Through Hole Bicolor LED Lamp LTL-R14FGFAJR3HKP Datasheet - Dimensions 5.0x2.5x2.0mm - Voltage 2.6V - Power 0.052W - Yellow Green/Orange - English Technical Document

1. Product Overview

This document details the technical specifications for the LTL-R14FGFAJR3HKP, a through-hole mounted bicolor LED lamp. The device is designed as a Circuit Board Indicator (CBI), featuring a black plastic right-angle holder (housing) that integrates with the LED light source. This design facilitates easy assembly onto printed circuit boards (PCBs) and is available in configurations suitable for various viewing angles and array layouts.

1.1 Core Features and Advantages

• Ease of Assembly: The design is optimized for straightforward and efficient circuit board assembly processes.
• Enhanced Contrast: The black housing material improves the contrast ratio of the illuminated indicator against its background.
• Solid-State Reliability: Utilizes solid-state light source technology for improved longevity and shock resistance compared to traditional bulbs.
• Energy Efficiency: Offers low power consumption and high luminous efficiency.
• Environmental Compliance: This is a lead-free product and complies with RoHS (Restriction of Hazardous Substances) directives.
• Light Source: Incorporates bicolor AlInGaP (Aluminum Indium Gallium Phosphide) chips, providing yellow green emission at approximately 569nm and orange emission at approximately 605nm, housed under a white diffused lens.

1.2 Target Applications

This LED lamp is suitable for a wide range of electronic equipment and indicator applications, including but not limited to:

• Communication equipment
• Computer systems and peripherals
• Consumer electronics
• Industrial control and instrumentation panels

2. Technical Parameters: In-Depth Objective Interpretation

2.1 Absolute Maximum Ratings

The following ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.

• Power Dissipation (P_D): 52 mW (for both colors)
• Peak Forward Current (I_FP): 60 mA (Duty Cycle ≤ 1/10, Pulse Width ≤ 10μs)
• DC Forward Current (I_F): 20 mA
• Operating Temperature Range (T_opr): -40°C to +85°C
• Storage Temperature Range (T_stg): -45°C to +100°C
• Lead Soldering Temperature: 260°C maximum for 5 seconds, measured 2.0mm (0.079") from the body of the component.

2.2 Electrical and Optical Characteristics

These parameters are specified at an ambient temperature (T_A) of 25°C and a test forward current (I_F) of 10mA, unless otherwise noted.

• Luminous Intensity (I_v): Typical value is 38 mcd for both yellow green and orange, with a range from 14 mcd (Min.) to 65 mcd (Max.). A ±30% testing tolerance is applied to guaranteed intensity values.
• Viewing Angle (2θ_1/2): Approximately 110 degrees, defined as the off-axis angle where luminous intensity drops to half its axial value.
• Peak Emission Wavelength (λ_P): Yellow Green: 574 nm (typical). Orange: 611 nm (typical).
• Dominant Wavelength (λ_d): Yellow Green: 568 nm (typical, range 563-570 nm). Orange: 605 nm (typical, range 598-613 nm). This is the single wavelength perceived by the human eye that defines the color.
• Spectral Line Half-Width (Δλ): Yellow Green: 15 nm (typical). Orange: 17 nm (typical). This indicates the spectral purity of the emitted light.
• Forward Voltage (V_F): Typical value is 2.1V for both colors, with a maximum of 2.6V at I_F = 10mA.
• Reverse Current (I_R): Maximum 10 μA for both colors when a reverse voltage (V_R) of 5V is applied. Important Note: The device is not designed for operation in reverse bias; this test condition is for characterization only.

3. Binning System Explanation

The LEDs are sorted (binned) based on key optical parameters to ensure consistency within an application. The bin tables provide reference ranges.

3.1 Luminous Intensity Binning

Both yellow green and orange LEDs are grouped into three intensity bins (AB, CD, EF) when measured at I_F = 10mA.

• Bin AB: 14 mcd (Min.) to 23 mcd (Max.)
• Bin CD: 23 mcd (Min.) to 38 mcd (Max.)
• Bin EF: 38 mcd (Min.) to 65 mcd (Max.)
• Tolerance: ±30% applies to the limits of each bin.

3.2 Dominant Wavelength Binning

LEDs are also binned by their dominant wavelength to control color consistency.

• Yellow Green:
  • Bin 5: 563.0 nm to 567.0 nm
  • Bin 6: 567.0 nm to 570.0 nm
• Orange:
  • Bin 3: 598.0 nm to 605.0 nm
  • Bin 4: 605.0 nm to 613.0 nm
• Tolerance: ±1 nm applies to the limits of each wavelength bin.

