T3B Series 3014 White LED Datasheet - Dimensions 3.0x1.4x0.8mm - Voltage 3.0V - Power 0.12W - English Technical Document

1. Product Overview

The T3B series is a compact, surface-mount LED designed for general lighting and backlighting applications. This single-chip, 0.12W white LED in the 3014 package format offers a balance of efficiency, size, and reliability, making it suitable for space-constrained designs requiring uniform illumination.

1.1 Core Features

• Package: 3014 (3.0mm x 1.4mm x 0.8mm)
• Chip Technology: Single crystal
• Power Rating: 0.12W (typical operation at 40mA)
• Color Options: Warm White (L), Neutral White (C), Cool White (W) with various Correlated Color Temperature (CCT) bins.
• Viewing Angle: Wide 110-degree half-angle (2θ1/2).

1.2 Target Applications

This LED is ideal for applications such as LED strips, signage backlighting, decorative lighting, indicator lights, and as a component in larger LED arrays for panel lighting.

2. Technical Parameter Analysis

All parameters are specified at a solder point temperature (Ts) of 25°C unless otherwise noted.

2.1 Absolute Maximum Ratings

Stresses beyond these limits may cause permanent damage.

• Forward Current (IF): 60 mA (continuous)
• Forward Pulse Current (IFP): 80 mA (Pulse width ≤10ms, Duty cycle ≤1/10)
• Power Dissipation (PD): 210 mW
• Operating Temperature (Topr): -40°C to +80°C
• Storage Temperature (Tstg): -40°C to +80°C
• Junction Temperature (Tj): 125°C
• Soldering Temperature (Tsld): 230°C or 260°C for 10 seconds (reflow soldering).

2.2 Electro-Optical Characteristics (Typical @ IF=40mA)

• Forward Voltage (VF): 3.0V (Typical), 3.5V (Maximum)
• Reverse Voltage (VR): 5V
• Reverse Current (IR): 10 μA (Maximum @ VR=5V)
• Luminous Flux: See binning tables in Section 2.4.
• Viewing Angle (2θ1/2): 110 degrees.

3. Binning System Explanation

The product is classified into precise bins to ensure color and brightness consistency in production.

3.1 Color Temperature (CCT) Binning

Standard ordering is based on specific chromaticity regions (MacAdam ellipses).

• 27M5: 2725K ±145K
• 30M5: 3045K ±175K
• 40M5: 3985K ±275K
• 50M5: 5028K ±283K
• 57M7: 5665K ±355K
• 65M7: 6530K ±510K

Note: Other CCT and flux combinations are available upon request. Shipments adhere to the ordered chromaticity region, not a maximum flux value.

3.2 Luminous Flux Binning

Flux is binned by minimum value at 40mA. The table defines codes (C6, C7, etc.) with minimum and maximum lumen ranges for different CCT and CRI (Color Rendering Index) categories (70 or 80). For example, a Neutral White (3700-5000K), 70 CRI LED with code D1 has a minimum flux of 17 lm and a typical maximum of 18 lm.

3.3 Forward Voltage (VF) Binning

Voltage is categorized into bins from B to H, each covering a 0.1V range (e.g., Bin C: 2.9V to 3.0V). This helps in designing consistent current-driven circuits.

3.4 Chromaticity Regions & Ellipse Centers

The document defines the center coordinates (x, y) and ellipse parameters (major/minor axis radii, angle) for each CCT bin (27M5, 30M5, etc.) on the CIE chromaticity diagram, ensuring tight color control within specified MacAdam steps.

4. Performance Curve Analysis

4.1 Forward Current vs. Forward Voltage (IV Curve)

The curve shows the exponential relationship. At the typical operating current of 40mA, the forward voltage is approximately 3.0V. Designers must use a current-limiting resistor or constant-current driver based on this curve to ensure stable operation.

4.2 Forward Current vs. Relative Luminous Flux

This graph demonstrates that light output increases with current but may not be linear across the entire range. Operating above the recommended 40mA increases junction temperature, which can reduce efficiency and lifespan.

3.3 Junction Temperature vs. Relative Spectral Power

The curve indicates how the spectral output shifts with junction temperature (Tj). Higher Tj typically causes a slight shift in wavelength and a decrease in overall light output, highlighting the importance of thermal management.

4.4 Relative Spectral Power Distribution

The graph plots relative intensity against wavelength for different CCT ranges (2600-3700K, 3700-5000K, 5000-10000K). Cool white LEDs have more energy in the blue spectrum, while warm white LEDs have more energy in the red/yellow spectrum.

5. Mechanical & Package Information

5.1 Outline Dimensions

The LED has a rectangular 3014 package with dimensions of 3.0mm (L) x 1.4mm (W) x 0.8mm (H). Tolerances are specified: .X ±0.10mm, .XX ±0.05mm.

5.2 Pad Layout & Stencil Design

Detailed drawings show the recommended solder pad footprint and the corresponding stencil opening pattern to ensure proper solder paste volume and reliable solder joint formation during reflow. The anode and cathode are clearly marked.

6. Soldering & Assembly Guidelines

6.1 Moisture Sensitivity & Baking

The 3014 package is moisture-sensitive (MSL compliant with IPC/JEDEC J-STD-020C).

• Storage: Store in original sealed bag at <30°C, <30% RH. No baking required if these conditions are met and the humidity indicator card is within limits.
• Baking Requirement: Required if the bag has been opened or storage conditions exceeded.
• Baking Method: Bake at 60°C for 24 hours on the original reel. Do not exceed 60°C. Solder within 1 hour after baking or store in <20% RH environment.

6.2 Reflow Soldering Profile

Use a standard lead-free reflow profile. Peak temperature should not exceed 260°C, and time above 230°C should be limited to 10 seconds as per the maximum rating.

7. Packaging & Ordering Information

7.1 Model Numbering Rule

The part number (e.g., T3B00SL(C、W)A) is constructed as follows: T [Package Code: 3B for 3014] [Lens Code: 00 for none] [Chip Count: S for single] [Color Code: L/C/W] [Internal Code] - [Flux Code] [CCT Code]. This system allows precise specification of all key parameters.

7.2 Color Code Reference

R: Red, Y: Yellow, B: Blue, G: Green, U: Purple/Violet, A: Amber/Orange, I: IR, L: Warm White (<3700K), C: Neutral White (3700-5000K), W: Cool White (>5000K), F: Full Color.

8. Application Notes & Design Considerations

8.1 Thermal Management

Although low power, effective heat sinking through the PCB is crucial for maintaining performance and longevity, especially in high-density arrays or enclosed fixtures. Ensure the PCB design provides adequate thermal vias and copper area under the LED pad.

8.2 Electrical Drive

Always drive the LED with a constant current source or a voltage source with a series current-limiting resistor. The value should be calculated based on the supply voltage and the LED's forward voltage bin to achieve the desired 40mA (or lower) current. Avoid driving at the absolute maximum current for extended periods.

8.3 Optical Design

The wide 110-degree viewing angle provides good spatial distribution. For directional lighting, secondary optics (lenses, reflectors) may be required. Consider the LED's spatial radiation pattern when designing optical systems.

9. Technical Comparison & Differentiation

Compared to older packages like 3528, the 3014 offers a more compact footprint with similar or better optical performance. Its low profile (0.8mm) is advantageous for ultra-thin lighting solutions. The defined binning structure for flux, voltage, and tight chromaticity ellipses provides superior color consistency for batch production compared to non-binned or loosely binned alternatives.

10. Frequently Asked Questions (FAQs)

10.1 What is the difference between the CCT bins 27M5 and 30M5?

27M5 is centered around 2725K (very warm white), while 30M5 is centered around 3045K (warm white). The \"M5\" indicates the color tolerance is within a 5-step MacAdam ellipse, ensuring very small visual color difference between LEDs of the same bin.

10.2 Can I operate this LED at 60mA continuously?

While the absolute maximum rating is 60mA, the typical operating condition and technical parameters are specified at 40mA. Continuous operation at 60mA will significantly increase junction temperature, reduce efficiency, accelerate lumen depreciation, and may void reliability guarantees. It is not recommended for standard applications.

10.3 Is baking always necessary before soldering?

No. Baking is only necessary if the LEDs have been exposed to moisture beyond the limits specified on the humidity indicator card inside the sealed bag, or if the bag has been opened and the LEDs stored in uncontrolled humid environments for an extended period (as defined by the moisture sensitivity level).

11. Practical Use Case Example

11.1 Design for an LED Strip Light

For a 12V LED strip light, multiple T3B LEDs are connected in series-parallel combinations. A typical segment might have 3 LEDs in series (total VF ~9V) with a current-limiting resistor calculated for ~40mA per string. These strings are then paralleled. The 3014 package allows for high-density placement, creating a continuous line of light. Using LEDs from the same flux and CCT bin (e.g., C8, 50M5) ensures uniform brightness and color along the entire strip.

12. Operating Principle

This is a semiconductor photonic device. When a forward voltage exceeding the diode's threshold is applied, electrons and holes recombine in the active region of the semiconductor chip (the \"single crystal\"), releasing energy in the form of photons (light). The specific materials and phosphor coating (for white LEDs) determine the wavelength and color of the emitted light. The 3014 package houses the chip, provides electrical connections via the anode and cathode pads, and incorporates a lens that shapes the light output.

13. Technology Trends

The market for SMD LEDs like the 3014 continues to trend towards higher efficacy (more lumens per watt), improved color rendering (higher CRI and R9 values), and tighter color consistency (smaller MacAdam ellipses like 2-step or 3-step). There is also a drive for miniaturization while maintaining or increasing light output, and for enhanced reliability under higher temperature operating conditions. The standardized binning systems used in this datasheet are part of the industry's effort to provide predictable and consistent components for automated, high-volume manufacturing.