1. Product Overview
The 6N138 and 6N139 are high-performance, low-input-current photocouplers featuring a split Darlington phototransistor output stage. These devices are designed to provide a very high current transfer ratio (CTR), enabling reliable signal transmission with minimal input drive current. They are housed in a standard 8-pin Dual In-line Package (DIP), with options for wide lead spacing and surface-mount configurations. The primary function is to provide electrical isolation between input and output circuits, protecting sensitive logic from voltage spikes and ground loops.
1.1 Core Advantages and Target Market
The key advantage of these photocouplers is their exceptionally high typical CTR of 2000%, which allows for direct interfacing with low-current logic signals without requiring additional amplification. They are certified by major international safety agencies (UL, cUL, VDE, SEMKO, NEMKO, DEMKO, FIMKO) and offer a high isolation voltage of 5000 Vrms. These features make them ideal for industrial, telecommunications, and computing applications where noise immunity, safety isolation, and signal integrity are critical. The target markets include industrial automation, power supply feedback loops, digital interface isolation, and communication line receivers.
2. Technical Parameter Deep Dive
This section provides an objective interpretation of the key electrical and optical parameters specified in the datasheet.
2.1 Absolute Maximum Ratings
These ratings define the stress limits beyond which permanent damage may occur. The input infrared LED has a maximum continuous forward current (IF) of 20 mA and can withstand a 1 A peak transient current for very short pulses (<1 µs). The output transistor's maximum collector current (IO) is 60 mA, and its power dissipation (PO) is limited to 100 mW. The device can operate in an ambient temperature range from -40°C to +85°C. The 5000 Vrms isolation voltage is a key safety parameter, tested with all input pins shorted together and all output pins shorted together.
2.2 Electrical Characteristics
The electrical characteristics are guaranteed over the commercial temperature range of 0°C to 70°C. For the input LED, the typical forward voltage (VF) is 1.3V at IF = 1.6 mA. The output section parameters differ slightly between the 6N138 and 6N139. The 6N139 typically offers a lower logic high output current (IOH) leakage of 0.01 µA compared to the 6N138's 100 µA under the same condition (IF=0mA, VCC=18V). The supply current in the logic low state (ICCL) is typically 0.6 mA for both when the LED is driven with 1.6 mA.
2.3 Transfer Characteristics
The Current Transfer Ratio (CTR) is the most critical parameter, defined as (IC / IF) * 100%. The 6N139 has a minimum CTR of 400% at IF=0.5mA and 500% at IF=1.6mA. The 6N138 has a minimum CTR of 300% at IF=1.6mA. The typical value for both is 2000-2500%, indicating high sensitivity. The logic low output voltage (VOL) is specified under various load conditions, with a maximum of 0.4V, ensuring compatibility with standard TTL and CMOS logic levels.
2.4 Switching Characteristics
Switching speed is dependent on the input drive current and load resistance. Propagation delay times (tPLH, tPHL) are provided for specific test conditions. For example, the 6N139 with IF=0.5mA and RL=4.7kΩ has a typical tPHL of 5 µs and tPLH of 16 µs. Increasing IF to 12mA with RL=270Ω drastically improves speed to 0.2 µs and 1.7 µs, respectively. The 6N138 is generally slower under its specified test condition (IF=1.6mA, RL=2.2kΩ). Common Mode Transient Immunity (CMTI) is specified at a minimum of 1000 V/µs for both logic high and low states, indicating good noise rejection against fast voltage transients across the isolation barrier.
3. Mechanical and Package Information
The devices are provided in a standard 8-pin DIP package. The pin configuration is as follows: Pin 1: No Connection, Pin 2: Anode, Pin 3: Cathode, Pin 4: No Connection, Pin 5: Ground (Gnd), Pin 6: Output (Vout), Pin 7: Base (VB), Pin 8: Supply Voltage (VCC). The base pin (7) provides access to the phototransistor's base, which can be used to connect a speed-up resistor or capacitor to trade off bandwidth for stability. Package options include standard DIP, wide-lead bend (0.4-inch spacing), and surface-mount lead forms (S and low-profile S1).
4. Soldering and Assembly Guidelines
The absolute maximum rating for soldering temperature is 260°C for 10 seconds. This is typical for wave or reflow soldering processes. Standard precautions for handling electrostatic discharge (ESD)-sensitive devices should be observed. The devices should be stored in conditions within the specified storage temperature range of -55°C to +125°C.
5. Packaging and Ordering Information
The part number follows the format: 6N13XY(Z)-V. 'X' is the part number (8 for 6N138, 9 for 6N139). 'Y' indicates the lead form option: none for standard DIP (45 units/tube), 'M' for wide lead bend (45 units/tube), 'S' for surface mount, 'S1' for low-profile surface mount. 'Z' specifies tape and reel option for SMD parts: 'TA' or 'TB' (1000 units/reel). 'V' is an optional suffix for VDE approval. Users must select the correct combination based on assembly requirements.
