 60mA, which is a common operating point. The absolute maximum continuous current is 90mA. For optimal balance of brightness, efficiency, and lifetime, operating between 60mA and 80mA is typical, but always refer to the luminous flux vs. current curve and ensure proper heat sinking.

12.2 Why is baking necessary before soldering?

The plastic package can absorb moisture from the air. During the high-temperature reflow soldering process, this trapped moisture can rapidly expand, causing internal delamination or cracking (\"popcorning\"), which leads to immediate or latent failure. Baking removes this absorbed moisture.

12.3 Can I drive this LED directly with a 3.3V or 5V supply?

Not without a current-limiting mechanism. The typical forward voltage is 2.2V. Connecting it directly to a 3.3V source would cause excessive current to flow, potentially exceeding the maximum rating and destroying the LED. You must use either a constant-current driver or a series resistor to limit the current to the desired value.

13. Design-in Case Study

Scenario: Designing a backlight unit for a small informational display requiring uniform red illumination across a 100mm x 50mm area.

Implementation: An array of SMD5050N LEDs (e.g., bin B1 for consistent brightness) is planned on a metal-core PCB (MCPCB) for thermal management. A constant-current driver is selected to supply 70mA per LED string. The LEDs are arranged in several parallel strings, each with its own series resistor as per the recommended circuit design. The PCB layout follows the recommended pad footprint. Prior to assembly, the LEDs, stored per MSL guidelines, are baked because the factory floor humidity exceeded 60% RH. During assembly, operators use ESD wrist straps and vacuum pens for placement. Post-reflow inspection confirms proper solder joint formation and no visible damage.

14. Operational Principle

Light Emitting Diodes (LEDs) are semiconductor devices that emit light through electroluminescence. When a forward voltage is applied across the p-n junction, electrons from the n-type region recombine with holes from the p-type region. This recombination process releases energy in the form of photons (light). The specific wavelength (color) of the emitted light is determined by the energy bandgap of the semiconductor materials used in the LED chip. For this red LED, materials like Aluminum Gallium Arsenide (AlGaAs) or similar compounds are typically used to produce light in the 620-630nm range.

15. Technology Trends

The general trend in LED technology continues towards higher efficacy (more lumens per watt), improved color rendering, and greater reliability at higher power densities. For package types like the 5050, advancements include the use of more robust and thermally conductive package materials, advanced phosphor systems for white LEDs, and designs that minimize optical losses. Furthermore, integration with intelligent drivers for dimming and color control is becoming more common. The emphasis on detailed handling procedures (MSL, ESD) in datasheets reflects the industry's focus on achieving high yield and reliability in automated, high-volume manufacturing environments.