White SMD LED Specification - 3.0x3.0x0.65mm Package - 5.8-6.4V Forward Voltage - 0.9W Typical Power - 2580-7120K CCT

1. Product Overview

This document provides the complete technical specification for a series of high-brightness, surface-mount white light-emitting diodes (LEDs). These LEDs are constructed using a blue LED chip combined with phosphor technology to produce white light. The device is housed in a compact and robust EMC (Epoxy Molding Compound) package measuring 3.0mm x 3.0mm x 0.65mm, making it suitable for automated assembly processes. The product is designed for general lighting and indication applications, offering a wide viewing angle and RoHS compliance.

1.1 Core Advantages

The key features of this LED series include the robust EMC package material, which enhances thermal performance and reliability. It offers an extremely wide viewing angle of 120 degrees, ensuring uniform light distribution. The component is fully compatible with standard SMT (Surface Mount Technology) assembly and solder reflow processes. It is supplied on tape and reel packaging with 5000 pieces per reel, facilitating high-volume production. The moisture sensitivity level is classified as Level 3, and the product meets RoHS environmental standards.

1.2 Target Market and Applications

This LED is versatile and targets applications requiring efficient, reliable white light sources. Primary application areas include serving as an optical indicator in electronic devices and equipment. It is suitable for indoor display backlighting and signage. Furthermore, its performance characteristics make it applicable for various outdoor lighting fixtures where consistent brightness and color are required.

2. Technical Parameters - Objective Analysis

The performance of the LED is defined under specific test conditions (Ts=25°C). It is crucial for designers to understand these parameters within the context of their application's thermal and electrical environment.

2.1 Photometric and Electrical Characteristics

The primary characteristics are defined for a drive current of 150mA. The luminous flux (Φ) output varies depending on the correlated color temperature (CCT) bin. For example, the 2850-3210K bin (RF-Q30SA 30A-24-J2) has a typical luminous flux of 158 lumens, with minimum and maximum values defined across sub-bins (FC7: 150-160 lm, FC8: 160-170 lm). The forward voltage (Vf) is binned into three ranks (R1: 5.8-6.0V, R2: 6.0-6.2V, S1: 6.2-6.4V) at 150mA. Other critical parameters include a reverse current (Ir) of max. 10uA at 10V, a viewing angle (2Θ1/2) of 120 degrees typical, a color rendering index (Ra) of 72 typical, and a thermal resistance from junction to solder point (Rth(j-s)) of 10 °C/W typical.

2.2 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage may occur. The maximum continuous forward current (IF) is 200mA, with a peak forward current (IFP) of 240mA under pulsed conditions (1/10 duty cycle, 0.1ms pulse width). The maximum power dissipation (PD) is 1200mW. The maximum reverse voltage (VR) is 10V. The device can withstand an electrostatic discharge (ESD) of 2000V (Human Body Model). The operating and storage temperature range is from -40°C to +100°C, with the maximum junction temperature (TJ) rated at 125°C. Designers must ensure operation within these limits for long-term reliability.

3. Binning System Explanation

A comprehensive binning system ensures color and brightness consistency, which is critical for applications requiring uniform appearance.

3.1 Correlated Color Temperature (CCT) and Chromaticity Binning

The LED is available in six main CCT bins: 27 (2580-2850K), 30 (2850-3210K), 40 (3690-4255K), 50 (4700-5350K), 57 (5260-6155K), and 65 (6035-7120K). Each main bin is further divided into four quadrants (A, B, C, D) on the CIE 1931 chromaticity diagram, conforming to the ANSI 5-step Macadam ellipse standard. This ensures that LEDs within the same bin are visually matched in color. Specific chromaticity coordinates (x, y) are provided for the nominal center of each main bin.

3.2 Luminous Flux (Brightness) Binning

Within each CCT bin, the luminous flux is further sorted into sub-bins labeled FC6, FC7, FC8, FC9, etc. For instance, in the 2850-3210K bin, the flux ranges from a minimum of 150 lumens (FC7 min) to a maximum of 170 lumens (FC8 max). This allows designers to select a brightness grade suitable for their application's requirements and cost targets.

3.3 Forward Voltage Binning

The forward voltage is sorted into three ranks: R1, R2, and S1. This helps in designing power supplies and current drivers, as knowing the expected Vf range allows for better optimization of driver efficiency and thermal management, especially when multiple LEDs are used in series.

4. Performance Curve Analysis

While specific graphical curves are referenced in the document, their implications are critical. The CIE Chromaticity Diagram visually represents the color bins and their boundaries. Typical optical characteristic curves, which likely include relative luminous flux vs. forward current and vs. junction temperature, are essential for understanding performance under non-standard conditions. For example, luminous output typically decreases as junction temperature increases. Designers should use this data to derate performance expectations in high-temperature environments.

5. Mechanical and Package Information

5.1 Dimensions and Tolerances

The package outline dimensions are 3.0mm (length) x 3.0mm (width) x 0.65mm (height). Unless otherwise noted, all dimensional tolerances are ±0.05mm. Detailed top, side, and bottom views are provided to aid in PCB footprint design and inspection.

