LTLR14FGFAJH213T Bicolor LED Lamp Datasheet - Orange/Yellow-Green - 20mA - 52mW - Through-Hole Package - English Technical Document

1. Product Overview

The LTLR14FGFAJH213T is a bicolor, through-hole LED lamp designed for use as a Circuit Board Indicator (CBI). It features a black plastic right-angle housing that mates with the LED component, enhancing contrast ratio for improved visibility. The device is part of a family of indicators available in various configurations, including top-view and right-angle orientations, with stackable and easy-to-assembly designs suitable for creating horizontal or vertical arrays on printed circuit boards (PCBs).

1.1 Key Features

• Designed for ease of circuit board assembly and integration.
• Black housing material provides a high contrast ratio against the illuminated LED.
• Features low power consumption and high luminous efficiency.
• Manufactured as a lead-free product and is compliant with RoHS (Restriction of Hazardous Substances) directives.
• Emits light in two colors: Orange and Yellow-Green, utilizing AlInGaP (Aluminum Indium Gallium Phosphide) technology for the semiconductor material.
• Incorporates a white diffused lens for a uniform, wide-angle light distribution.
• Supplied in tape and reel packaging for automated assembly processes.

1.2 Target Applications

This LED lamp is engineered for reliability and performance across a broad spectrum of electronic equipment. Its primary application domains include:

• Computer Systems: Status indicators on motherboards, servers, network switches, and peripheral devices.
• Communication Equipment: Signal and status indicators in routers, modems, telecommunication infrastructure, and networking hardware.
• Consumer Electronics: Power, mode, and function indicators in audio/video equipment, home appliances, and personal electronics.
• Industrial Controls: Panel indicators for machinery, control systems, instrumentation, and automation equipment where clear visual feedback is critical.

2. Technical Parameters: In-Depth Objective Interpretation

The following sections provide a detailed, objective analysis of the device's technical specifications as defined in the datasheet. All parameters are specified at an ambient temperature (TA) of 25°C unless otherwise noted.

2.1 Absolute Maximum Ratings

Absolute maximum ratings define the stress limits beyond which permanent damage to the device may occur. These are not operating conditions.

• Power Dissipation (PD): 52 mW (for both Orange and Yellow-Green colors). This is the maximum amount of power the device can dissipate as heat without degradation.
• Peak Forward Current (IF(peak)): 60 mA. This current can only be applied under pulsed conditions with a duty cycle ≤ 1/10 and a pulse width ≤ 10µs. Exceeding this in DC operation will damage the LED.
• DC Forward Current (IF): 20 mA. This is the recommended continuous forward current for normal operation to achieve the specified optical characteristics.
• Operating Temperature Range (Topr): -30°C to +85°C. The device is guaranteed to function within this ambient temperature range.
• Storage Temperature Range (Tstg): -40°C to +100°C. The device can be stored without applied power within this range.
• Lead Soldering Temperature: 260°C for a maximum of 5 seconds, measured at a distance of 2.0mm (0.079\") from the LED body. This defines the thermal profile tolerance for hand or wave soldering processes.

2.2 Electrical and Optical Characteristics

These parameters define the typical performance of the device under normal operating conditions (IF=20mA, TA=25°C).

• Luminous Intensity (Iv):
  • Orange: Typical value is 140 mcd. The datasheet specifies a minimum of 23 mcd, but the typical performance is significantly higher. The actual delivered intensity is subject to a binning classification (see Section 4).
  • Yellow-Green: The typical value is also listed as 140 mcd, following the same binning structure as the Orange LED.
  • Measurement Note: Intensity is measured using a sensor and filter combination that approximates the CIE photopic eye-response curve, ensuring the value correlates with human visual perception.
• Viewing Angle (2θ1/2): 100 degrees (typical for both colors). This is the full angle at which the luminous intensity drops to half of its peak (axial) value. The white diffused lens is responsible for this wide viewing characteristic.
• Peak Emission Wavelength (λP):
  • Orange: 611 nm (typical).
  • Yellow-Green: 575 nm (typical).
  • This is the wavelength at which the spectral power distribution of the emitted light is at its maximum.
• Dominant Wavelength (λd):
  • Orange: Range from 598 nm (Min) to 612 nm (Max), with a typical value of 605 nm.
  • Yellow-Green: Range from 565 nm (Min) to 571 nm (Max), with a typical value of 569 nm.
  • The dominant wavelength is derived from the CIE chromaticity diagram and represents the perceptual color of the light, which is the single wavelength that best matches the color sensation.
• Spectral Line Half-Width (Δλ):
  • Orange: 17 nm (typical).
  • Yellow-Green: 15 nm (typical).
  • This parameter indicates the spectral purity or bandwidth of the emitted light, measured as the full width at half maximum (FWHM) of the emission peak.
• Forward Voltage (VF):
  • Orange: Range from 2.1V (Min) to 2.6V (Typ). A maximum value is not specified in the provided table.
  • Yellow-Green: Assumed to be similar, though not explicitly stated separately in the provided excerpt.
• Reverse Current (IR): 10 µA (maximum) when a reverse voltage (VR) of 5V is applied. Critical Note: The datasheet explicitly states that \"The device is not designed for reverse operation.\" This test condition is for characterization only; applying reverse bias in circuit design is not recommended.

3. Binning System Specification

To ensure color and brightness consistency in production, LEDs are sorted into bins. The LTLR14FGFAJH213T uses a dual-bin code system for both luminous intensity and dominant wavelength.

3.1 Luminous Intensity Binning

Both the Orange and Yellow-Green LEDs are binned into three intensity grades, identified by a two-letter code (AB, CD, EF). The bin code for intensity is marked on the packing bag.

• Bin AB: 23 mcd (Min) to 50 mcd (Max).
• Bin CD: 50 mcd (Min) to 85 mcd (Max).
• Bin EF: 85 mcd (Min) to 140 mcd (Max).
• Tolerance: Each bin limit has a tolerance of ±30% during testing.

3.2 Dominant Wavelength Binning

The LEDs are also binned by their dominant wavelength (color point) using a numerical code.

For Yellow-Green:

• Bin 1: 565.0 nm to 568.0 nm.
• Bin 2: 568.0 nm to 571.0 nm.

For Orange (referred to as Amber in the bin table):

• Bin 3: 598.0 nm to 605.0 nm.
• Bin 4: 605.0 nm to 612.0 nm.

Tolerance: Each wavelength bin limit has a tolerance of ±1 nm.

Design Implication: For applications requiring tight color or brightness matching (e.g., multi-indicator panels), designers should specify the desired bin codes or implement circuit-level calibration to compensate for variations.

4. Performance Curve Analysis

The datasheet references typical electrical and optical characteristic curves. While the specific graphs are not reproduced in the provided text, they typically include the following essential relationships:

• Forward Current vs. Forward Voltage (I-V Curve): Shows the exponential relationship between current and voltage for a semiconductor diode. The curve will have a specific \"knee\" voltage (around 2.1-2.6V) beyond which current increases rapidly with a small increase in voltage. A current-limiting resistor is mandatory in series with the LED to prevent thermal runaway.
• Luminous Intensity vs. Forward Current: Demonstrates how light output increases with forward current. It is generally linear within the recommended operating range (up to 20mA) but will saturate and eventually degrade at higher currents due to efficiency droop and heating.
• Luminous Intensity vs. Ambient Temperature: Illustrates the negative temperature coefficient of LED efficiency. As the junction temperature rises, the luminous output typically decreases. The wide operating temperature range (-30°C to +85°C) indicates the device is designed to maintain functionality across this span, though with varying output.
• Spectral Distribution: A plot of relative intensity versus wavelength, showing the peak emission wavelength (λP) and the spectral half-width (Δλ). The Orange LED's spectrum will be centered around 611 nm, and the Yellow-Green around 575 nm.

5. Mechanical and Packaging Information

5.1 Outline Dimensions and Construction

The device consists of a black or dark gray plastic housing (holder) with integrated leads for through-hole mounting. The LED component itself is an Orange/Yellow-Green bicolor chip with a white diffused lens. Key mechanical notes from the datasheet include:

• All dimensions are provided in millimeters, with inches in parentheses.
• A general tolerance of ±0.25mm (±0.010\") applies unless a specific feature calls out a different tolerance.
• The exact mechanical drawing showing lead spacing, body dimensions, and lens profile is referenced in the datasheet (implied by \"Outline Dimensions\" section).

5.2 Packaging Specification

The device is supplied in an industry-standard tape and reel format for automated insertion equipment.

• Carrier Tape:
  • Material: Black Conductive Polystyrene Alloy.
  • Thickness: 0.50 mm ±0.06 mm.
  • 10-sprocket-hole pitch cumulative tolerance: ±0.20 mm.
• Reel: Standard 13-inch (330mm) diameter reel.
• Quantity per Reel: 500 pieces.
• Master Carton Packaging:
  • 2 reels (1000 pcs total) are packed with a humidity indicator card and desiccants into one Moisture Barrier Bag (MBB).
  • 1 MBB is packed into 1 inner carton (1000 pcs/box).
  • 10 inner cartons are packed into 1 outer shipping carton (10,000 pcs total).

6. Soldering and Assembly Guidelines

Proper handling is critical to ensure reliability and prevent damage to the LED.

6.1 Storage Conditions

• Sealed Package (MBB): Store at ≤30°C and ≤70% Relative Humidity (RH). The components are rated for use within one year from the date code while the MBB remains sealed.
• Opened Package: If the MBB is opened, the storage environment must not exceed 30°C and 60% RH.
• Floor Life: Components removed from their original MBB should undergo IR reflow soldering within 168 hours (7 days).
• Extended Storage/Baking: If components are stored out of the original packaging for more than 168 hours, they must be baked at approximately 60°C for at least 48 hours before the SMT assembly (reflow) process to drive out absorbed moisture and prevent \"popcorning\" or delamination during soldering.

6.2 Lead Forming and PCB Assembly

• Bend leads at a point at least 3mm from the base of the LED lens.
• Do not use the base of the lead frame as a fulcrum during bending.
• All lead forming must be completed before soldering and at room temperature.
• During insertion into the PCB, use the minimum clinch force necessary to avoid imposing excessive mechanical stress on the LED body or leads.

6.3 Soldering Process

• Maintain a minimum clearance of 2mm between the base of the lens and the solder point on the lead.
• Avoid immersing the lens into solder during wave soldering.
• Do not apply any external stress to the leads while the LED is at an elevated temperature from soldering.
• Recommended Soldering Condition: The datasheet specifies a maximum of 260°C for 5 seconds when measured 2.0mm from the body. This is compatible with standard wave or hand soldering profiles.

6.4 Cleaning

If post-assembly cleaning is required, use only alcohol-based solvents such as isopropyl alcohol (IPA). Avoid aggressive or ultrasonic cleaning that could damage the plastic housing or lens.

7. Application Suggestions and Design Considerations

7.1 Typical Application Circuits

The most basic driving circuit for a single-color operation involves a current-limiting resistor in series with the LED, connected to a DC voltage supply (Vcc). The resistor value (R) can be calculated using Ohm's Law: R = (Vcc - VF) / IF, where VF is the forward voltage of the LED (use 2.6V for a conservative design) and IF is the desired forward current (20 mA max). For example, with a 5V supply: R = (5V - 2.6V) / 0.020A = 120 Ohms. A standard 120Ω or 150Ω resistor would be suitable. For bicolor operation, two independent current-limiting circuits are typically used, often with a common cathode or common anode configuration, controlled by logic signals or switches.

7.2 Design Considerations

• Current Driving: Always drive LEDs with a constant current or use a series resistor for current limitation. Direct connection to a voltage source will destroy the LED.
• Heat Management: While power dissipation is low (52mW), ensure adequate spacing and possible airflow if used in high-density arrays or high ambient temperatures to maintain junction temperature within limits.
• Optical Design: The wide 100-degree viewing angle makes it suitable for front-panel indicators where viewing is not strictly axial. The black housing minimizes stray light and improves contrast.
• Polarity: Observe correct anode/cathode orientation during PCB layout and assembly. Reverse connection will block current flow (the LED will not light) and, if voltage exceeds the reverse breakdown rating, may cause damage.

