Table of Contents
- 1. Product Overview
- 1.1 Core Features and Advantages
- 1.2 Target Applications
- 2. In-Depth Technical Parameter Analysis
- 2.1 Absolute Maximum Ratings
- 2.2 Electrical and Optical Characteristics
- 3. Binning System Specification
- 3.1 Luminous Intensity Binning
- 3.2 Dominant Wavelength Binning
- 4. Mechanical and Packaging Information
- 4.1 Outline and Dimensions
- 4.2 Packaging Specification
- 5. Assembly, Handling, and Application Guidelines
- 5.1 Storage and Moisture Sensitivity
- 5.2 Soldering and Assembly Instructions
- 5.3 Application Design Considerations
- 6. Performance Curves and Typical Characteristics
- 7. Technical Comparison and Differentiation
- 8. Frequently Asked Questions (FAQs)
- 9. Design and Usage Case Study
1. Product Overview
This document details the specifications for a bicolor, through-hole mounted LED indicator lamp. The device features a black plastic right-angle housing designed for easy assembly and stackable configurations on printed circuit boards (PCBs). It integrates solid-state light sources offering high efficiency and low power consumption.
1.1 Core Features and Advantages
- Enhanced Contrast: The black housing material provides a high contrast ratio, improving indicator visibility.
- Dual-Color Source: Incorporates AlInGaP semiconductor chips to produce both Yellow and Yellow-Green light from a single package.
- Energy Efficiency: Low power consumption with typical forward voltage of 2.0V at 10mA drive current.
- Environmental Compliance: Lead-free construction and fully compliant with RoHS directives.
- Manufacturing Friendly: Supplied in tape-and-reel packaging compatible with automated assembly processes. Preconditioned to JEDEC Level 3 and rated MSL3 for moisture sensitivity.
1.2 Target Applications
This component is suitable for status indication and backlighting in a variety of electronic equipment, including:
- Communication devices
- Computer peripherals and motherboards
- Consumer electronics
- Home appliances
2. In-Depth Technical Parameter Analysis
All specifications are defined at an ambient temperature (TA) of 25°C unless otherwise stated.
2.1 Absolute Maximum Ratings
Stresses beyond these limits may cause permanent damage to the device.
- Power Dissipation (Pd): 52 mW (for both Yellow and Yellow-Green LEDs)
- Continuous Forward Current (IF): 20 mA DC
- Peak Forward Current (IFP): 60 mA (pulse width ≤ 10μs, duty cycle ≤ 1/10)
- Operating Temperature Range: -40°C to +85°C
- Storage Temperature Range: -40°C to +100°C
- Lead Soldering Temperature: 260°C maximum for 5 seconds, measured 2.0mm from the LED body.
2.2 Electrical and Optical Characteristics
The following table summarizes the key performance parameters when driven at a standard test current of 10mA.
Optical Parameters:
- Luminous Intensity (Iv): Typical value is 11 mcd for both colors, with a range from 4 mcd (Min) to 29 mcd (Max). Intensity is measured using a sensor filtered to the CIE photopic eye-response curve.
- Viewing Angle (2θ1/2): 110 degrees. This wide viewing angle is achieved through a white diffused lens, ensuring good visibility from off-axis positions.
- Peak Wavelength (λP): Approximately 574 nm for Yellow-Green and 590 nm for Yellow.
- Dominant Wavelength (λd): Defines the perceived color. For Yellow-Green: 569 nm (Typ), range 565-572 nm. For Yellow: 590 nm (Typ), range 582-594 nm.
- Spectral Bandwidth (Δλ): Approximately 20 nm for both colors, indicating relatively pure spectral output.
Electrical Parameters:
- Forward Voltage (VF): Typical value is 2.0V, ranging from 1.6V (Min) to 2.5V (Max) at 10mA. This parameter is crucial for current-limiting resistor calculation in circuit design.
- Reverse Current (IR): Maximum 10 μA when a reverse voltage (VR) of 5V is applied. Important: The device is not designed for operation under reverse bias; this test condition is for characterization only.
3. Binning System Specification
To ensure color and brightness consistency in production, LEDs are sorted into bins based on luminous intensity and dominant wavelength.
