SMD5050 White LED Datasheet - Dimensions 5.0x5.0x1.6mm - Voltage 3.2V - Power 0.306W - Technical Documentation

1. Product Overview

The SMD5050 series is a high-brightness, surface-mount LED designed for general lighting applications. This series offers white light in various correlated color temperatures (CCT), including Warm White, Neutral White, and Cool White, with options for different Color Rendering Index (CRI) values. The package features a compact 5.0mm x 5.0mm footprint, making it suitable for space-constrained designs requiring uniform and efficient illumination.

The core advantage of this series lies in its standardized binning system for luminous flux and chromaticity, ensuring color consistency in production runs. It is engineered for reliability under standard SMT assembly processes and is targeted at applications such as LED strips, backlighting modules, decorative lighting, and architectural accent lighting.

2. Technical Parameter Deep Dive

2.1 Absolute Maximum Ratings

The following parameters define the limits beyond which permanent damage to the LED may occur. Operation under these conditions is not guaranteed.

• Forward Current (IF): 90 mA (Maximum continuous current)
• Forward Pulse Current (IFP): 120 mA (Pulse width ≤10ms, Duty cycle ≤1/10)
• Power Dissipation (PD): 306 mW
• Operating Temperature (Topr): -40°C to +80°C
• Storage Temperature (Tstg): -40°C to +80°C
• Junction Temperature (Tj): 125°C
• Soldering Temperature (Tsld): Reflow soldering at 200°C or 230°C for a maximum of 10 seconds.

2.2 Electrical & Optical Characteristics

These parameters are measured at a standard test condition of T_s=25°C and represent typical performance.

• Forward Voltage (V_F): 3.2V (Typical), 3.4V (Maximum) at I_F=60mA.
• Reverse Voltage (V_R): 5V
• Reverse Current (I_R): 10 µA (Maximum)
• Viewing Angle (2θ_1/2): 120° (Typical)

3. Binning System Explanation

3.1 Correlated Color Temperature (CCT) Binning

The LEDs are classified into specific chromaticity regions (bins) based on their target CCT. This ensures color uniformity when multiple LEDs are used together. The standard ordering bins are:

• 2700K: Bins 8A, 8B, 8C, 8D
• 3000K: Bins 7A, 7B, 7C, 7D
• 3500K: Bins 6A, 6B, 6C, 6D
• 4000K: Bins 5A, 5B, 5C, 5D
• 4500K: Bins 4A, 4B, 4C, 4D, 4R, 4S, 4T, 4U
• 5000K: Bins 3A, 3B, 3C, 3D, 3R, 3S, 3T, 3U
• 5700K: Bins 2A, 2B, 2C, 2D, 2R, 2S, 2T, 2U
• 6500K: Bins 1A, 1B, 1C, 1D, 1R, 1S, 1T, 1U
• 8000K: Bins 0A, 0B, 0C, 0D, 0R, 0S, 0T, 0U

Note: The luminous flux for 5050N series products is specified with a minimum value; the actual shipped flux may be higher while still adhering to the ordered CCT bin.

3.2 Luminous Flux Binning

Flux is categorized by codes (e.g., 1E, 1F, 1G) representing minimum and typical output ranges at 60mA. The bins vary by CCT and CRI.

• 70 CRI White (Warm, Neutral, Cool): Codes range from 1E (18-20 lm min) to 1H (24-26 lm min for Cool White).
• 85 CRI White: Codes range from 1D (16-18 lm min) to 1F (20-22 lm min).
• 93 CRI Warm White: Codes 1C (14-16 lm min) and 1D (16-18 lm min).

Tolerances: Luminous Flux (±7%), Forward Voltage (±0.08V), CRI (±2), Chromaticity Coordinates (±0.005).

4. Performance Curve Analysis

4.1 Forward Current vs. Forward Voltage (I-V Curve)

The I-V characteristic is typical of a diode. The forward voltage increases logarithmically with current. Operating at the recommended 60mA ensures optimal efficiency and longevity, staying well within the maximum rating.

4.2 Forward Current vs. Relative Luminous Flux

Luminous output is approximately linear with current in the normal operating range. Driving the LED above the recommended current leads to diminishing returns in light output while significantly increasing heat and accelerating lumen depreciation.

4.3 Spectral Power Distribution & Junction Temperature Effects

The relative spectral energy distribution curves show the emission peaks for different CCT ranges (2600-3700K, 3700-5000K, 5000-10000K). The spectrum shifts slightly with increasing junction temperature, which can cause a measurable change in chromaticity coordinates and CCT. Proper thermal management is crucial to maintain stable color output.

5. Mechanical & Package Information

5.1 Package Dimensions

The SMD5050 package has nominal dimensions of 5.0mm (L) x 5.0mm (W) x 1.6mm (H). Detailed mechanical drawings specify tolerances: .X dimensions: ±0.10mm, .XX dimensions: ±0.05mm.

5.2 Pad Layout & Stencil Design

The datasheet provides recommended land pattern (footprint) and solder stencil designs to ensure reliable solder joint formation during reflow. Adhering to these layouts is critical for proper alignment, thermal relief, and mechanical stability.

6. Soldering & Assembly Guidelines

6.1 Moisture Sensitivity & Baking

The SMD5050 LED is moisture-sensitive (MSL classification per IPC/JEDEC J-STD-020C).

• Storage: Store unopened bags at <30°C/<85% RH. After opening, store at <30°C/<60% RH in a dry cabinet or sealed container with desiccant.
• Floor Life: Use within 12 hours of bag opening.
• Baking Required if: Bag has been opened, floor life exceeded, or humidity indicator card shows exposure. Do not bake LEDs already soldered to boards.
• Baking Procedure: Bake at 60°C for 24 hours on the original reel. Reflow within 1 hour after baking or return to dry storage (<20% RH). Do not exceed 60°C.

6.2 Reflow Soldering Profile

Use a standard lead-free reflow profile. Peak temperature must not exceed 230°C, and time above 200°C must be limited to 10 seconds maximum to prevent package damage or degradation of the internal materials.

7. Electrostatic Discharge (ESD) Protection

LEDs are semiconductor devices susceptible to ESD damage, particularly white, green, blue, and purple types.

• ESD Generation: Can occur via friction, induction, or conduction.
• Potential Damage: Latent damage (increased leakage current, reduced brightness/color shift, shorter lifespan) or catastrophic failure (complete non-operation).
• Precautions: Implement standard ESD control measures: use grounded workstations, wrist straps, conductive floor mats, ionizers, and ESD-safe packaging and handling materials.

8. Application Suggestions & Design Considerations

8.1 Typical Application Scenarios

• LED Strips and Tape Lights: High density and good viewing angle enable even linear illumination.
• Backlighting: For signage, displays, and panels requiring uniform white light.
• Decorative & Architectural Lighting: Accent lighting, coves, and contour lighting.
• General Purpose Indicator/Illumination: Where a bright, compact surface-mount source is needed.

8.2 Design Considerations

• Current Limiting: Always use a constant current driver or appropriate current-limiting resistor. Do not connect directly to a voltage source.
• Thermal Management: Design the PCB with adequate thermal relief and copper area to dissipate heat. High junction temperatures reduce light output, shift color, and shorten lifespan.
• Optical Design: The 120° viewing angle provides wide illumination. Consider secondary optics (lenses, diffusers) if beam shaping is required.
• Binning for Color Consistency: For multi-LED applications, specify tight CCT and flux bins from the supplier to avoid visible color or brightness mismatches.

9. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I drive this LED at its maximum current of 90mA for higher brightness?
A: It is not recommended for continuous operation. The recommended operating current is 60mA. Operating at 90mA will generate significantly more heat, potentially exceeding the maximum junction temperature, leading to rapid lumen depreciation and reduced reliability. Always design for the recommended conditions.

Q: What happens if I don't bake the LEDs after the bag has been open for more than 12 hours?
A: Moisture absorbed into the plastic package can rapidly expand during reflow soldering, causing internal delamination, wire bond damage, or package cracking (\"popcorning\"). This often results in immediate failure or latent defects that cause premature failure in the field.

Q: How critical is the soldering temperature profile?
A: Very critical. Exceeding 230°C or the time-at-temperature limits can damage the silicone lens, phosphor, die attach, or wire bonds. Always follow the recommended reflow profile.

Q: The luminous flux has a ±7% tolerance. How does this affect my design?
A: This variation is normal in LED manufacturing. For applications requiring uniform brightness, it's advisable to use LEDs from the same production batch and specify a narrow flux bin. The driver circuit should be designed to accommodate the typical forward voltage range as well.

10. Operating Principle & Technology Trends

10.1 Basic Operating Principle

A white SMD LED typically uses a blue indium gallium nitride (InGaN) semiconductor chip. Part of the blue light emitted by this chip is converted to longer wavelengths (yellow, red) by a phosphor layer coating the chip. The combination of the remaining blue light and the phosphor-converted light results in the perception of white light. The exact blend of phosphors determines the Correlated Color Temperature (CCT) and Color Rendering Index (CRI).

10.2 Industry Trends

The general trend in mid-power SMD LEDs like the 5050 is towards higher efficacy (more lumens per watt), improved color rendering (higher CRI with R9 values), and better color consistency (tighter binning). There is also a focus on enhancing reliability and longevity under higher drive currents and operating temperatures. Furthermore, phosphor technology continues to advance, enabling more saturated colors and a wider gamut for display applications, as well as more spectrally tunable white light for human-centric lighting.