8. Technical Comparison and Differentiation

The LTLR14FGFAJH213T offers several distinct advantages in its category:

• Bicolor in a Single Package: Integrates two distinct colors (Orange and Yellow-Green), saving PCB space and simplifying assembly compared to using two separate single-color LEDs.
• Right-Angle Housing: The built-in right-angle holder directs light parallel to the PCB plane, ideal for edge-lit or side-view indicators, unlike top-view LEDs that emit light perpendicular to the board.
• AlInGaP Technology: For the Orange and Yellow-Green colors, AlInGaP semiconductors generally offer higher efficiency and better temperature stability compared to older technologies like GaAsP, resulting in brighter and more consistent output.
• Diffused Lens: The white diffused lens provides a uniform, soft light appearance without a visible die hotspot, enhancing aesthetic quality and viewability from wider angles.

9. Frequently Asked Questions (Based on Technical Parameters)

Q1: What is the difference between Peak Wavelength (λP) and Dominant Wavelength (λd)?
A1: Peak Wavelength is the physical wavelength where the LED emits the most optical power. Dominant Wavelength is a calculated value based on human color perception (CIE chart) that best represents the perceived color. For monochromatic LEDs like these, they are often close, but λd is the more relevant parameter for color specification.

Q2: Can I drive this LED at 30mA for more brightness?
A2: No. The Absolute Maximum Rating for continuous DC forward current is 20mA. Operating at 30mA exceeds this rating, which will significantly reduce lifespan, cause rapid efficiency degradation, and likely lead to catastrophic failure. Always adhere to the recommended operating conditions.

Q3: The bin table shows intensity up to 140mcd, but the characteristics table lists a typical of 140mcd. Which is correct?
A3: Both are. The \"Typical\" value in the characteristics table represents the expected performance of devices from the highest bin (EF). The bin table defines the sorting ranges. Not all devices will perform at the typical value; they will be distributed across the AB, CD, and EF bins.

Q4: Why is the storage and baking requirement so strict?
A4> The plastic packaging of the LED can absorb moisture from the atmosphere. During the rapid heating of reflow soldering, this trapped moisture can vaporize explosively, causing internal cracks (delamination) or \"popcorning\" that destroys the device. The Moisture Barrier Bag (MBB), desiccants, and baking procedures are all designed to control moisture content and ensure soldering reliability.

10. Operational Principles and Technology Trends

10.1 Basic Operating Principle

A Light Emitting Diode (LED) is a semiconductor p-n junction diode. When a forward voltage is applied, electrons from the n-type region and holes from the p-type region are injected into the junction region. When these charge carriers recombine, they release energy in the form of photons (light). The specific wavelength (color) of the emitted light is determined by the energy bandgap of the semiconductor material used. For the Orange and Yellow-Green colors in this device, Aluminum Indium Gallium Phosphide (AlInGaP) is the active material, which allows for efficient emission in the red to yellow-green spectrum. The bicolor functionality is achieved by having two semiconductor chips (one for each color) housed within the same package.

10.2 Industry Trends

The through-hole LED market, while mature, continues to evolve alongside surface-mount technology (SMT). Through-hole components like the LTLR14FGFAJH213T remain vital for applications requiring high mechanical robustness, easier manual prototyping, repair, and in scenarios where wave soldering is the primary assembly process. Trends in this segment include a continued shift towards higher efficiency materials (like AlInGaP over GaAsP), improved color consistency through tighter binning, and the integration of multiple colors or functions into single packages. Furthermore, there is a sustained emphasis on reliability and extended lifetime, driven by demands from industrial, automotive, and infrastructure applications. The packaging is also evolving to be more compatible with automated through-hole insertion machines while maintaining cost-effectiveness.