Table of Contents
- 1. Product Overview
- 1.1 Core Advantages and Target Market
- 2. Technical Parameter Deep-Dive
- 2.1 Absolute Maximum Ratings
- 2.2 Electro-Optical Characteristics
- 3. Performance Curve Analysis
- 3.1 Relative Intensity vs. Wavelength
- 3.2 Directivity Pattern
- 3.3 Forward Current vs. Forward Voltage (IV Curve)
- 3.4 Relative Intensity vs. Forward Current
- 3.5 Thermal Characteristics
- 4. Mechanical and Package Information
- 4.1 Package Dimensions
- 4.2 Polarity Identification
- 5. Soldering and Assembly Guidelines
- 5.1 Lead Forming
- 5.2 Storage Conditions
- 5.3 Soldering Parameters
- 5.4 Cleaning
- 5.5 Heat Management
- 6. Packaging and Ordering Information
- 6.1 Packing Specification
- 6.2 Packing Quantity
- 6.3 Label Explanation
- 7. Application Suggestions and Design Considerations
- 7.1 Typical Application Circuits
- 7.2 Design Considerations
- 8. Technical Comparison and Differentiation
- 9. Frequently Asked Questions (Based on Technical Parameters)
- 9.1 What is the difference between Peak Wavelength and Dominant Wavelength?
- 9.2 Can I drive this LED with a 3.3V supply?
- 9.3 Why is the storage condition so specific (3 months)?
- 10. Practical Use Case Example
- 11. Operating Principle Introduction
- 12. Technology Trends and Context
1. Product Overview
The 1383-2SDRD/S530-A3 is a high-brightness LED lamp designed for applications requiring superior luminous intensity in the deep red spectrum. Utilizing AlGaInP chip technology, this component delivers reliable performance with a typical luminous intensity of 320 mcd at a standard drive current of 20mA. It is engineered for robustness and longevity, making it suitable for integration into various electronic devices and displays.
1.1 Core Advantages and Target Market
This LED series offers several key advantages, including a choice of viewing angles, availability on tape and reel for automated assembly, and compliance with major environmental and safety standards such as RoHS, REACH, and Halogen-Free requirements (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm). Its primary target markets include consumer electronics, specifically for use as indicator lights or backlighting in products like television sets, computer monitors, telephones, and other computing equipment where a clear, bright red signal is essential.
2. Technical Parameter Deep-Dive
The performance of the LED is defined by a comprehensive set of electrical, optical, and thermal parameters measured under standard conditions (Ta=25°C).
2.1 Absolute Maximum Ratings
These ratings define the limits beyond which permanent damage to the device may occur. They should not be exceeded under any operating conditions.
- Continuous Forward Current (IF): 25 mA
- Peak Forward Current (IFP): 60 mA (Duty 1/10 @ 1KHz)
- Reverse Voltage (VR): 5 V
- Power Dissipation (Pd): 60 mW
- Operating Temperature Range (Topr): -40°C to +85°C
- Storage Temperature Range (Tstg): -40°C to +100°C
- Soldering Temperature (Tsol): 260°C for 5 seconds
2.2 Electro-Optical Characteristics
These are the typical performance parameters under normal operating conditions (IF=20mA, unless specified).
- Luminous Intensity (Iv): 160 mcd (Min), 320 mcd (Typ)
- Viewing Angle (2θ1/2): 30 degrees (Typ)
- Peak Wavelength (λp): 650 nm (Typ)
- Dominant Wavelength (λd): 639 nm (Typ)
- Spectrum Radiation Bandwidth (Δλ): 20 nm (Typ)
- Forward Voltage (VF): 2.0 V (Typ), 2.4 V (Max)
- Reverse Current (IR): 10 µA (Max) at VR=5V
Note: Measurement uncertainties are ±10% for Luminous Intensity, ±0.1V for Forward Voltage, and ±1.0nm for Dominant Wavelength.
3. Performance Curve Analysis
Graphical data provides deeper insight into the LED's behavior under varying conditions.
3.1 Relative Intensity vs. Wavelength
The spectral distribution curve shows a sharp peak centered around 650 nm, confirming the super deep red emission. The narrow spectral bandwidth of 20 nm typifies the color purity achievable with AlGaInP technology.
3.2 Directivity Pattern
The radiation pattern illustrates the 30-degree half-intensity viewing angle, demonstrating a well-defined beam suitable for directed illumination or indicator purposes.