5.2 Polarity Identification and Solder Pad Design

The anode (A, positive) and cathode (C, negative) are clearly marked on the bottom of the component. A recommended solder pad pattern (land pattern) is provided to ensure proper solder joint formation, reliable electrical connection, and good thermal transfer during reflow soldering. Adhering to this pattern is crucial for manufacturing yield and long-term reliability.

6. Soldering and Assembly Guidelines

6.1 SMT Reflow Soldering Profile

Detailed instructions for SMT reflow soldering are provided. This includes a recommended temperature-time profile that typically consists of preheat, thermal soak, reflow, and cooling phases. Following the manufacturer's specified profile is essential to prevent thermal shock, which can cause delamination or cracking inside the LED package, and to ensure proper wetting of the solder.

6.2 Handling and Storage Precautions

As a moisture-sensitive device (MSL Level 3), the LEDs must be stored in a dry environment (typically <30°C/60%RH) and used within a specified time after the sealed moisture barrier bag is opened. If exceeded, a baking procedure is required before reflow to prevent popcorning (package cracking due to rapid vapor expansion). General handling precautions include avoiding mechanical stress, using ESD-safe practices, and preventing contamination of the optical surface.

7. Packaging and Ordering Information

7.1 Packaging Specification

The LEDs are packaged in anti-static carrier tape. The dimensions of the carrier tape pockets and the reel (including hub diameter, reel width, and outer diameter) are specified to ensure compatibility with automated pick-and-place equipment. A label form specification details the information printed on the reel label.

7.2 Moisture-Resistant Packing and Carton

The reels are packed in moisture barrier bags with desiccant and a humidity indicator card to maintain the MSL Level 3 rating during storage and shipment. These bags are then placed in cardboard boxes for bulk shipping and handling.

8. Reliability and Quality Assurance

The document references reliability test items and conditions, as well as criteria for judging damage. While specific tests are not listed in the provided excerpt, typical LED reliability tests include temperature cycling, humidity testing, solder heat resistance, and operational life testing. These tests validate the product's durability under expected field conditions.

9. Application Design Suggestions

9.1 Design Considerations

When integrating this LED, consider the following: Use a constant-current driver for stable light output and long life. Perform thermal management analysis using the provided thermal resistance (10°C/W) to ensure the junction temperature remains below 125°C. Select the appropriate CCT and flux bin for the target application to ensure visual consistency. Adhere strictly to the recommended solder pad layout and reflow profile.

9.2 Technical Comparison and Advantages

Compared to non-EMC packages, the EMC material offers better resistance to heat and UV radiation, leading to superior lumen maintenance over time. The 3030 footprint provides a good balance between light output and board space, offering higher brightness than smaller packages like 2835 while being more compact than high-power LEDs requiring separate heatsinks.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: How do I choose between the different CCT bins?

A: Select based on the desired "warmth" of the white light. Lower Kelvin values (e.g., 27, 30) produce warm white light similar to incandescent bulbs, suitable for ambient lighting. Higher values (e.g., 50, 65) produce cool white or daylight white, often used for task lighting or displays.

Q: What driver current should I use?

A: The data is characterized at 150mA. While the absolute max is 200mA, driving at or below 150mA will improve efficacy (lumens per watt) and significantly enhance longevity and reliability by reducing junction temperature. Always refer to derating curves if available.

Q: The LED has a 10°C/W thermal resistance. What does this mean for my design?

A> It means for every watt of power dissipated in the LED (Vf * If), the junction will be 10°C hotter than the solder point temperature. You must design the PCB layout and, if necessary, use thermal vias or a metal core board to keep the solder point temperature low enough so that TJ stays under 125°C.

11. Practical Application Examples

Example 1: Indoor Panel Light: An array of these LEDs, binned to 4000K (Bin 40), can be used on an aluminum-backed PCB to create a flat panel light. The wide viewing angle ensures even illumination without hotspots. The constant-current driver is set to 140mA per LED to maximize lifespan while achieving target brightness.

Example 2: Industrial Indicator: A single LED from the 6500K bin (Bin 65) can serve as a high-brightness status indicator on industrial control equipment. Its robust EMC package withstands higher ambient temperatures and potential contamination better than plastic packages.

12. Technical Principle Introduction

This LED generates white light through a process called phosphor conversion. The core component is a semiconductor chip that emits blue light when electrical current passes through it. This blue light is partially absorbed by a layer of yellow (and sometimes red) phosphor coating deposited directly on or near the chip. The phosphor re-emits light at longer wavelengths (yellow/red). The combination of the remaining blue light from the chip and the yellow/red light from the phosphor mixes to produce the perception of white light. The exact ratio of blue to phosphor-converted light determines the correlated color temperature (CCT) of the output.

13. Technology Trends and Context

The 3030 EMC package represents a mature and widely adopted platform in the mid-power LED market. Ongoing trends in this segment focus on increasing luminous efficacy (more lumens per watt), improving color rendering index (CRI) and color consistency (tighter binning), and enhancing long-term reliability (lumen maintenance). Furthermore, there is a drive towards higher maximum junction temperatures and improved thermal packaging to allow for higher drive currents in smaller form factors. The technology continues to evolve towards more efficient phosphor systems and chip designs to push the limits of performance and cost-effectiveness.