LED Lamp 334-15/X1C2-1 UWA Datasheet - T-1 3/4 Package - 20mA - Warm White - English Technical Document

1. Product Overview

This document details the specifications for a high-performance warm white LED lamp. The device is housed in a popular T-1 3/4 round package, designed to deliver high luminous power for applications requiring significant light output. The warm white emission is achieved through a phosphor conversion process applied to an InGaN blue chip, resulting in typical chromaticity coordinates of x=0.40, y=0.39 according to the CIE 1931 standard.

1.1 Core Advantages and Target Market

The primary advantages of this LED series include its high luminous intensity, robust ESD protection (withstand voltage up to 4KV), and compliance with key environmental regulations including RoHS, EU REACH, and halogen-free requirements (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm). It is supplied in bulk or taped on reel for automated assembly. The target applications are diverse, encompassing message panels, optical indicators, backlighting modules, and marker lights where reliable and bright white illumination is critical.

2. Technical Parameter Deep Dive

2.1 Absolute Maximum Ratings

The device is rated for a continuous forward current (IF) of 30 mA, with a peak forward current (IFP) of 100 mA permissible at a 1/10 duty cycle and 1 kHz. The maximum reverse voltage (VR) is 5 V. The power dissipation (Pd) is limited to 110 mW. The operational temperature range (Topr) is from -40°C to +85°C, while storage temperature (Tstg) can range from -40°C to +100°C. The LED can withstand an ESD (HBM) of 4KV. The maximum soldering temperature is 260°C for 5 seconds.

2.2 Electro-Optical Characteristics

Under standard test conditions (Ta=25°C, IF=20mA), the forward voltage (VF) ranges from a minimum of 2.8V to a maximum of 3.6V. The luminous intensity (IV) has a typical value, with a binning system defining minimums from 9000 mcd to 18000 mcd. The viewing angle (2θ1/2) is typically 20 degrees. The reverse current (IR) is a maximum of 50 μA at VR=5V. A Zener diode feature is included with a reverse voltage (Vz) of 5.2V at Iz=5mA.

3. Binning System Explanation

The product is classified according to three key parameters to ensure consistency in application design.

3.1 Luminous Intensity Binning

Luminous intensity is categorized into three bin codes at IF=20mA: Bin U (9000 - 11250 mcd), Bin V (11250 - 14250 mcd), and Bin W (14250 - 18000 mcd). A general tolerance of ±10% applies.

3.2 Forward Voltage Binning

Forward voltage is grouped into four bins at IF=20mA: Bin 0 (2.8 - 3.0 V), Bin 1 (3.0 - 3.2 V), Bin 2 (3.2 - 3.4 V), and Bin 3 (3.4 - 3.6 V). The measurement uncertainty is ±0.1V.

3.3 Color Binning

The chromaticity coordinates are defined within specific regions on the CIE 1931 diagram. The color ranks are D1, D2, E1, E2, F1, and F2, each with defined coordinate boundaries. These are grouped together (Group 1: D1+D2+E1+E2+F1+F2) for ordering purposes. The measurement uncertainty for color coordinates is ±0.01.

4. Performance Curve Analysis

The datasheet provides several characteristic curves measured at Ta=25°C.

4.1 Spectral and Angular Distribution

The Relative Intensity vs. Wavelength curve shows the spectral power distribution of the warm white light. The Directivity curve illustrates the spatial radiation pattern, confirming the typical 20-degree viewing angle with a Lambertian-like distribution.

4.2 Electrical and Thermal Relationships

The Forward Current vs. Forward Voltage curve demonstrates the diode's exponential IV characteristic. The Relative Intensity vs. Forward Current curve shows how light output increases with current, crucial for driving circuit design. The Chromaticity Coordinate vs. Forward Current plot indicates the stability of color point with varying drive current. The Forward Current vs. Ambient Temperature curve is essential for understanding derating requirements and thermal management, showing how maximum permissible current decreases as ambient temperature rises.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED uses a standard T-1 3/4 (5mm) round package. Key dimensions include the overall diameter, the height from the base to the top of the lens, and the lead spacing. The lead spacing is measured where the leads emerge from the package body. All dimensions are in millimeters with a standard tolerance of ±0.25mm unless otherwise specified. A maximum protrusion of resin under the flange is 1.5mm.

5.2 Polarity Identification and Mounting

The cathode is typically indicated by a flat spot on the lens rim or a shorter lead. The datasheet emphasizes that during PCB mounting, the holes must align precisely with the LED leads to avoid inducing mechanical stress on the epoxy body, which can lead to degradation or failure.

6. Soldering and Assembly Guidelines

6.1 Lead Forming

If required, lead forming must be performed before soldering. The bend should be at least 3mm from the base of the epoxy bulb to prevent stress damage. Cutting of leadframes should be done at room temperature.

6.2 Soldering Parameters

For hand soldering, an iron tip temperature of 300°C maximum (30W max) is recommended, with a soldering time not exceeding 3 seconds. For wave or dip soldering, a preheat temperature of 100°C max (60 sec max) and a solder bath temperature of 260°C max for 5 seconds are specified. In all cases, the solder joint must be at least 3mm away from the epoxy bulb.