3.3 Forward Current vs. Forward Voltage (IV Curve)
This curve is crucial for circuit design. The LED exhibits a typical forward voltage of 2.0V at 20mA. Designers must ensure the current-limiting resistor is calculated based on the maximum VF of 2.4V to guarantee proper operation across all production units.
3.4 Relative Intensity vs. Forward Current
Luminous output increases with forward current but is subject to the absolute maximum rating of 25mA continuous current. Operating above this point without proper heat management will reduce lifespan and reliability.
3.5 Thermal Characteristics
Two key graphs analyze thermal effects: Relative Intensity vs. Ambient Temperature: Luminous output decreases as ambient temperature rises. This de-rating must be considered for applications in high-temperature environments. Forward Current vs. Ambient Temperature: This curve may illustrate the need for current de-rating at elevated temperatures to maintain reliability and prevent thermal runaway.
4. Mechanical and Package Information
4.1 Package Dimensions
The LED is housed in a standard lamp-style package. Critical dimensions include the lead spacing, body diameter, and overall height. The flange height is specified to be less than 1.5mm. All dimensions are in millimeters with a standard tolerance of ±0.25mm unless otherwise noted. Engineers must refer to the detailed dimensioned drawing in the datasheet for precise PCB footprint design.
4.2 Polarity Identification
The component features a cathode identifier, typically a flat side on the lens or a shorter lead. Correct polarity orientation is mandatory during assembly to prevent reverse bias damage.
5. Soldering and Assembly Guidelines
Proper handling is critical to maintain LED performance and longevity.
5.1 Lead Forming
- Bending must occur at least 3mm from the epoxy bulb base.
- Form leads before soldering.
- Avoid applying stress to the package. PCB holes must align perfectly with LED leads to prevent mechanical strain.
- Cut leads at room temperature.
5.2 Storage Conditions
- Store at ≤30°C and ≤70% Relative Humidity after receipt.
- Shelf life is 3 months under these conditions. For longer storage (up to 1 year), use a sealed container with nitrogen and desiccant.
- Avoid rapid temperature changes in humid environments to prevent condensation.
5.3 Soldering Parameters
Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.
Hand Soldering: - Iron Tip Temperature: 300°C Max (30W Max iron). - Soldering Time: 3 seconds Max per lead.
Wave/Dip Soldering: - Preheat Temperature: 100°C Max (60 sec Max). - Solder Bath Temperature: 260°C Max. - Dwell Time in Bath: 5 seconds Max.
Avoid multiple soldering cycles. Do not apply stress to leads while hot. Allow the LED to cool gradually to room temperature after soldering, protecting it from shock or vibration during cooling.
5.4 Cleaning
If cleaning is necessary, use isopropyl alcohol at room temperature for no more than one minute. Do not use ultrasonic cleaning unless specifically pre-qualified for the assembly, as it can damage the LED structure.
5.5 Heat Management
Effective thermal management is essential, especially when operating near maximum ratings. The design should consider PCB layout, possible use of thermal vias, and appropriate current de-rating based on the ambient operating temperature to ensure long-term reliability.
6. Packaging and Ordering Information
6.1 Packing Specification
The LEDs are packed to prevent electrostatic discharge (ESD) and moisture damage: - Anti-electrostatic Bags: Primary packaging. - Inner Cartons: Hold multiple bags. - Outside Cartons: Final shipping container.
6.2 Packing Quantity
Standard packing is 200-500 pieces per anti-static bag. Five bags are packed into one inner carton. Ten inner cartons constitute one master outside carton.
6.3 Label Explanation
Labels on packaging include key identifiers: - CPN: Customer's Part Number. - P/N: Manufacturer's Part Number (1383-2SDRD/S530-A3). - QTY: Quantity contained. - CAT / HUE: Indicates performance binning for luminous intensity and dominant wavelength. - LOT No: Traceability lot number.
7. Application Suggestions and Design Considerations
7.1 Typical Application Circuits
The most common drive circuit is a series current-limiting resistor. The resistor value (R) is calculated using Ohm's Law: R = (Vcc - VF) / IF, where Vcc is the supply voltage, VF is the forward voltage of the LED (use max value of 2.4V for reliability), and IF is the desired forward current (e.g., 20mA). For a 5V supply: R = (5V - 2.4V) / 0.020A = 130 Ohms. A standard 130Ω or 150Ω resistor would be appropriate.
