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LTL-R42FTGYH106PT Bicolor LED Lamp Datasheet - Green/Yellow - 525nm/587nm - 20mA/30mA - Through-Hole Package

Technical datasheet for the LTL-R42FTGYH106PT bicolor (Green/Yellow) through-hole LED lamp. Includes specifications, dimensions, electrical/optical characteristics, binning, and application guidelines.
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PDF Document Cover - LTL-R42FTGYH106PT Bicolor LED Lamp Datasheet - Green/Yellow - 525nm/587nm - 20mA/30mA - Through-Hole Package

1. Product Overview

The LTL-R42FTGYH106PT is a bicolor through-hole LED lamp designed for use as a Circuit Board Indicator (CBI). It integrates a black plastic right-angle holder (housing) that mates with two distinct LED chips: one emitting green light and the other emitting yellow light. This component is engineered for straightforward assembly onto printed circuit boards (PCBs) and is supplied in tape and reel packaging for automated placement.

1.1 Core Advantages

1.2 Target Applications

This LED lamp is suitable for a variety of electronic equipment requiring status or indicator functions. Primary application areas include:

2. In-Depth Technical Parameter Analysis

All specifications are defined at an ambient temperature (TA) of 25°C unless otherwise stated. Understanding these parameters is critical for reliable circuit design.

2.1 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. Operation under or at these limits is not guaranteed.

Parameter Green LED Yellow LED Unit
Power Dissipation 70 78 mW
Peak Forward Current (Duty Cycle ≤1/10, Pulse Width ≤0.1ms) 60 60 mA
DC Forward Current 20 30 mA
Operating Temperature Range -30°C to +85°C
Storage Temperature Range -40°C to +100°C
Lead Soldering Temperature (2.0mm from body) 260°C for 5 seconds max.

2.2 Electrical & Optical Characteristics

These are the typical operating parameters under specified test conditions.

Parameter Symbol Color Min. Typ. Max. Unit Test Condition
Luminous Intensity Iv Green 180 420 880 mcd IF=10mA
Luminous Intensity Iv Yellow 180 400 880 mcd IF=20mA
Viewing Angle (2θ1/2) - Green - 100 - deg -
Viewing Angle (2θ1/2) - Yellow - 65 - deg -
Peak Emission Wavelength λP Green - 526 - nm -
Peak Emission Wavelength λP Yellow - 588 - nm -
Dominant Wavelength λd Green 516 525 535 nm IF=10mA
Dominant Wavelength λd Yellow 584 587 594 nm IF=20mA
Spectral Line Half-Width Δλ Green - 35 - nm -
Spectral Line Half-Width Δλ Yellow - 15 - nm -
Forward Voltage VF Green - 2.9 3.3 V IF=10mA
Forward Voltage VF Yellow - 2.0 2.6 V IF=20mA
Reverse Current IR Green/Yellow - - 10 μA VR=5V

Key Notes:

2.3 Thermal Characteristics

The specified operating and storage temperature ranges ensure long-term reliability. The power dissipation ratings (70mW for Green, 78mW for Yellow) must be considered in conjunction with ambient temperature to prevent junction temperature from exceeding safe limits, which can degrade light output and lifespan.

3. Binning System Explanation

To ensure color and brightness consistency in production, LEDs are sorted into bins based on key parameters. The LTL-R42FTGYH106PT uses separate binning for luminous intensity and dominant wavelength.

3.1 Green LED Binning

Luminous Intensity @ 10mA:

Dominant Wavelength @ 10mA:

3.2 Yellow LED Binning

Luminous Intensity @ 20mA:

Dominant Wavelength @ 20mA:

4. Performance Curve Analysis

The datasheet references typical performance curves which illustrate the relationship between key parameters. While the specific graphs are not reproduced here, their implications are critical for design.

4.1 Forward Current vs. Luminous Intensity (I-V Curve)

This curve shows that luminous intensity is approximately proportional to forward current within the recommended operating range. Driving the LED above its rated current leads to super-linear increase in light output but also significantly increases junction temperature and accelerates degradation.

4.2 Temperature Dependence

LED light output typically decreases as junction temperature rises. The green InGaN and yellow AlInGaP chips will have different temperature coefficients. Designers must account for this derating in applications with high ambient temperatures or poor thermal management to ensure consistent brightness.

4.3 Spectral Distribution

The spectral curves for each color show the concentration of emitted light around the peak wavelength (526nm for green, 588nm for yellow). The narrower half-width for yellow (15nm typical) indicates a more spectrally pure color compared to green (35nm typical).

5. Mechanical & Packaging Information

5.1 Outline Dimensions

The component features a right-angle through-hole design. Critical dimensional notes include:

5.2 Polarity Identification

Correct polarity is essential for operation. The datasheet drawing indicates the anode and cathode leads for each LED within the common housing. Designers must reference the physical drawing to identify the pinout correctly for PCB layout.

5.3 Packaging Specification

The device is supplied in an industry-standard tape and reel format for automated assembly.

