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SMT Green LED Indicator LTL-M11TG1H310Q Datasheet - Right-Angle Holder - 525nm Green - 3.8V - 80mW - English Technical Document

Technical datasheet for the LTL-M11TG1H310Q, a surface-mount green LED indicator in a black right-angle holder. Includes specifications, ratings, curves, and application guidelines.
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PDF Document Cover - SMT Green LED Indicator LTL-M11TG1H310Q Datasheet - Right-Angle Holder - 525nm Green - 3.8V - 80mW - English Technical Document

1. Product Overview

The LTL-M11TG1H310Q is a Circuit Board Indicator (CBI) component designed for surface-mount assembly. It consists of a green LED lamp integrated into a black plastic right-angle holder (housing). This design is intended for applications requiring side-emitting indicators on printed circuit boards (PCBs). The product is characterized by its stackable design, which facilitates easy assembly and allows for the creation of vertical or horizontal arrays of indicators.

1.1 Core Features and Advantages

1.2 Target Applications and Markets

This indicator is suitable for a broad range of electronic equipment where status indication is required. Primary application sectors include:

2. Technical Parameter Deep Dive

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.

2.2 Electrical and Optical Characteristics

These are typical performance parameters measured at an ambient temperature (TA) of 25°C under specified test conditions.

3. Performance Curve Analysis

The datasheet references typical characteristic curves which are essential for circuit design. While the specific graphs are not reproduced in text, their implications are analyzed below.

3.1 Forward Current vs. Forward Voltage (I-V Curve)

This curve shows the exponential relationship between current and voltage for a semiconductor diode. For designers, the key takeaway is the typical VF of 3.8V at 10mA. This curve is crucial for selecting an appropriate current-limiting resistor. The voltage increases non-linearly with current; operating significantly above 20mA will cause VF to rise sharply, leading to excessive power dissipation and potential damage.

3.2 Luminous Intensity vs. Forward Current

This graph typically shows that light output (IV) increases approximately linearly with forward current (IF) within the recommended operating range. However, efficiency (light output per unit of electrical power) may decrease at very high currents due to increased heat generation. Operating at the typical 10mA provides a good balance of brightness and efficiency.

3.3 Luminous Intensity vs. Ambient Temperature

The light output of an LED decreases as the junction temperature increases. This curve is vital for applications operating in high-temperature environments. A designer must derate the expected luminous intensity if the device will be used near its maximum operating temperature of 85°C.

3.4 Spectral Distribution

The referenced spectral graph would show a bell-shaped curve centered around the peak wavelength of 523 nm with a half-width of 25 nm. This confirms the green color emission.

4. Mechanical and Packaging Information

4.1 Outline Dimensions and Notes

The mechanical drawing provides critical dimensions for PCB footprint design and clearance checks. Key notes from the datasheet include:

Designer Note: Always refer to the latest dimensional drawing from the manufacturer for PCB layout. The right-angle design means the light emits parallel to the PCB surface, which is ideal for panel-mounted applications.

4.2 Polarity Identification

For surface-mount devices, polarity is typically indicated by a marking on the component body or an asymmetrical shape. The designer must consult the footprint diagram to identify the cathode and anode pads on the PCB layout to ensure correct orientation during assembly.

5. Soldering and Assembly Guidelines

5.1 Storage and Handling

5.2 Cleaning

If cleaning is necessary after soldering, use alcohol-based solvents like isopropyl alcohol. Avoid using aggressive or unknown chemical cleaners that may damage the plastic housing or lens.

5.3 Soldering Process Parameters

Reflow Soldering (Recommended Process):

Hand Soldering (if necessary):

Critical Caution: Do not apply any mechanical stress to the leads or housing while the LED is at high temperature during soldering, as this can cause internal damage.

6. Packaging and Ordering Information

6.1 Tape and Reel Specifications

6.2 Carton Packaging

7. Application Design and Circuit Considerations

7.1 Drive Circuit Design

LEDs are current-driven devices. To ensure consistent brightness and longevity, they must be driven with a constant current or a voltage source with a series current-limiting resistor.

Recommended Circuit (Circuit A): Use a series resistor for each LED. The resistor value (R) is calculated using Ohm's Law: R = (Vsupply - VF) / IF. For a 5V supply, targeting IF=10mA and using VF=3.8V: R = (5V - 3.8V) / 0.01A = 120 Ω. A standard 120Ω resistor would be suitable.

Circuit to Avoid (Circuit B): Connecting multiple LEDs directly in parallel from a single voltage source with one shared current-limiting resistor is not recommended. Small variations in the forward voltage (VF) characteristic between individual LEDs will cause uneven current distribution, leading to significant differences in brightness and potentially overstressing one LED.

7.2 Electrostatic Discharge (ESD) Protection

LEDs are sensitive to electrostatic discharge. Standard ESD precautions must be observed during handling and assembly:

7.3 Thermal Management

While the power dissipation is low (80mW max), proper thermal design extends lifetime and maintains light output. Ensure adequate spacing between components on the PCB for airflow. Avoid placing the LED near other significant heat sources. Operating at or below the typical current (10mA) rather than the absolute maximum (20mA) will minimize temperature rise.

8. Frequently Asked Questions (FAQ)

8.1 What is the purpose of the white diffused lens?

The white diffused lens scatters the light from the small, bright green chip. This creates a more uniform, wider viewing angle (40 degrees) and softens the appearance of the light source, making it look like a solid illuminated area rather than a pinpoint, which is generally more desirable for status indicators.

8.2 Can I drive this LED with a 3.3V supply?

Possibly, but with caution. The typical forward voltage is 3.8V. At 3.3V, the LED may not turn on at all, or it will be very dim because the applied voltage is below the required VF threshold. A boost converter or a higher supply voltage (like 5V) with a series resistor is the recommended approach.

8.3 How do I interpret the luminous intensity value of 29 mcd?

Millicandela (mcd) is a unit of luminous intensity, which is a measure of how bright a light source appears in a specific direction. 29 mcd is a moderate brightness suitable for direct viewing in typical indoor electronic equipment. For comparison, a power indicator on a laptop might be in the range of 20-100 mcd.

8.4 Is the housing material conductive?

The carrier tape is specified as \"black conductive polystyrene alloy,\" which is for anti-static purposes during automated handling. The device housing itself is standard black plastic and is not electrically conductive.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.