7.2 Design Considerations
- Current Control: Always use a constant current source or a current-limiting resistor. Driving the LED directly from a voltage source will cause excessive current and rapid failure.
- Thermal Design: For continuous operation at high ambient temperatures or near maximum current, consider PCB copper area for heat sinking.
- ESD Protection: While the LED has some inherent robustness, standard ESD handling precautions should be observed during assembly.
- Optical Design: The 30-degree viewing angle provides a focused beam. For wider illumination, secondary optics (e.g., diffusers) may be required.
8. Technical Comparison and Differentiation
The 1383-2SDRD/S530-A3 differentiates itself in the deep red LED market through its specific combination of attributes. Compared to standard red LEDs (often around 625-630nm dominant wavelength), this "Super Deep Red" variant at 639nm offers a deeper, more saturated red color. Its typical luminous intensity of 320mcd is competitive for its package size and viewing angle. The compliance with Halogen-Free and REACH standards makes it suitable for environmentally conscious designs and markets with strict material regulations, such as Europe.
9. Frequently Asked Questions (Based on Technical Parameters)
9.1 What is the difference between Peak Wavelength and Dominant Wavelength?
Peak Wavelength (650nm) is the single wavelength at which the spectral power distribution is maximum. Dominant Wavelength (639nm) is the single wavelength of monochromatic light that matches the perceived color of the LED. Dominant wavelength is more relevant for color specification in display applications.
9.2 Can I drive this LED with a 3.3V supply?
Yes. Using the formula with Vcc=3.3V and VF(max)=2.4V at IF=20mA: R = (3.3V - 2.4V) / 0.020A = 45 Ohms. A 47Ω resistor would be a suitable standard value. Ensure the resistor power rating is adequate (P = I^2 * R = 0.02^2 * 47 = 0.0188W, so a 1/10W or 1/8W resistor is fine).
9.3 Why is the storage condition so specific (3 months)?
LED packages can absorb moisture from the atmosphere. During high-temperature soldering, this trapped moisture can rapidly expand, causing internal delamination or cracking ("popcorning"). The 3-month shelf life assumes standard factory moisture protection. For longer storage, the nitrogen-packed method prevents moisture ingress, preserving solderability and reliability.
10. Practical Use Case Example
Scenario: Status Indicator on a Network Router A designer needs a bright, clear "Link Active" indicator. The 1383-2SDRD/S530-A3 is selected for its high brightness and distinct deep red color. - Circuit: Driven from the router's 3.3V logic rail through a 47Ω current-limiting resistor, providing ~19mA. - Layout: The LED is placed on the front panel. The PCB footprint matches the datasheet drawing, with holes aligned to prevent lead stress. - Assembly: LEDs from tape and reel are placed by pick-and-place machine. The board undergoes a controlled wave soldering process adhering to the 260°C for 5s profile. - Result: A reliable, consistently bright status indicator that meets all regulatory requirements for the target market.
11. Operating Principle Introduction
This LED is based on AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor technology. When a forward voltage is applied across the P-N junction, electrons and holes are injected into the active region. Their recombination releases energy in the form of photons (light). The specific composition of the AlGaInP layers determines the bandgap energy, which directly corresponds to the wavelength of the emitted light—in this case, deep red at ~650 nm peak. The epoxy lens encapsulates the chip, provides mechanical protection, and shapes the emitted light into the specified 30-degree viewing angle.
12. Technology Trends and Context
AlGaInP LEDs represent a mature and highly efficient technology for producing red, orange, and yellow light. Key trends in this segment include: - Increased Efficiency: Ongoing material science improvements aim to extract more lumens per watt (efficacy), reducing power consumption for the same light output. - Miniaturization: While this is a lamp package, the industry trend is towards smaller surface-mount device (SMD) packages for higher density PCB layouts. - Color Stability: Advancements focus on maintaining consistent color output (wavelength) over the device's lifetime and across varying operating temperatures. - Integration: In broader lighting applications, deep red LEDs like this one are often combined with other colors (blue, green, white) in multi-chip packages or arrays to create tunable white light or specific color mixes for horticultural lighting, where deep red is crucial for plant photosynthesis.
The 1383-2SDRD/S530-A3 sits within this evolving landscape as a reliable, single-color source optimized for indicator and signaling applications where specific color point and brightness are key requirements.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |