SMD Infrared LED RE30AX Specification Sheet - Dimensions 3.00x3.00x2.10mm - Voltage 1.7V - Power 0.9W - 850nm Peak Wavelength - English Technical Documentation

1. Product Overview

This technical documentation details the specifications and application guidelines for a high-power surface-mount infrared (IR) light-emitting diode (LED). The device features an EMC (Epoxy Molding Compound) package, which provides excellent mechanical strength, thermal stability, and reliability for demanding operational environments.

Core Advantages: The key benefits of this component include a compact SMD footprint (3.0mm x 3.0mm), a high total radiant flux output, and a broad viewing angle of 100 degrees, ensuring wide-area illumination. It is designed for compatibility with standard lead-free reflow soldering processes.

Target Market: The primary application domains for this IR LED are security and surveillance systems, where it serves as an invisible illumination source for night-vision cameras. It is also highly suitable for machine vision systems in industrial automation, enabling reliable object detection and positioning in low-light conditions.

1.1 Package Dimension

The component is housed in a compact, rectangular package measuring 3.00 mm in length, 3.00 mm in width, and 2.10 mm in height. Dimensional tolerances are typically ±0.2 mm unless otherwise specified. The package features a clear polarity marking to ensure correct orientation during PCB assembly. The recommended soldering land pattern (footprint) is provided to facilitate optimal thermal and electrical performance, as well as reliable mechanical attachment to the printed circuit board.

2. In-Depth Technical Parameter Analysis

The following sections provide a detailed, objective interpretation of the device's electrical, optical, and thermal characteristics.

2.1 Electrical & Optical Characteristics

All measurements are specified at a standard solder point temperature (Ts) of 25°C.

• Forward Voltage (V_F): With a forward current (I_F) of 500 mA applied, the typical voltage drop across the LED is 1.7 V, with a minimum of 1.4 V. This low forward voltage contributes to higher system efficiency.
• Peak Wavelength (λ_p): The primary wavelength of emitted infrared light is 850 nm, which is near the peak sensitivity of many silicon-based image sensors while remaining invisible to the human eye.
• Spectral Bandwidth (Δλ): The spectral width at half maximum intensity is typically 30 nm, which defines the purity of the emitted infrared light.
• Total Radiant Flux (Φ_e): This parameter measures the total optical power output in milliwatts. At I_F = 500 mA, the typical value is 350 mW, with a range from 280 mW (min) to 450 mW (max).
• Viewing Angle (2θ_1/2): The angle at which the radiant intensity is half of the maximum intensity is 100 degrees, providing a wide beam pattern.
• Thermal Resistance (R_θJ-S): The junction-to-solder point thermal resistance is 16 °C/W. This value is critical for calculating the junction temperature during operation to ensure long-term reliability.

2.2 Absolute Maximum Ratings

These are the stress limits beyond which permanent damage to the device may occur. Operation at or near these limits for extended periods is not recommended.

• Maximum Power Dissipation (P_D): 0.9 W.
• Maximum Continuous Forward Current (I_F): 500 mA.
• Maximum Reverse Voltage (V_R): 5 V. Exceeding this can cause immediate breakdown.
• Electrostatic Discharge (ESD) Tolerance: Human Body Model (HBM) rating is 2000 V. Proper ESD handling procedures are mandatory.
• Temperature Ranges: Operating temperature: -40°C to +85°C. Storage temperature: -40°C to +100°C.
• Maximum Junction Temperature (T_J): 105°C. The operating current must be derated to keep T_J below this limit.

3. Performance Curve Analysis

3.1 Forward Voltage vs. Forward Current (IV Curve)

The IV curve shows a non-linear relationship typical of semiconductor diodes. As current increases from 0 to 600 mA, the forward voltage rises from approximately 1.3 V to 1.7 V. This curve is essential for selecting appropriate current-limiting circuitry and understanding power dissipation.

3.2 Relative Intensity vs. Forward Current

This plot demonstrates that the optical output (relative intensity) increases almost linearly with drive current up to the rated maximum. This predictable relationship allows designers to tune brightness by adjusting the drive current.

3.3 Relative Intensity vs. Ambient Temperature

The graph indicates a decrease in optical output as the ambient temperature rises. From 25°C to 85°C, the relative intensity drops to about 85-90% of its room-temperature value. This thermal droop must be factored into designs for stable performance across the operating temperature range.

3.4 Spectral Distribution

The spectrum graph confirms a peak emission at 850 nm with a relatively narrow bandwidth, centered around the typical silicon sensor responsivity peak. The shape is characteristic of an AlGaAs-based LED structure.