6.3 Storage Conditions

LEDs should be stored at 30°C or less and 70% relative humidity or less. The recommended storage life after shipment is 3 months. For longer storage (up to one year), use a sealed container with a nitrogen atmosphere and desiccant. Rapid temperature transitions in humid environments should be avoided to prevent condensation.

7. Packaging and Ordering Information

7.1 Packaging Specification

The LEDs are packed in moisture-resistant, anti-static bags. The packing hierarchy is: 200-500 pieces per bag, 5 bags per inner carton, and 10 inner cartons per master (outside) carton.

7.2 Label Explanation and Model Number

The packaging label includes fields for Customer's Production Number (CPN), Production Number (P/N), Packing Quantity (QTY), CAT (combination of Luminous Intensity and Forward Voltage bins), HUE (Color Rank), Reference (REF), and Lot Number (LOT No). The full product designation follows the pattern: 334-15/X1C2-□□□□, where the squares are placeholders for the specific bin codes for Color Group, Luminous Intensity, and Voltage Group.

8. Application Suggestions and Design Considerations

8.1 Typical Application Circuits

When designing a drive circuit, the forward voltage bin must be considered to ensure proper current regulation. A series current-limiting resistor is the simplest method. For constant brightness, a constant current driver is recommended, especially given the LED's positive temperature coefficient (forward voltage decreases with rising temperature, which can lead to thermal runaway if driven by a constant voltage source). The integrated Zener diode provides basic reverse voltage protection.

8.2 Thermal Management

Although the package is not designed for high-power dissipation, effective thermal management is still important for longevity and stable color output. The maximum power dissipation is 110 mW. Designers should ensure the operating junction temperature remains within limits by providing adequate ventilation or heat sinking if the LED is driven at or near its maximum continuous current, especially in high ambient temperature environments.

8.3 Optical Design

The 20-degree viewing angle makes this LED suitable for applications requiring a directed beam. For wider illumination, secondary optics such as diffusers or lenses may be required. The warm white color temperature is ideal for creating a comfortable, non-harsh visual appearance in indicator and signage applications.

9. Technical Comparison and Differentiation

Compared to standard 5mm LEDs, this device offers significantly higher luminous intensity, making it suitable for applications where brightness is paramount. The inclusion of ESD protection up to 4KV HBM enhances reliability in handling and assembly. The comprehensive binning system for intensity, voltage, and color provides designers with the predictability needed for consistent end-product performance. The compliance with halogen-free and REACH regulations addresses modern environmental and supply chain requirements.

10. Frequently Asked Questions (Based on Technical Parameters)

10.1 What is the difference between the luminous intensity bins (U, V, W)?

The bins represent guaranteed minimum light output ranges at 20mA. Bin U is 9000-11250 mcd, Bin V is 11250-14250 mcd, and Bin W is 14250-18000 mcd. Selecting a higher bin ensures greater brightness but may affect cost and availability.

10.2 How do I select the correct current-limiting resistor?

The resistor value depends on your supply voltage (Vs), the desired forward current (If, typically 20mA), and the LED's actual forward voltage (Vf, which depends on its voltage bin). Use the formula: R = (Vs - Vf) / If. Always use the maximum Vf from the bin (e.g., 3.6V for Bin 3) for a conservative design that ensures the current does not exceed limits even with a low-Vf LED.

10.3 Can I drive this LED with a pulsed current?

Yes, the datasheet specifies a peak forward current (IFP) of 100 mA at a 1/10 duty cycle and 1 kHz. This allows for pulsed operation to achieve even higher perceived brightness or for multiplexing schemes, but the average current must not exceed the continuous rating of 30 mA.

11. Practical Design and Usage Case

Case: Designing a High-Visibility Status Indicator Panel: A designer needs to create a panel with multiple status indicators that must be clearly visible in both dim and brightly lit industrial environments. Using the Bin W version of this LED ensures high luminous intensity. By driving the LEDs at a steady 20mA with a constant-current circuit, consistent brightness and color are achieved across all indicators. The 20-degree viewing angle provides a focused beam, making each indicator distinct. The warm white color is chosen to reduce eye strain for operators monitoring the panel over long periods. The LEDs are mounted on a PCB with correctly aligned holes, and wave soldering is performed adhering to the 260°C for 5 seconds guideline, with solder joints kept >3mm from the epoxy body.

12. Operating Principle Introduction

This is a phosphor-converted white LED. The core light-emitting element is a semiconductor chip made of Indium Gallium Nitride (InGaN), which emits blue light when forward biased. This blue light is not emitted directly. Instead, it strikes a phosphor layer deposited inside the reflector cup of the package. The phosphor absorbs a portion of the blue photons and re-emits light at longer wavelengths (yellow, red). The mixture of the remaining blue light and the phosphor-converted yellow/red light combines to produce the perception of warm white light. The specific ratios of phosphor materials determine the exact color temperature and chromaticity coordinates on the CIE diagram.

13. Technology Trends and Context

The T-1 3/4 package represents a mature and widely adopted through-hole LED format. While surface-mount device (SMD) packages dominate new designs for their size and assembly advantages, through-hole LEDs like this one remain relevant for applications requiring robust mechanical mounting, easier manual prototyping, or compatibility with existing legacy systems. The trend within this package type is toward higher efficiency (more lumens per watt) and tighter binning tolerances to meet the demands of applications requiring color and brightness consistency. The integration of basic protection features like Zener diodes and high ESD ratings is also becoming more standard, improving reliability.