T3B Series 3014 Single Chip 0.2W Backlight LED Datasheet - Dimensions 3.0x1.4x0.8mm - Voltage 3.1V - Power 0.2W - English Technical Document

1. Product Overview

The T3B Series represents a family of high-performance, single-chip, surface-mount LEDs designed primarily for backlighting applications. Utilizing a compact 3014 package footprint (3.0mm x 1.4mm), these LEDs offer a balance of luminous efficiency, reliability, and design flexibility suitable for modern electronic displays and indicator systems.

The core of the device is a single semiconductor chip capable of delivering up to 0.2W of optical power. The series is characterized by its wide viewing angle, stable color performance across a range of color temperatures, and robust construction suitable for automated assembly processes like reflow soldering.

2. Technical Parameters and Specifications

2.1 Absolute Maximum Ratings

The following parameters define the operational limits beyond which permanent damage to the LED may occur. All values are specified at an ambient temperature (Ts) of 25°C.

• Forward Current (IF): 80 mA (Continuous)
• Forward Pulse Current (IFP): 120 mA (Pulse width ≤10ms, Duty cycle ≤1/10)
• Power Dissipation (PD): 288 mW
• Operating Temperature (Topr): -40°C to +80°C
• Storage Temperature (Tstg): -40°C to +80°C
• Junction Temperature (Tj): 125°C
• Soldering Temperature (Tsld): 230°C or 260°C for 10 seconds (reflow profile)

2.2 Electro-Optical Characteristics

Typical performance parameters measured under standard test conditions (Ts=25°C, IF=60mA).

• Forward Voltage (VF): Typical 3.1V, Maximum 3.5V
• Reverse Voltage (VR): 5V
• Reverse Current (IR): Maximum 10 µA (VR=5V)
• Viewing Angle (2θ1/2): 110° (Typical)

3. Product Binning and Classification System

3.1 Model Numbering Rule

The product code follows a structured format: T □□ □□ □ □ □ – □□□ □□. This code encapsulates key attributes:

• Package/Form Factor Code: e.g., '3B' denotes the 3014 package.
• Chip Configuration: 'S' for a single small-power chip (as in this series).
• Optical Design Code: '00' indicates no secondary lens.
• Color Code: Defines the emission color or white point.
  • Warm White: L (<3700K)
  • Neutral White: C (3700-5000K)
  • Cool White: W (>5000K)
  • Other colors: R (Red), Y (Yellow), G (Green), B (Blue), etc.
• Luminous Flux Code: Specifies the minimum luminous output bin (e.g., D2, D3).
• Color Temperature Code: For white LEDs, specifies the correlated color temperature (CCT) bin.
• Forward Voltage Code: Specifies the VF bin (e.g., B, C, D).

3.2 Luminous Flux Binning

For backlight white LEDs with a Color Rendering Index (CRI) of 60 and CCT ranging from 10,000K to 40,000K, the luminous flux is binned at a test current of 60mA. The binning specifies a minimum value, with the actual flux potentially higher.

• Code D2: 18 lm (Min) to 20 lm (Max)
• Code D3: 20 lm (Min) to 22 lm (Max)
• Code D4: 22 lm (Min) to 24 lm (Max)
• Code D5: 24 lm (Min) to 26 lm (Max)

Tolerance for luminous flux measurement is ±7%.

3.3 Forward Voltage Binning

The forward voltage (VF) is classified into precise bins to aid in circuit design for current regulation and uniformity in multi-LED arrays.

• Code B: 2.8V to 2.9V
• Code C: 2.9V to 3.0V
• Code D: 3.0V to 3.1V
• Code E: 3.1V to 3.2V
• Code F: 3.2V to 3.3V
• Code G: 3.3V to 3.4V
• Code H: 3.4V to 3.5V

Tolerance for voltage measurement is ±0.08V.

3.4 Chromaticity Binning

White LEDs are classified into specific chromaticity regions on the CIE 1931 color space diagram to ensure color consistency. For the 3014 backlight series, regions labeled BG1 through BG5 are defined with precise (x, y) coordinate boundaries. Products are shipped adhering to the ordered chromaticity region restrictions.

Chromaticity coordinate tolerance is ±0.005. CRI tolerance is ±2.

4. Performance Curves and Characteristics

4.1 Forward Current vs. Forward Voltage (I-V Curve)

The I-V characteristic is typical of a semiconductor diode. The curve shows a sharp increase in current once the forward voltage exceeds the threshold (approximately 2.7V-2.9V). Operating at the recommended 60mA ensures stable performance within the specified voltage bin.

4.2 Relative Luminous Flux vs. Forward Current

Luminous output increases with forward current but exhibits a sub-linear relationship at higher currents due to increased junction temperature and efficiency droop. The curve highlights the optimal drive current range for maximizing efficacy (lumens per watt).

4.3 Relative Spectral Power vs. Junction Temperature

The spectral output of the LED phosphor system shifts with junction temperature (Tj). This curve is critical for applications requiring stable color points. As Tj increases from 25°C to 125°C, the relative spectral energy typically decreases, which can affect both luminous flux and chromaticity.

4.4 Relative Spectral Power Distribution

This graph depicts the normalized emission spectrum of the white LED, showing the combination of the blue chip emission peak and the broader phosphor-converted yellow/green/red emission. The shape of this curve determines the Color Rendering Index (CRI) and the perceived color quality.

5. Mechanical and Packaging Information

5.1 Outline Dimensions and Footprint

The LED conforms to the standard 3014 package dimensions:

• Length (L): 3.0 mm ±0.10 mm
• Width (W): 1.4 mm ±0.10 mm
• Height (H): 0.8 mm ±0.10 mm

Detailed dimensional drawings with tolerances (.X: ±0.10mm, .XX: ±0.05mm) are provided for PCB layout.

5.2 Recommended PCB Land Pattern and Stencil Design

A dedicated solder pad layout is recommended to ensure reliable soldering, proper thermal management, and mechanical stability. The land pattern typically includes two anode/cathode pads. A corresponding solder paste stencil design is also specified, which is crucial for controlling solder paste volume during Surface Mount Technology (SMT) assembly to prevent tombstoning or insufficient solder joints.

Polarity Identification: The cathode is typically marked on the LED body. The PCB silkscreen should clearly indicate polarity to prevent reverse mounting.

6. Assembly, Handling, and Storage Guidelines

6.1 Moisture Sensitivity and Baking Requirements

The 3014 LED package is classified as moisture-sensitive according to IPC/JEDEC J-STD-020C. Exposure to ambient humidity after opening the sealed moisture barrier bag can lead to popcorn cracking or delamination during the high-temperature reflow soldering process.

• Storage: Unopened bags should be stored below 30°C and 85% RH. After opening, store at <30°C and <60% RH, preferably in a dry cabinet or sealed container with desiccant.
• Floor Life: After opening the sealed bag, components should be used within 12 hours if exposed to ambient factory conditions (>30% RH).
• Baking: If the floor life is exceeded or the humidity indicator card shows high humidity, baking is required: 60°C for 24 hours. Do not exceed 60°C. Reflow should occur within 1 hour after baking, or the parts must be returned to a dry storage (<20% RH).

6.2 Reflow Soldering Profile

The LED can withstand standard lead-free reflow soldering profiles. The maximum peak temperature is 260°C, with a recommended time above liquidus (e.g., 217°C) of 10 seconds. A controlled ramp-up and cool-down rate is essential to minimize thermal stress on the package.

6.3 Electrostatic Discharge (ESD) Protection

LEDs are semiconductor devices and are sensitive to electrostatic discharge, particularly white, green, blue, and purple types. ESD can cause immediate failure or latent damage leading to reduced lifetime and performance degradation (e.g., color shift, increased leakage current).

• Prevention: Handle LEDs in an ESD-protected area (EPA) using grounded wrist straps, conductive mats, and ionizers.
• Packaging: Use ESD-safe containers and trays during transport and handling.
• Assembly Equipment: Ensure SMT pick-and-place machines and other handlers are properly grounded.

7. Application Notes and Design Considerations

7.1 Typical Applications

• LCD Backlighting: Edge-lit or direct-lit backlight units for monitors, TVs, laptops, and automotive displays.
• General Indicator Lights: Status indicators, panel lighting, and decorative lighting where a compact, bright source is needed.
• Consumer Electronics: Backlighting for keyboards, switches, and signage.

7.2 Drive Circuit Design

Constant Current Drive: LEDs are current-driven devices. For consistent brightness and color, and to prevent thermal runaway, they must be driven by a constant current source, not a constant voltage source. A current-limiting resistor used with a voltage source is a simple method but is less efficient and less stable with temperature and voltage variations.

Current Setting: The recommended operating current is 60mA. Operating at or near the absolute maximum rating (80mA) will reduce lifetime and may shift color parameters unless exceptional heat sinking is provided.

Thermal Management: Although the power is relatively low (0.2W), effective heat dissipation from the LED solder pads to the PCB copper is crucial for maintaining performance and longevity. Use adequate thermal relief and copper area on the PCB. For high-density arrays, consider the overall thermal load on the PCB.

7.3 Optical Design Considerations

The wide 110-degree viewing angle makes this LED suitable for applications requiring broad, even illumination. For more directional light, secondary optics (reflectors, light guides) must be used. When designing light guides, the LED's emission pattern and intensity distribution should be modeled to achieve uniform output.

8. Technical Comparison and Product Differentiation

The 3014 package offers a distinct advantage in the landscape of SMD LEDs:

• vs. 3528/2835: The 3014 is more compact in width, allowing for higher density in linear arrays or tighter pitch in backlight designs. It often features a more modern chip and package design for higher efficacy.
• vs. 5050: The 3014 is a single-die solution, whereas 5050 packages often contain three dice. The 3014 provides a smaller point source, which can be beneficial for optical control in light guides, and typically has a lower thermal resistance per package.
• vs. 0201/0402: Larger than micro-LEDs, the 3014 is easier to handle in assembly, offers higher light output, and is more robust for general lighting applications.

The key differentiators of this specific T3B series are its defined binning structure for color and flux, its compliance with moisture sensitivity standards, and its detailed application guidelines, which support design for manufacturability and reliability.

9. Frequently Asked Questions (FAQ)

9.1 What is the difference between the luminous flux 'Min' and 'Typ' values in the binning table?

The 'Min' value is the guaranteed lower limit for that bin code. The 'Typ' value is a representative average, but not guaranteed. When you order a D3 bin, you are guaranteed a minimum of 20 lm at 60mA, but the actual parts may measure up to 22 lm. This system ensures you meet your minimum brightness requirement.

9.2 Why is baking necessary, and can I use a higher temperature to bake faster?

Baking removes absorbed moisture from the plastic package to prevent vapor pressure damage during reflow. Do not exceed 60°C. Higher temperatures can degrade the internal materials (epoxy, phosphor, wire bonds) and the tape-and-reel packaging itself, leading to premature failure or handling issues.

9.3 Can I drive this LED with a 3.3V power supply and a resistor?

Yes, but with important caveats. Given a typical VF of 3.1V, a series resistor would need to drop only 0.2V at 60mA, requiring a very small resistance (~3.3 Ohms). This leaves almost no headroom for variation in supply voltage or LED VF. A small increase in supply voltage or a lower VF bin LED would cause a large increase in current, potentially damaging the LED. A constant current driver is strongly recommended for reliable operation.

9.4 How do I interpret the chromaticity region codes (BG1, BG2, etc.)?

These codes define a small quadrilateral area on the CIE chromaticity diagram. All LEDs from a given batch, when measured, will have their (x,y) color coordinates fall within the boundaries of that specific region. This allows designers to select LEDs that will match each other closely in color, which is critical for backlight uniformity. The datasheet provides the exact corner coordinates for each region.

10. Operational Principles and Technology Trends

10.1 Basic Operating Principle

A Light Emitting Diode (LED) is a solid-state semiconductor device. When a forward voltage is applied across the p-n junction, electrons and holes recombine, releasing energy in the form of photons—a process called electroluminescence. The wavelength (color) of the emitted light is determined by the energy bandgap of the semiconductor material. In a white LED like this one, a blue-emitting indium gallium nitride (InGaN) chip is coated with a yellow (or multi-color) phosphor. Some blue light escapes, and the rest is absorbed by the phosphor and re-emitted as longer wavelength light (yellow, red, green). The mixture of blue and phosphor-converted light is perceived as white.

10.2 Industry Trends

The LED industry continues to evolve towards higher efficacy (lumens per watt), improved color rendering, and greater reliability. For package types like the 3014, trends include:

• Higher Power Density: Ability to drive at higher currents from the same footprint as chip technology improves.
• Improved Color Consistency: Tighter binning specifications and advanced phosphor technology for more uniform color across batches and over lifetime.
• Enhanced Thermal Performance: New package materials and designs to lower thermal resistance, allowing for higher drive currents and longer life.
• Miniaturization: While 3014 is established, there is parallel development in even smaller packages (e.g., 2016, 1515) for ultra-thin displays.
• Smart Integration: The growth of LED drivers with integrated diagnostics and communication (e.g., I2C) for backlight local dimming and control.