6. Soldering & Assembly Guidelines

Adherence to these guidelines is mandatory to prevent mechanical or thermal damage.

6.1 Storage Conditions

For long-term storage, maintain an environment not exceeding 30°C and 70% relative humidity. Components removed from their original sealed, moisture-barrier packaging should be used within three months. For extended storage outside the original package, use a sealed container with desiccant or a nitrogen ambient.

6.2 Cleaning

If cleaning is necessary after soldering, use only alcohol-based solvents such as isopropyl alcohol. Avoid aggressive or unknown chemical cleaners.

6.3 Lead Forming

6.4 Soldering Process

A minimum clearance of 2mm must be maintained between the solder point and the base of the lens/holder. Never immerse the lens into solder.

Recommended Soldering Conditions:

Method Parameter Limit
Soldering Iron Temperature 350°C Max.
Time 3 seconds Max. (one time only)
Position No closer than 2mm from base
Wave Soldering Pre-heat Temperature 120°C Max.
Pre-heat Time 100 seconds Max.
Solder Wave Temperature 260°C Max.
Soldering Time 5 seconds Max.
Dipping Position No lower than 2mm from base

Warning: Excessive temperature or time can cause lens deformation or catastrophic LED failure.

7. Application & Design Considerations

7.1 Drive Circuit Design

LEDs are current-driven devices. To ensure uniform brightness when driving multiple LEDs in parallel, it is essential to use a individual current-limiting resistor in series with each LED. Driving LEDs directly from a voltage source without current regulation leads to uneven brightness and potential overcurrent damage due to the natural variation in forward voltage (Vf) from device to device.

7.2 Thermal Management

While the through-hole design offers some heat sinking via the leads, applications operating at high ambient temperatures or at the maximum forward current should consider the PCB layout. Providing adequate copper area around the lead insertion points on the PCB can help dissipate heat and maintain stable performance.

7.3 Optical Considerations

The different viewing angles (100° for green, 65° for yellow) mean the yellow LED will have a more focused beam. This should be considered if the indicator needs to be visible from wide angles. The black housing improves contrast by absorbing stray light, making the illuminated LED easier to see.

8. Technical Comparison & Differentiation

The LTL-R42FTGYH106PT offers specific advantages in its category:

9. Frequently Asked Questions (FAQ)

9.1 Can I drive both LEDs simultaneously?

Yes, but they must be driven independently with separate current-limiting resistors, as they have different forward voltage (Vf) and recommended operating current (10mA for green, 20mA for yellow) characteristics.

9.2 What is the difference between peak wavelength and dominant wavelength?

Peak wavelength (λP) is the wavelength at which the spectral power distribution is maximum. Dominant wavelength (λd) is the single wavelength perceived by the human eye, calculated from the CIE chromaticity coordinates. λd is more relevant for color specification.

9.3 How do I select the correct current-limiting resistor?

Use Ohm's Law: R = (V_supply - Vf_LED) / I_LED. For the green LED at 10mA with a typical Vf of 2.9V and a 5V supply: R = (5 - 2.9) / 0.01 = 210 Ω. Always calculate for the worst-case (minimum Vf) to ensure current does not exceed the maximum rating.

9.4 Is this LED suitable for outdoor use?

The datasheet states it is good for indoor and outdoor signs. However, for harsh outdoor environments with prolonged UV exposure, wide temperature swings, and moisture, the specific lens material's weatherability and the integrity of the housing seal should be verified for the intended lifetime.

10. Design-in Case Study

Scenario: Designing a status panel for an industrial router with Power, Network Activity, and System Error indicators. Space is limited.

Implementation: A single LTL-R42FTGYH106PT can serve a dual-purpose indicator slot. The green LED can indicate "Power On / Normal Operation." The yellow LED can be programmed to indicate "Network Activity" (blinking) or "System Warning" (steady). This consolidates two indicator functions into one footprint, simplifying the front panel design and PCB layout. The right-angle emission is perfect for a panel where the PCB is mounted perpendicular to the viewing surface.

11. Operational Principle

Light Emitting Diodes (LEDs) are semiconductor devices that emit light through electroluminescence. When a forward voltage is applied across the p-n junction, electrons recombine with holes, releasing energy in the form of photons. The wavelength (color) of the emitted light is determined by the energy bandgap of the semiconductor material. The green LED uses an Indium Gallium Nitride (InGaN) chip, while the yellow LED uses an Aluminium Indium Gallium Phosphide (AlInGaP) chip, each chosen for their specific bandgap energies corresponding to their respective colors.

12. Technology Trends

While through-hole LEDs remain vital for prototyping, serviceable equipment, and certain industrial applications, the broader industry trend is towards surface-mount device (SMD) packages like 0603, 0402, and even smaller for higher density. SMDs enable fully automated assembly, smaller form factors, and better thermal performance to the PCB. However, through-hole components like the LTL-R42FTGYH106PT offer superior mechanical strength, easier manual handling for low-volume production, and often higher single-point brightness, ensuring their continued relevance in specific market segments.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.