6. Application Suggestions
6.1 Typical Application Scenarios
The datasheet lists several key applications: Digital logic ground isolation, RS-232C line receivers, low input current line receivers, microprocessor bus isolation, and current loop receivers. Their high CTR makes them excellent for interfacing microcontroller GPIO pins directly, isolating sensor signals in noisy environments, or providing galvanic isolation in serial communication lines like RS-232 or RS-485.
6.2 Design Considerations
1. Input Current Limiting: An external series resistor must be used to limit the LED forward current (IF) to a value within the absolute maximum and desired operating range. The required resistor value is (Vdrive - VF) / IF. 2. Output Loading: The output transistor acts as a current sink. The load resistor (connected between VCC and pin 6) should be chosen to set the desired output voltage swing and switching speed. A smaller resistor increases speed but also increases power consumption. 3. Speed vs. Stability: Connecting a resistor (typically 10kΩ to 1MΩ) from the base pin (7) to ground can improve stability and noise immunity but will reduce the CTR and slow down the switching speed. A capacitor can be added in parallel for further filtering. 4. Power Supply Decoupling: Good practice involves placing a 0.1 µF ceramic capacitor close to the VCC pin (8) to ground to suppress noise.
7. Technical Comparison and Differentiation
The primary differentiation of the 6N138/6N139 family lies in its split Darlington configuration and very high CTR. Compared to standard single-transistor photocouplers (e.g., 4N25 series), these devices offer significantly higher sensitivity, allowing them to be driven directly by low-current CMOS logic. Compared to newer digital isolators, they offer a simpler, analog solution that is highly cost-effective for applications requiring basic isolation without the need for ultra-high speed or complex protocols. The availability of a base pin provides designers with a unique degree of freedom to tailor the frequency response and noise immunity.
8. Frequently Asked Questions (Based on Technical Parameters)
Q1: What is the main difference between the 6N138 and 6N139?
A1: The key differences are in their electrical specifications. The 6N139 generally offers better performance: a higher minimum CTR (500% vs. 300% at IF=1.6mA), lower output leakage current in the off state, and slightly different switching characteristics under test. The 6N138 is the lower-specification variant.
Q2: How do I choose the value for the input current limiting resistor?
A2: Determine the required forward current (IF) from your application (e.g., 1.6 mA for a good balance of speed and CTR). Measure or use the typical VF from the datasheet (1.3V). If your drive voltage is 5V, the resistor R = (5V - 1.3V) / 0.0016A = 2312.5Ω. A standard 2.2kΩ resistor would be a suitable choice.
Q3: Why is my photocoupler switching slowly?
A3: Switching speed is heavily influenced by IF and the load resistor RL. To increase speed, you can: a) Increase the LED drive current (IF). b) Decrease the value of the load resistor (RL) on the output collector. c) Optionally, use the base pin (7) with a small resistor to ground to remove stored charge, but this will reduce CTR.
Q4: What does \"Common Mode Transient Immunity\" mean?
A4: It measures the device's ability to ignore fast voltage spikes that appear equally on both the input and output sides of the isolation barrier. A high CMTI (like 1000 V/µs) means the output will not falsely toggle due to such noise, which is crucial in noisy power environments.
9. Practical Design Case
Case: Isolating a Microcontroller UART Signal for RS-232 Communication.
A microcontroller's 3.3V UART TX line needs to be isolated before connecting to an RS-232 transceiver chip on a different ground plane. A 6N139 can be used. The microcontroller pin drives the LED through a 1kΩ resistor (IF ~ (3.3V-1.3V)/1k = 2mA). The output collector (pin 6) is connected to the RS-232 chip's input pin via a 4.7kΩ pull-up resistor to the RS-232 chip's VCC (5V). The base pin (7) is left open or connected to ground via a large resistor (e.g., 1MΩ) for stability. This simple circuit provides robust isolation, protects the microcontroller from ground shifts or surges on the RS-232 line, and maintains signal integrity.
10. Principle of Operation
The device operates on the principle of optoelectronic coupling. An electrical current applied to the input pins (Anode and Cathode) causes the infrared Light Emitting Diode (LED) to emit light. This light travels across a transparent isolation gap and strikes the photosensitive base region of a split Darlington pair of silicon phototransistors. The incident light generates a base current, which is amplified by the two transistor stages, resulting in a much larger collector current at the output. The \"split\" configuration typically means the base of the first transistor is accessible (pin 7), allowing external biasing. The complete electrical isolation between the input LED and the output transistors is provided by the molded plastic package, which has high dielectric strength.
11. Industry Trends and Context
Photocouplers like the 6N138/139 represent a mature and reliable isolation technology. Current trends in signal isolation include the growth of digital isolators based on CMOS and RF or capacitive coupling, which offer superior speed, power efficiency, and integration (multiple channels in one package). However, photocouplers maintain strong advantages in certain areas: they offer very high working voltage isolation (several kV), excellent common-mode transient immunity, simplicity, and robustness against high-voltage dv/dt stresses. They are often preferred in high-noise industrial environments, power supply feedback loops, and applications where proven reliability and safety certifications are paramount. The development of new LED and detector materials continues to improve the speed and CTR of optocouplers, ensuring their relevance alongside newer technologies.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |