T3B Series 3014 White LED Datasheet - Dimensions 3.0x1.4x0.8mm - Voltage 3.1V - Power 0.2W - English Technical Documentation

1. Product Overview

The T3B series is a family of compact, high-performance Surface-Mount Device (SMD) Light Emitting Diodes (LEDs) designed for general lighting applications. This series utilizes a single-chip 0.2W white LED die packaged in the industry-standard 3014 footprint. The primary target markets include backlighting units (BLU) for displays, decorative lighting, indicator lights, and various consumer electronics where reliable, efficient, and consistent white light output is required in a miniaturized form factor.

The core advantages of this series lie in its standardized package size, which facilitates automated assembly processes, and its well-defined binning system for luminous flux, color temperature, and forward voltage. This ensures predictable performance and color consistency in mass production. The product is engineered to operate within a standard industrial temperature range, making it suitable for a wide array of indoor applications.

2. Technical Parameter Analysis

2.1 Absolute Maximum Ratings

The following parameters define the limits beyond which permanent damage to the LED may occur. Operation under these conditions is not guaranteed.

• Forward Current (IF): 80 mA (Maximum continuous current).
• Forward Pulse Current (IFP): 120 mA (Maximum, pulse width ≤10ms, duty cycle ≤1/10).
• Power Dissipation (PD): 288 mW.
• Operating Temperature (Topr): -40°C to +80°C.
• Storage Temperature (Tstg): -40°C to +80°C.
• Junction Temperature (Tj): 125°C (Maximum).
• Soldering Temperature (Tsld): Reflow soldering at 230°C or 260°C for a maximum of 10 seconds.

2.2 Electro-Optical Characteristics

These parameters are measured at a standard test condition of a 25°C solder point temperature (Ts=25°C) and represent typical performance.

• Forward Voltage (VF): 3.1 V (Typical), 3.6 V (Maximum) at IF=60mA.
• Reverse Voltage (VR): 5 V (Maximum).
• Reverse Current (IR): 10 μA (Maximum) at VR=5V.
• Viewing Angle (2θ1/2): 110° (Typical). This wide beam angle is characteristic of the 3014 package without a secondary lens.

3. Binning System Explanation

A comprehensive binning system is implemented to ensure color and brightness consistency. This allows designers to select LEDs that match their specific application requirements.

3.1 Color Temperature (CCT) Binning

The white LEDs are categorized into several Correlated Color Temperature (CCT) bins, each defined by a target value and an elliptical chromaticity region on the CIE 1931 color space diagram. The standard ordering bins for the 3014 series are:

• 27M5: 2725K ±145K (Warm White)
• 30M5: 3045K ±175K (Warm White)
• 40M5: 3985K ±275K (Neutral White)
• 50M5: 5028K ±283K (Cool White)
• 57M7: 5665K ±355K (Cool White)
• 65M7: 6530K ±510K (Cool White)

The nomenclature (e.g., 27M5) indicates the nominal CCT and the size of the MacAdam ellipse (5-step or 7-step) used to define the color tolerance. A smaller ellipse step indicates tighter color control.

3.2 Luminous Flux Binning

Luminous flux is binned based on minimum values at a test current of 60mA. The bins are defined separately for different CCT ranges and Color Rendering Index (CRI) values (70 or 80). For example, for Neutral White (3700-5000K) with CRI 70, the available bins are D3 (20-22 lm min), D4 (22-24 lm min), and D5 (24-26 lm min). It is important to note that the ordering specifies a minimum luminous flux; actual shipped parts may exceed this minimum value but will always remain within the specified chromaticity region.

3.3 Forward Voltage Binning

To aid in circuit design for current regulation, LEDs are also binned by forward voltage (VF) at the operating current. The bins range from code B (2.8-2.9V) to code H (3.4-3.5V), with a typical value of 3.1V corresponding to bin D or E. Matching VF bins can help achieve more uniform brightness in parallel LED strings.

4. Performance Curve Analysis

4.1 Current-Voltage (I-V) Characteristic

The I-V curve shows the relationship between forward voltage and forward current. It is non-linear, typical of a diode. At the recommended operating current of 60mA, the forward voltage is approximately 3.1V. Designers must use a constant-current driver or appropriate current-limiting resistor to ensure the LED operates at the desired current point, as small changes in voltage can lead to large changes in current.

4.2 Relative Luminous Flux vs. Forward Current

This graph illustrates that light output increases with current, but not linearly. While increasing current boosts brightness, it also increases power dissipation and junction temperature, which can affect longevity and color shift. Operating significantly above the recommended 60mA is not advised despite the maximum rating of 80mA, as it accelerates lumen depreciation.

3.3 Spectral Power Distribution & Thermal Effects

The relative spectral power distribution curves are provided for different CCT ranges (warm, neutral, cool white). Cool white LEDs have more energy in the blue region of the spectrum. A separate graph shows the effect of junction temperature on relative spectral energy. As the junction temperature rises, the overall light output typically decreases (lumen depreciation), and for white LEDs based on blue chips with phosphor, there can be a subtle shift in chromaticity. Effective thermal management is crucial to maintain consistent color and light output over the product's lifetime.

5. Mechanical & Package Information

5.1 Package Dimensions

The LED conforms to the 3014 package standard with nominal dimensions of 3.0mm (length) x 1.4mm (width) x 0.8mm (height). Detailed dimensional drawings with tolerances are provided: dimensions noted as .X have a tolerance of ±0.10mm, and .XX have a tolerance of ±0.05mm.

5.2 Pad Layout & Stencil Design

A recommended footprint (land pattern) for PCB design is supplied, showing the anode and cathode pad sizes and spacing to ensure reliable soldering. A corresponding stencil pattern is also provided for solder paste application during Surface-Mount Technology (SMT) assembly. The cathode is typically marked by a green tint on the package or a notch.

6. Soldering, Assembly & Storage Guidelines

6.1 Moisture Sensitivity & Baking

The 3014 package is moisture-sensitive (MSL classified per IPC/JEDEC J-STD-020). If the original vacuum-sealed moisture barrier bag is opened and the LEDs are exposed to ambient humidity, they must be baked before reflow soldering to prevent popcorn cracking or other moisture-induced damage during the high-temperature reflow process.

• Storage: Unopened bags should be stored below 30°C and 85% RH. After opening, parts should be used within the floor life specified by the humidity indicator card inside the bag.
• Baking Conditions: If baking is required (e.g., exceeded floor life), bake at 60°C for 24 hours on the original reel. Do not exceed 60°C. After baking, solder within one hour or store in a dry cabinet (<20% RH).

6.2 Reflow Soldering Profile

The LED can withstand a standard infrared or convection reflow process. The maximum peak temperature at the package should not exceed 260°C, and the time above 230°C should be limited to 10 seconds. A recommended reflow profile with preheat, soak, reflow, and cooling stages should be followed to ensure reliable solder joints without thermal shock to the LED component.

7. Application Notes & Design Considerations

7.1 Circuit Design

Always drive the LED with a constant current source for stable light output. If using a series resistor with a constant voltage supply, calculate the resistor value precisely using the maximum forward voltage from the datasheet to ensure the current does not exceed the maximum rating under worst-case conditions. Consider the forward voltage binning when designing parallel arrays to balance current.

7.2 Thermal Management

Although the power is only 0.2W, effective heat sinking is important for longevity and color stability. Ensure the PCB has adequate thermal relief, especially when operating multiple LEDs closely spaced or near their maximum current. The maximum junction temperature of 125°C should not be exceeded. The thermal resistance from the junction to the solder point (Rth js) is a key parameter for thermal design calculations.

7.3 Optical Integration

The 110-degree viewing angle provides a wide, Lambertian-like emission pattern suitable for area lighting and backlighting diffusers. For applications requiring a more focused beam, secondary optics (lenses or reflectors) must be used. The package has a primary silicone lens, but no integrated secondary optic.

8. Model Numbering Rule

The product naming convention follows a structured format: T [Shape Code] [Chip Qty] [Lens Code] [Color Code] - [Flux Code][Voltage Code].

• Shape Code (3B): Denotes the 3014 package.
• Chip Quantity (S): 'S' for a single small-power chip (0.2W).
• Lens Code (00): '00' indicates no secondary lens (primary lens only).
• Color Code (L/C/W): 'L' for Warm White (<3700K), 'C' for Neutral White (3700-5000K), 'W' for Cool White (>5000K).
• Flux Code (e.g., D3): Specifies the luminous flux bin.
• Voltage Code (e.g., E): Specifies the forward voltage bin.

Example: T3B00SLA-D3E decodes to a 3014 package, single chip, no secondary lens, Warm White LED, with D3 flux bin and E voltage bin.