3.5 Radiation Pattern

The polar diagram visualizes the 100-degree viewing angle, showing a near-Lambertian emission pattern where intensity is fairly uniform across the central viewing cone before dropping off at wider angles.

3.6 Solder Point Temperature vs. Forward Current

This curve illustrates the thermal coupling between the LED junction and its solder point. For a given forward current, the solder point temperature will rise. This data, combined with the thermal resistance, is used for accurate thermal management design.

4. Packaging & SMT Assembly Information

4.1 Packaging Specification

The product is supplied in tape-and-reel packaging for automated SMT assembly. Each reel contains 3000 pieces. The carrier tape dimensions (pocket pitch, width, depth) and the reel dimensions (diameter, hub size) conform to EIA standard specifications to ensure compatibility with standard pick-and-place equipment.

4.2 SMT Reflow Soldering Guidelines

This component is rated for lead-free reflow soldering processes. Key considerations include:

• Moisture Sensitivity Level (MSL): Level 3. Components must be baked according to the IPC/JEDEC standard if the packaging has been opened and exposed to ambient conditions beyond the specified floor life.
• Profile Parameters: A standard lead-free reflow profile with a peak temperature not exceeding 260°C is recommended. The time above liquidus (typically 217°C) should be controlled to minimize thermal stress on the EMC package and the semiconductor die.
• Handling Precautions: Avoid mechanical stress on the package. Use vacuum pick-up nozzles of appropriate size. Maintain ESD-safe working environments and equipment.

5. Application & Design Recommendations

5.1 Typical Application Scenarios

• Surveillance & Security Cameras: Provides covert illumination for night-vision functionality in CCTV, dash cams, and doorbell cameras.
• Machine Vision & Industrial Automation: Enables consistent lighting for barcode readers, optical sensors, robotic guidance, and quality inspection systems.
• Biometric Sensors: Can be used in IR illumination modules for facial recognition or iris scanning systems.

5.2 Design Considerations

• Thermal Management: Due to the high power dissipation (up to 0.9W), effective heat sinking is crucial. Use a PCB with adequate thermal vias under the LED pad connected to a ground plane or dedicated heatsink. Calculate the expected junction temperature using T_J = T_S + (P_D * R_θJ-S) and ensure it remains below 105°C.
• Drive Circuitry: A constant current driver is strongly recommended over a constant voltage source to ensure stable optical output and prevent thermal runaway. The driver should be capable of supplying up to 500 mA.
• Optical Design: The wide 100-degree viewing angle is suitable for general flood illumination. For focused beams, secondary optics (lenses) will be required.

5.3 Comparative Analysis

Compared to standard through-hole IR LEDs, this SMD version offers significant advantages for modern manufacturing: smaller footprint, suitability for automated assembly, and better thermal performance due to direct attachment to the PCB. Compared to other SMD IR LEDs, its combination of 350 mW output at 500mA and a 100-degree angle in a 3.0mm x 3.0mm package represents a balanced solution for high-output, wide-coverage applications.

6. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I drive this LED with a 3.3V power supply?

A: Yes, but you must use a constant current driver. The typical forward voltage is 1.7V at 500mA, so a series resistor or active driver circuit is necessary to limit the current from a 3.3V rail.

Q: How many LEDs can I connect in series?

A: This depends on your drive voltage. For a 12V driver, you could theoretically connect up to 7 LEDs in series (12V / 1.7V ≈ 7). However, you must account for voltage tolerances and driver overhead. Parallel connection of LEDs is not recommended without individual current balancing.

Q: What is the expected lifetime?

A: LED lifetime is primarily determined by operating junction temperature. When operated within the specified absolute maximum ratings, particularly keeping T_J well below 105°C, the device can achieve tens of thousands of hours of operation. High temperatures accelerate lumen depreciation.

Q: Is an IR filter needed on the camera?

A: Most daylight cameras have an IR-cut filter to prevent color distortion. For effective IR night vision, this filter must be mechanically moved aside or a camera without a permanent IR-cut filter must be used.

7. Technical Principles & Trends

7.1 Operating Principle

An infrared LED is a semiconductor p-n junction diode. When a forward voltage is applied, electrons and holes recombine in the active region, releasing energy in the form of photons. The wavelength of these photons (850nm in this case) is determined by the bandgap energy of the semiconductor materials used, typically aluminum gallium arsenide (AlGaAs) for this wavelength range.

7.2 Industry Trends

The trend in IR LEDs for imaging applications is towards higher efficiency (more mW per mA), smaller package sizes for denser arrays, and improved reliability. There is also ongoing development in wavelengths optimized for specific sensor types and applications requiring eye safety. The integration of driver ICs with LEDs in a single package is another growing trend to simplify system design.