SMT CBI LED LTL-M11TB1H310U Datasheet - Blue LED with White Diffused Lens - 10mA - English Technical Document

1. Product Overview

The LTL-M11TB1H310U is a Surface Mount Technology (SMT) Circuit Board Indicator (CBI). It consists of a black plastic right-angle housing (holder) designed to mate with a specific LED lamp. The primary function is to serve as a status or indicator light on electronic circuit boards. The product family offers versatility with options for top-view or right-angle orientation and configurations in horizontal or vertical arrays, which are stackable for ease of assembly.

1.1 Core Advantages

• Surface Mount Design: Enables automated pick-and-place assembly, improving manufacturing efficiency and consistency.
• Enhanced Contrast: The black housing material provides a high contrast ratio against the illuminated LED, improving visibility.
• Energy Efficiency: Characterized by low power consumption and high luminous efficiency.
• Environmental Compliance: This is a lead-free product compliant with the RoHS (Restriction of Hazardous Substances) directive.
• Optical Design: Utilizes an InGaN (Indium Gallium Nitride) blue semiconductor chip paired with a white diffused lens to soften and spread the light output.
• Reliability Screening: Devices undergo preconditioning accelerated to JEDEC Moisture Sensitivity Level 3, indicating a robust package for typical SMT processes.

1.2 Target Applications

This indicator LED is suitable for a wide range of ordinary electronic equipment, including:

• Computer peripherals and internal components.
• Communication devices and networking equipment.
• Consumer electronics.
• Industrial control systems and instrumentation.

2. Technical Parameter Analysis

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.

• Power Dissipation (Pd): 80 mW maximum. This is the total electrical power the device can safely dissipate as heat.
• Peak Forward Current (I_FP): 100 mA maximum, but only under pulsed conditions (duty cycle ≤ 1/10, pulse width ≤ 0.1ms).
• DC Forward Current (I_F): 20 mA maximum for continuous operation. This is the key parameter for circuit design.
• Operating Temperature (T_opr): -40°C to +85°C. The device is rated for operation across this industrial temperature range.
• Storage Temperature (T_stg): -40°C to +100°C.
• Soldering Temperature: Withstands 260°C for a maximum of 5 seconds, which is compatible with lead-free reflow soldering profiles.

2.2 Electro-Optical Characteristics

Measured at an ambient temperature (T_A) of 25°C and a forward current (I_F) of 10mA, unless otherwise specified.

• Luminous Intensity (I_V): 8.7 mcd (Min), 15 mcd (Typ), 38 mcd (Max). This is the perceived brightness in the axial direction. The classification code marked on the packing bag corresponds to the actual luminous intensity bin.
• Viewing Angle (2θ_1/2): 40 degrees (Typical). This is the full angle at which the luminous intensity drops to half of its axial value, defining the beam spread.
• Peak Emission Wavelength (λ_P): 468 nm (Typical). This is the wavelength at which the spectral power output is highest.
• Dominant Wavelength (λ_d): 464 nm (Min), 470 nm (Typ), 476 nm (Max). This is the single wavelength perceived by the human eye that defines the color of the light, derived from the CIE chromaticity diagram.
• Spectral Line Half-Width (Δλ): 20 nm (Typical). This indicates the spectral purity or bandwidth of the emitted blue light.
• Forward Voltage (V_F): 2.7 V (Min), 3.1 V (Typ), 3.8 V (Max) at I_F = 10mA. This is the voltage drop across the LED when conducting.
• Reverse Current (I_R): 10 μA maximum at a reverse voltage (V_R) of 5V. Important: The device is not designed for operation under reverse bias; this test condition is for characterization only.

3. Performance Curve Analysis

The datasheet references typical characteristic curves which are essential for design engineers. While the specific graphs are not reproduced in the text, they typically include:

• I-V (Current-Voltage) Curve: Shows the relationship between forward voltage and forward current, crucial for selecting the appropriate current-limiting resistor.
• Relative Luminous Intensity vs. Forward Current: Illustrates how light output increases with drive current, helping to optimize brightness and efficiency.
• Relative Luminous Intensity vs. Ambient Temperature: Demonstrates the thermal derating of light output, which is critical for high-temperature applications.
• Spectral Distribution: A graph showing the relative power output across wavelengths, centered around the peak wavelength of 468 nm.

These curves allow designers to predict device behavior under non-standard conditions (different currents or temperatures) and are fundamental for robust circuit design.

4. Mechanical and Packaging Information

4.1 Outline Dimensions

The device features a right-angle SMT package. Key dimensional notes include:

• All dimensions are provided in millimeters, with inches in parentheses.
• A general tolerance of ±0.25mm (±0.010\") applies unless otherwise specified.
• The housing material is black plastic.
• The integrated LED emits blue light through a white diffused lens.

4.2 Packing Specification

The components are supplied in a tape-and-reel format suitable for automated assembly.

• Carrier Tape: Made of black conductive polystyrene alloy, 0.40mm ±0.06mm thick. The 10-sprocket hole pitch has a cumulative tolerance of ±0.20mm.
• Reel Capacity: Each 13-inch reel contains 1,400 pieces.
• Carton Packaging:
  • 1 reel is packed with a desiccant and humidity indicator card inside a Moisture Barrier Bag (MBB).
  • 3 MBBs are packed in one Inner Carton (total 4,200 pieces).
  • 10 Inner Cartons are packed in one Outer Carton (total 42,000 pieces).

5. Assembly and Application Guidelines

5.1 Storage and Handling

• Sealed Package: Store at ≤30°C and ≤70% RH. Use within one year of the pack date.
• Opened Package: Store at ≤30°C and ≤60% RH. Components should be reflow-soldered within 168 hours (7 days) of exposure to ambient air.
• Extended Storage/Baking: If exposed for >168 hours, bake at 60°C for at least 48 hours before soldering to remove absorbed moisture and prevent \"popcorning\" during reflow.

5.2 Soldering Process

Reflow Soldering (Recommended):

• Pre-heat: 150–200°C for up to 120 seconds max.
• Peak Temperature: 260°C maximum at the solder joints.
• Time Above Liquidus: 5 seconds maximum within the peak temperature zone.
• Number of Cycles: The reflow process must not exceed 2 times.

Hand Soldering: Use a soldering iron at a maximum temperature of 300°C for no more than 3 seconds, one time only. Avoid applying mechanical stress to the leads during soldering.

Cleaning: Use alcohol-based solvents like isopropyl alcohol if cleaning is necessary.

5.3 Drive Circuit Design

LEDs are current-driven devices. To ensure uniform brightness when using multiple LEDs:

• Recommended Circuit (A): Use a separate current-limiting resistor in series with each LED. This compensates for the natural variation in forward voltage (V_F) between individual LEDs, ensuring each receives the same current and thus emits the same luminous intensity.
• Non-Recommended Circuit (B): Connecting multiple LEDs in parallel with a single shared resistor is discouraged. Small differences in the I-V characteristics of each LED can cause significant current imbalance, leading to uneven brightness.

5.4 Electrostatic Discharge (ESD)

The device is susceptible to damage from electrostatic discharge. Standard ESD handling precautions must be observed during assembly and handling, including the use of grounded workstations, wrist straps, and conductive containers.

6. Design Considerations and Application Notes

6.1 Thermal Management

While the power dissipation is low (80 mW max), maintaining the junction temperature within limits is crucial for long-term reliability. Ensure adequate PCB copper area or thermal vias if the device is operated at high ambient temperatures or near its maximum current rating.

6.2 Optical Integration

The 40-degree viewing angle and white diffused lens provide a wide, soft illumination suitable for panel indicators. The black housing minimizes light piping and stray reflections, enhancing the on/off contrast. Designers should consider the final assembly's viewing angle requirements when selecting the mounting orientation (right-angle as provided).

6.3 Reliability and Lifespan

Operation within the Absolute Maximum Ratings, especially the DC forward current and temperature limits, is paramount for reliability. The JEDEC Level 3 preconditioning indicates the package can withstand typical factory floor exposure times before reflow, but the post-opening storage and baking guidelines must be followed to prevent moisture-induced failures.

7. Frequently Asked Questions (Based on Technical Parameters)

Q1: What resistor value should I use to drive this LED at 10mA from a 5V supply?
A1: Using Ohm's Law: R = (V_supply - V_F) / I_F. With a typical V_F of 3.1V, R = (5V - 3.1V) / 0.01A = 190 Ω. To ensure the current does not exceed the maximum under worst-case conditions (min V_F), recalculate using V_F(min)=2.7V: R = (5V - 2.7V) / 0.01A = 230 Ω. A standard 220 Ω resistor is a safe and practical choice, yielding approximately 10.5mA at typical V_F.

Q2: Can I pulse this LED at higher currents for increased brightness?
A2: Yes, but strictly within the Absolute Maximum Ratings. You can pulse it at up to 100mA, provided the duty cycle is ≤10% (e.g., 0.1ms pulse every 1ms) and the average current over time does not exceed the DC rating or power dissipation limits. The instantaneous luminous intensity will be higher than at 10mA DC.

Q3: The dominant wavelength range is 464-476nm. Will there be a visible color difference between units?
A3: Within this 12nm binning range, the human eye can perceive a slight shift in blue hue, especially when comparing devices from the minimum and maximum ends of the range side-by-side. For most indicator applications where individual LEDs are viewed independently, this variation is acceptable. For applications requiring strict color matching, specifying a tighter wavelength bin or using LEDs from the same production lot is advised.