SMD5050 White LED Datasheet - Dimensions 5.0x5.0x1.6mm - Voltage 3.2V - Power 0.306W - Technical Documentation

1. Product Overview

The SMD5050 series is a high-brightness, surface-mount white LED designed for general lighting applications. This series offers a range of color temperatures from warm white to cool white, with options for different color rendering indices (CRI). The package features a compact 5.0mm x 5.0mm footprint, making it suitable for space-constrained designs requiring uniform and efficient illumination.

1.1 Core Features and Target Applications

The primary advantages of the SMD5050 LED include its high luminous flux output, wide viewing angle of 120 degrees, and robust performance across a specified temperature range. It is engineered for reliability in various lighting fixtures, including architectural lighting, decorative lighting, backlighting for displays, and signage. The product's design facilitates efficient thermal management and ease of assembly in automated surface-mount technology (SMT) processes.

2. Technical Parameter Analysis

This section provides a detailed, objective interpretation of the key electrical, optical, and thermal parameters specified for the SMD5050 LED.

2.1 Absolute Maximum Ratings

The following parameters define the limits beyond which permanent damage to the LED may occur. Operation under these conditions is not guaranteed.

• Forward Current (IF): 90 mA (Continuous)
• Forward Pulse Current (IFP): 120 mA (Pulse width ≤10ms, Duty cycle ≤1/10)
• Power Dissipation (PD): 306 mW
• Operating Temperature (Topr): -40°C to +80°C
• Storage Temperature (Tstg): -40°C to +80°C
• Junction Temperature (Tj): 125°C
• Soldering Temperature (Tsld): 200°C or 230°C for 10 seconds (Reflow soldering)

2.2 Typical Electrical and Optical Characteristics

Measured at a standard test condition of T_s = 25°C and I_F = 60mA.

• Forward Voltage (V_F): Typical 3.2V, Maximum 3.4V (Tolerance: ±0.08V)
• Reverse Voltage (V_R): 5V
• Reverse Current (I_R): Maximum 10 µA
• Viewing Angle (2θ_1/2): 120°

3. Binning System Explanation

The SMD5050 series employs a comprehensive binning system to ensure color and brightness consistency, which is critical for lighting applications.

3.1 Color Temperature (CCT) Binning

The LEDs are classified into standard Correlated Color Temperature (CCT) bins, each associated with specific chromaticity regions on the CIE diagram. The standard ordering bins are:

• 2700K (Regions: 8A, 8B, 8C, 8D)
• 3000K (Regions: 7A, 7B, 7C, 7D)
• 3500K (Regions: 6A, 6B, 6C, 6D)
• 4000K (Regions: 5A, 5B, 5C, 5D)
• 4500K (Regions: 4A, 4B, 4C, 4D, 4R, 4S, 4T, 4U)
• 5000K (Regions: 3A, 3B, 3C, 3D, 3R, 3S, 3T, 3U)
• 5700K (Regions: 2A, 2B, 2C, 2D, 2R, 2S, 2T, 2U)
• 6500K (Regions: 1A, 1B, 1C, 1D, 1R, 1S, 1T, 1U)
• 8000K (Regions: 0A, 0B, 0C, 0D, 0R, 0S, 0T, 0U)

Note: The product ordering specifies the minimum luminous flux and the exact chromaticity region, not a maximum flux value.

3.2 Luminous Flux Binning

Luminous flux is binned according to color temperature and Color Rendering Index (CRI). The following table outlines the standard flux bins at I_F=60mA. Tolerances are ±7% for luminous flux and ±2 for CRI.

• 70 CRI, Warm White (2700-3700K): Code 1E (18-20 lm), 1F (20-22 lm)
• 70 CRI, Neutral White (3700-5000K): Code 1E (18-20 lm), 1F (20-22 lm), 1G (22-24 lm)
• 70 CRI, Cool White (5000-10000K): Code 1E (18-20 lm), 1F (20-22 lm), 1G (22-24 lm), 1H (24-26 lm)
• 80-85 CRI, Warm White (2700-3700K): Code 1D (16-18 lm), 1E (18-20 lm)
• 80-85 CRI, Neutral White (3700-5300K): Code 1D (16-18 lm), 1E (18-20 lm), 1F (20-22 lm)
• 80-85 CRI, Cool White (5300-10000K): Code 1E (18-20 lm), 1F (20-22 lm)
• 90-93 CRI, Warm White (2700-3700K): Code 1C (14-16 lm), 1D (16-18 lm)

4. Performance Curve Analysis

Understanding the relationship between electrical drive, optical output, and temperature is essential for optimal circuit design and thermal management.

4.1 Forward Current vs. Forward Voltage (I-V Curve)

The I-V curve is characteristic of a semiconductor diode. For the SMD5050, the typical forward voltage is 3.2V at 60mA. Designers must ensure the current-limiting circuit (e.g., constant current driver or resistor) is designed to operate within the specified voltage range to maintain stable light output and prevent excessive power dissipation.

4.2 Forward Current vs. Relative Luminous Flux

This curve shows that luminous output increases with forward current but not linearly. Operating significantly above the test current (60mA) may lead to reduced efficiency (lumens per watt) and accelerated degradation due to increased junction temperature. The maximum continuous current of 90mA should be considered the upper design limit.

4.3 Junction Temperature vs. Relative Spectral Power Distribution

As the LED junction temperature rises, the spectral output can shift. For white LEDs, this often manifests as a change in color temperature and a potential decrease in luminous flux. Effective heat sinking is crucial to maintain stable color and brightness over the product's lifetime.

4.4 Relative Spectral Power Distribution

The spectral graph illustrates the emission characteristics for different CCT ranges (e.g., 2600-3700K, 3700-5000K, 5000-10000K). Warm white LEDs have more energy in the longer (red/yellow) wavelengths, while cool white LEDs have a peak in the blue region, complemented by phosphor-converted yellow light. This information is vital for applications with specific color requirements.

5. Mechanical and Package Information

5.1 Package Dimensions and Outline Drawing

The SMD5050 package has nominal dimensions of 5.0mm (L) x 5.0mm (W) x 1.6mm (H). Detailed mechanical drawings specify critical dimensions, including lens size, lead frame placement, and overall tolerances (e.g., ±0.10mm for .X dimensions, ±0.05mm for .XX dimensions).

5.2 Pad Layout and Stencil Design

The datasheet provides recommended pad layout (footprint) and solder paste stencil designs to ensure reliable solder joint formation during reflow. Adhering to these recommendations is essential for proper alignment, thermal transfer, and mechanical strength. The pad design typically includes six pads (for a 3-chip configuration) with specific dimensions to facilitate soldering and heat dissipation.

6. Soldering and Assembly Guidelines

6.1 Moisture Sensitivity and Baking

The SMD5050 LED is moisture-sensitive (MSL classified per IPC/JEDEC J-STD-020C).

• Storage: Unopened bags should be stored below 30°C and 85% RH. After opening, store below 30°C and 60% RH, preferably in a dry cabinet or sealed container with desiccant.
• Floor Life: Use within 12 hours after opening the moisture barrier bag.
• Baking Requirement: If the device is exposed beyond the floor life or if the humidity indicator card shows excessive moisture, baking is required before reflow.
• Baking Method: Bake at 60°C for 24 hours. Do not exceed 60°C. Reflow should occur within 1 hour after baking, or the parts must be returned to a dry storage environment (<20% RH).

6.2 Reflow Soldering Profile

The LED can withstand a peak reflow temperature of 200°C or 230°C for a maximum of 10 seconds. It is critical to follow a standard, controlled reflow profile for lead-free solders, ensuring preheat, soak, reflow, and cooling rates are within acceptable limits to prevent thermal shock or damage to the epoxy lens and internal die.

7. Electrostatic Discharge (ESD) Protection

LEDs are semiconductor devices susceptible to ESD damage, particularly white, green, blue, and purple types.

• ESD Generation: Can occur through friction, induction, or conduction.
• Potential Damage: ESD can cause latent defects (increased leakage current, reduced brightness/color shift) or catastrophic failure (complete non-operation).
• Precautions: Implement standard ESD control measures: use grounded workstations, wrist straps, conductive floor mats, and anti-static packaging. Handle LEDs only in ESD-protected areas.

8. Model Numbering Rule

The product code follows a specific structure to denote key attributes. The general format is: T□□ □□ □ □ □ – □□□ □□. The breakdown includes codes for:

• Package Outline: e.g., '5A' for 5050N.
• Chip Count: e.g., '3' for a 3-chip design.
• Optics Code: e.g., '00' for no lens, '01' for with lens.
• Color Code: e.g., 'L' for Warm White (<3700K), 'C' for Neutral White (3700-5000K), 'W' for Cool White (>5000K).
• Internal Code: Manufacturer's internal reference.
• CCT Code: Specifies the color temperature bin.
• Luminous Flux Code: Specifies the flux bin (e.g., 1E, 1F).

9. Application Suggestions and Design Considerations

9.1 Typical Application Scenarios

• Architectural and Decorative Lighting: Cove lighting, accent lighting, and linear strips where high brightness and uniform light distribution are needed.
• Backlighting: Edge-lit or direct-lit panels for signage, displays, and control panels.
• General Illumination: Integrated into modules for downlights, panel lights, and other luminaires, often in arrays.

9.2 Critical Design Considerations

• Thermal Management: The maximum junction temperature is 125°C. Proper PCB design with adequate thermal vias and, if necessary, an external heatsink is mandatory to maintain T_j within safe limits, especially when driving at higher currents or in high ambient temperatures. This ensures long-term reliability and stable light output.
• Current Drive:** Always use a constant current driver or a current-limiting resistor. Driving with a constant voltage source is not recommended as it can lead to thermal runaway. The driver should be designed to accommodate the forward voltage variation (tolerance).
• Optical Design: The 120-degree viewing angle provides wide illumination. For focused beams, secondary optics (lenses or reflectors) designed for the 5050 footprint may be required.
• Binning for Consistency: For applications requiring uniform color and brightness (e.g., multi-LED arrays), specify tight binning for both CCT and luminous flux from the supplier.

10. Frequently Asked Questions (Based on Technical Parameters)

10.1 What is the difference between the typical and maximum forward voltage?

The typical forward voltage (3.2V) is the expected value under standard test conditions. The maximum (3.4V) is the upper limit for the product bin. Your driver circuit must be able to provide sufficient voltage to accommodate LEDs at the maximum V_F to ensure they turn on and operate correctly.

10.2 Can I drive this LED at 90mA continuously?

While 90mA is the absolute maximum continuous current, operating at this level will generate significant heat and likely reduce the LED's lifespan due to elevated junction temperature. For optimal reliability and efficiency, it is advisable to design for a lower drive current, such as the 60mA test condition or a value determined by your thermal management capabilities.

10.3 Why is baking necessary before soldering?

The plastic package can absorb moisture from the atmosphere. During the high-temperature reflow soldering process, this trapped moisture can rapidly expand, causing internal delamination, cracking, or "popcorning," which leads to immediate or latent failure. Baking removes this absorbed moisture.

10.4 How do I interpret the luminous flux bin code (e.g., 1F)?

The flux bin code (like 1F) corresponds to a specific range of luminous output measured in lumens at 60mA. For example, code 1F for a 70-CRI cool white LED guarantees a minimum of 20 lumens and a typical maximum of 22 lumens, with a ±7% tolerance on the measurement. You select the bin based on the brightness requirement for your application.