4. Performance Curve Analysis

Typical performance curves illustrate the relationship between key parameters. These are essential for design simulation and understanding device behavior under non-standard conditions.

• Forward Current vs. Forward Voltage (I-V Curve): Shows the exponential relationship, critical for designing current-limiting circuits.
• Forward Current vs. Luminous Intensity: Demonstrates how light output increases with current, up to the maximum rated limits.
• Ambient Temperature vs. Relative Luminous Intensity: Illustrates the decrease in light output as junction temperature rises, a key consideration for thermal management.
• Spectral Distribution: Graphs the relative radiant power versus wavelength, showing the peak and dominant wavelengths and spectral width.
• Viewing Angle Pattern: A polar plot depicting the spatial distribution of luminous intensity.

Note: The specific graphical data from these curves should be referenced from the original datasheet for precise numerical design.

5. Mechanical and Package Information

5.1 Outline Dimensions

The device features a right-angle through-hole package. Key dimensional notes include:

• All primary dimensions are in millimeters (with inches in parentheses).
• Standard tolerance is ±0.25mm (0.010") unless specified otherwise.
• The holder/housing is constructed from black plastic rated UL 94V-0 for flammability resistance.
• The package accommodates three LED chips (LED1~LED3) which are yellow green/orange bicolor types with a white diffused lens.

Note: The exact dimensional drawing with specific measurements (e.g., lead spacing, body height, etc.) must be obtained from the detailed outline diagram in the original datasheet.

6. Soldering and Assembly Guidelines

6.1 Storage and Handling

• Storage: Recommended storage conditions are ≤30°C and ≤70% relative humidity. LEDs removed from their original packaging should be used within three months. For longer storage, use a sealed container with desiccant or a nitrogen ambient.
• Cleaning: Use alcohol-based solvents like isopropyl alcohol if cleaning is necessary.

6.2 Lead Forming and PCB Assembly

• Bend leads at a point at least 3mm from the base of the LED lens. Do not use the lens base as a fulcrum.
• Perform all lead forming at room temperature and before the soldering process.
• During PCB insertion, apply minimal clinching force to avoid imposing excessive mechanical stress on the component.

6.3 Soldering Process

Maintain a minimum distance of 2mm from the base of the lens/holder to the solder point. Avoid immersing the lens/holder in solder.

• Hand Soldering (Iron): Maximum temperature 350°C for a maximum of 3 seconds, one time only.
• Wave Soldering:
  • Pre-heat: Max 120°C for up to 100 seconds.
  • Solder Wave: Max 260°C for up to 5 seconds.
  • Do not dip the component lower than 2mm from the base of the epoxy bulb.
• Reflow Soldering Profile (Reference):
  • Preheat/Soak: 150°C to 200°C over a maximum of 100 seconds.
  • Time Above Liquidous (T_L=217°C): 60 to 90 seconds.
  • Peak Temperature (T_P): 250°C maximum.
  • Time within 5°C of Specified Classification Temp (T_C=245°C): 30 seconds maximum.
  • Total time from 25°C to peak temperature: 5 minutes maximum.

Warning: Excessive soldering temperature or time can deform the lens or cause catastrophic LED failure.

6.4 Drive Method

LEDs are current-operated devices. To ensure uniform brightness when connecting multiple LEDs in parallel, it is essential to use individual current-limiting resistors for each LED or a dedicated constant-current driver circuit. Driving LEDs directly from a voltage source without current regulation is not recommended and will lead to inconsistent performance and potential overcurrent damage.

7. Packaging and Ordering Information

7.1 Packing Specification

The device is supplied in industry-standard packaging to facilitate automated assembly and protect the components. The packing specification typically details:

• The carrier tape width, pocket dimensions, and reel diameter.
• The quantity of devices per reel.
• The structure of the packaging (e.g., devices reeled in ammo packs, placed in inner cartons, and then outer cartons).

Note: The specific packing details (e.g., reel size, quantities per pack/carton) are defined in the dedicated packing specification section of the original datasheet and may be subject to change.

8. Application Notes and Design Considerations

8.1 Recommended Application Scope

This LED lamp is suitable for general indicator applications in both indoor and outdoor signage, as well as standard electronic equipment. Its bicolor nature allows for status indication (e.g., power on/standby, mode selection) using a single component footprint.

8.2 Design Considerations

• Current Limiting: Always use a series resistor or constant-current driver. Calculate the resistor value using R = (V_supply - V_F) / I_F, where V_F is the maximum forward voltage from the datasheet (2.6V) to ensure safe operation under all conditions.
• Thermal Management: Although power dissipation is low, maintaining the LED junction within its specified temperature range ensures long-term reliability and stable light output. Avoid placing the LED near other heat-generating components.
• Reverse Voltage Protection: As the device is not designed for reverse bias, ensure the circuit design prevents the application of any reverse voltage across the LED.
• Optical Design: The 110-degree viewing angle and white diffused lens provide a wide, evenly illuminated appearance, suitable for panel indicators.

9. Technical Comparison and Differentiation

While a direct comparison requires specific competitor data, this device's key differentiating features based on its datasheet include:

• Bicolor in Single Package: Integrates two distinct colors (Yellow Green and Orange) into one standard through-hole package, saving PCB space compared to using two separate single-color LEDs.
• Right-Angle Holder Design: The integrated black right-angle housing simplifies assembly and provides built-in contrast enhancement, eliminating the need for a separate light pipe or spacer in many applications.
• AlInGaP Technology: The use of AlInGaP chips for both colors typically offers high luminous efficiency and good temperature stability for these specific wavelengths.
• Detailed Binning: Provides separate binning for both intensity and dominant wavelength for each color, allowing for tighter color and brightness matching in critical applications.

10. Frequently Asked Questions (Based on Technical Parameters)

1. Q: What is the difference between peak wavelength and dominant wavelength?
   A: Peak wavelength (λ_P) is the wavelength at which the emitted optical power is maximum. Dominant wavelength (λ_d) is derived from the color coordinates and represents the single wavelength that best matches the color perceived by the human eye. Designers typically use dominant wavelength for color specification.
2. Q: Can I drive this LED at 20mA like many standard LEDs?
   A: The Absolute Maximum Rating for DC forward current is 20mA. However, the Electrical/Optical Characteristics are specified at 10mA. For reliable long-term operation and to stay within the 52mW power dissipation limit, it is recommended to design for a forward current of 10mA or less, as used for the specification data.
3. Q: Why is there a ±30% tolerance on luminous intensity bin limits?
   A: This accounts for measurement system variability during production testing. It means a device tested at the minimum bin limit (e.g., 14 mcd) could measure between approximately 9.8 mcd and 18.2 mcd on a different calibrated system. Designers should use the minimum value from the bin for worst-case brightness calculations.
4. Q: How do I achieve the different colors?
   A: The bicolor LED contains two different semiconductor chips. Applying forward current to one set of leads will illuminate the yellow green chip. Applying forward current to the other set (with correct polarity) will illuminate the orange chip. The circuit must be designed to control current flow through the appropriate chip.
5. Q: Is a heat sink required?
   A: Given the low power dissipation (52mW max), a dedicated heat sink is generally not required for most applications within the specified operating temperature range. Proper PCB layout and avoiding enclosed, unventilated spaces are usually sufficient.

11. Practical Application Examples

• Network Router Status Panel: Use the yellow green LED to indicate "Power On/Active" and the orange LED to indicate "Standby/Data Activity". The right-angle design allows the light to be directed sideways for optimal panel visibility.
• Industrial Control Box: Implement the LED as a multi-state indicator on a control board. For example, steady yellow green for "System Normal", flashing orange for "Warning", and alternating colors for a specific fault code.
• Consumer Audio Equipment: Utilize the bicolor function to show input source selection (e.g., orange for "AUX", yellow green for "Bluetooth") on a front display using a single component footprint.

12. Operating Principle

Light Emitting Diodes (LEDs) are semiconductor devices that emit light through electroluminescence. When a forward voltage is applied across the p-n junction of the semiconductor material (in this case, AlInGaP), electrons recombine with holes within the device, releasing energy in the form of photons. The specific wavelength (color) of the emitted light is determined by the bandgap energy of the semiconductor material. The yellow green and orange colors are produced by different compositions of the AlInGaP alloy, creating chips with distinct bandgap energies corresponding to those wavelengths. The white diffused lens encapsulates the chip, provides environmental protection, and scatters the light to create a wider, more uniform viewing angle.

13. Technology Trends

The field of indicator LEDs continues to evolve. While through-hole packages remain vital for prototyping, repair, and certain industrial applications, there is a clear industry trend towards surface-mount device (SMD) packages for high-volume automated assembly due to their smaller size and lower profile. Furthermore, advancements in semiconductor materials, such as the development of more efficient and color-stable phosphor-converted LEDs, continue to expand the available color gamut and improve the performance of all LED types, including indicator lamps. The integration of multiple colors and functions into single packages, as seen with this bicolor device, is a response to the demand for higher component density and more sophisticated user interfaces on electronic products.