3.1 Luminous Intensity Binning
Two intensity bins are defined for each color, with a tolerance of ±30% on bin limits.
- Bin A: 4 mcd to 13 mcd @ 10mA
- Bin B: 13 mcd to 29 mcd @ 10mA
3.2 Dominant Wavelength Binning
Wavelength bins provide tight control over the emitted color, with a tolerance of ±1nm on bin limits.
For Yellow-Green:
- Bin 1: 565 nm to 569 nm
- Bin 2: 569 nm to 572 nm
For Yellow:
- Bin 1: 582 nm to 588 nm
- Bin 2: 588 nm to 594 nm
The specific bin codes for intensity and wavelength are marked on the product packaging, allowing designers to select parts matching their application's requirements for brightness and color uniformity.
4. Mechanical and Packaging Information
4.1 Outline and Dimensions
The device uses a right-angle through-hole mounting style. Key dimensional notes:
- All dimensions are in millimeters.
- Standard tolerance is ±0.25mm unless specified otherwise on the dimensional drawing.
- Housing material is black plastic.
- The LED features a white diffused lens.
4.2 Packaging Specification
The components are supplied in an industry-standard tape-and-reel format for automated insertion.
- Carrier Tape: Black conductive polystyrene alloy, 0.50 mm ± 0.06 mm thick.
- Reel Capacity: 500 pieces per 13-inch reel.
- Packing Hierarchy:
- 500 pieces on 1 reel are placed in a Moisture Barrier Bag (MBB) with desiccants and a humidity indicator card.
- 2 MBBs (1000 pieces total) are packed in an Inner Carton.
- 10 Inner Cartons (10,000 pieces total) are packed in an Outer Carton for shipment.
5. Assembly, Handling, and Application Guidelines
5.1 Storage and Moisture Sensitivity
This product is rated MSL3. Adherence to the following procedures is critical to prevent moisture-induced damage during solder reflow.
- Sealed Package: Store at ≤ 30°C and ≤ 70% RH. Use within one year of bag seal.
- Opened Package: If the Moisture Barrier Bag is opened, the components must be stored at ≤ 30°C and ≤ 60% RH.
- Floor Life: After opening the original bag, components should be subjected to IR reflow soldering within 168 hours (7 days).
- Extended Storage/Baking: For storage beyond 168 hours outside the original bag, store in a sealed container with desiccant. Before assembly, bake at 60°C for at least 48 hours to remove absorbed moisture.
5.2 Soldering and Assembly Instructions
- Lead Forming: If required, bend leads at a point at least 3mm away from the base of the LED lens. Do not use the lens base as a fulcrum. Perform forming before soldering at room temperature.
- PCB Assembly: Apply minimum clinching force during insertion to avoid mechanical stress on the component.
- Soldering: Maintain a minimum distance of 2mm between the base of the lens/housing and the solder point on the lead. Do not immerse the lens in solder or cleaning solvent.
- Cleaning: If post-assembly cleaning is necessary, use only alcohol-based solvents like isopropyl alcohol.
5.3 Application Design Considerations
- Current Limiting: Always use a series resistor to limit the forward current to the recommended 20mA DC maximum. Calculate resistor value using R = (Vsupply - VF) / IF, where VF is the typical or maximum forward voltage from the datasheet.
- Thermal Management: While power dissipation is low, ensure the operating ambient temperature does not exceed 85°C. Avoid placing the LED near other heat-generating components.
- Reverse Voltage Protection: As the LED is not designed for reverse bias, ensure circuit design prevents the application of reverse voltage, for example, when using in an AC or bipolar driving circuit. A protection diode in parallel (reverse-biased) may be necessary.
- Visual Design: The 110-degree viewing angle and diffused lens provide wide, even illumination. The black housing minimizes light piping and improves contrast, making it suitable for panel-mounted indicators.
6. Performance Curves and Typical Characteristics
The datasheet includes graphical representations of key relationships, which are essential for detailed design analysis.
- Relative Luminous Intensity vs. Forward Current: Shows how light output increases with current, typically in a sub-linear manner at higher currents due to heating effects.
- Forward Voltage vs. Forward Current: Illustrates the diode's I-V characteristic, important for understanding voltage requirements under different drive conditions.
- Relative Luminous Intensity vs. Ambient Temperature: Demonstrates the reduction in light output as junction temperature rises, a critical factor for high-temperature applications.
- Spectral Distribution: Graphs showing the relative radiant power versus wavelength for both Yellow and Yellow-Green LEDs, highlighting the peak and dominant wavelengths.
These curves allow designers to predict performance under non-standard conditions (e.g., different drive currents or temperatures) and to optimize their circuits for efficiency and longevity.
7. Technical Comparison and Differentiation
This bicolor through-hole LED offers specific advantages in its category:
- Versatility in One Package: The integration of two distinct colors (Yellow and Yellow-Green) in a single right-angle package saves board space and simplifies inventory compared to using two separate single-color LEDs.
- Optimized for Visibility: The combination of a wide-viewing diffused lens and a high-contrast black housing is specifically designed for status indication where viewing angle and clarity are paramount.
- Robust Construction for Through-Hole: The design considerations for lead forming and soldering clearance indicate a component built for the physical demands of through-hole assembly and potential manual handling.
- Standardized Binning: The clear binning structure for both intensity and wavelength supports applications requiring tight color and brightness matching across multiple units.
8. Frequently Asked Questions (FAQs)
Q1: What is the difference between Peak Wavelength (λP) and Dominant Wavelength (λd)?
A1: Peak Wavelength is the wavelength at which the emitted optical power is maximum. Dominant Wavelength is derived from the color coordinates on the CIE chromaticity diagram and represents the single wavelength of the pure spectral color that matches the perceived color of the LED. λd is often more relevant for color specification.
Q2: Can I drive this LED at 20mA continuously?
A2: Yes, 20mA DC is the maximum continuous forward current rating. For reliable long-term operation, it is often advisable to drive LEDs at a lower current, such as 10-15mA, to reduce thermal stress and increase lifespan, especially if high ambient temperatures are expected.
Q3: The MSL is rated Level 3. What does this mean for my production process?
A3: Moisture Sensitivity Level 3 means the package can be exposed to factory floor conditions (≤ 30°C / 60% RH) for up to 168 hours (7 days) after the moisture barrier bag is opened before it requires baking prior to reflow soldering. You must track the time the bag is opened and follow the baking instructions if the time limit is exceeded.
Q4: How do I interpret the bin codes when ordering?
A4: You would typically specify the required combination of luminous intensity bin (A or B) and dominant wavelength bin (1 or 2) for your desired color (Yellow or Yellow-Green). For example, \"Yellow, Bin B2\" would specify a Yellow LED with higher brightness (13-29 mcd) and a dominant wavelength between 588-594 nm. Consult the manufacturer for available combinations.
9. Design and Usage Case Study
Scenario: Designing a Dual-Status Indicator for a Network Router
A designer needs two status indicators on a front panel: one for \"Power On\" (steady Yellow) and one for \"Network Activity\" (blinking Yellow-Green). Space is limited.
Solution: Using one LTL-R14FGSAJH61T LED per indicator.
- Circuit Design: Two independent drive circuits are created from a 5V rail. For each LED, a current-limiting resistor is calculated. Using the typical VF of 2.0V at 10mA: R = (5V - 2.0V) / 0.01A = 300Ω. A standard 330Ω resistor would provide approximately 9.1mA, a safe and efficient drive current.
- Microcontroller Interface: The cathodes of the two LEDs (likely common) are grounded. The anodes for the Yellow and Yellow-Green chips are connected to separate GPIO pins of a microcontroller via the 330Ω resistors. The MCU can turn the Yellow LED on steadily and blink the Yellow-Green LED to indicate activity.
- Mechanical Implementation: The right-angle housing allows the LEDs to be mounted on the main PCB parallel to the board, with the lenses pointing up through holes in the router's front panel. The black housing prevents light bleed between the two closely mounted indicators.
- Part Selection: To ensure consistent appearance across thousands of units, the designer specifies all LEDs for the \"Power On\" indicator to be from the same wavelength and intensity bin (e.g., Yellow, Bin A1).
This approach saves board area, simplifies assembly using auto-insertion for the tape-and-reel parts, and provides a clean, professional indicator solution.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |