T-1 3mm Diffused Blue LED Lamp - 468nm Peak Wavelength - 3.0V Forward Voltage - 102mW Power Dissipation - English Technical Datasheet

1. Product Overview

This document provides the complete technical specifications for a high-efficiency, blue light-emitting diode (LED) in a popular T-1 (3mm) through-hole package. The device features a diffused lens, which provides a wider and more uniform light distribution compared to clear lenses, making it suitable for indicator and backlighting applications where soft, non-glaring illumination is desired. The core advantages of this LED include its compliance with RoHS directives, indicating it is manufactured without the use of hazardous substances like lead, its low power consumption, and high reliability. It is designed for versatile mounting on printed circuit boards (PCBs) or panels and is compatible with integrated circuit (IC) drive levels due to its low current requirement.

2. In-Depth Technical Parameter Analysis

2.1 Absolute Maximum Ratings

The absolute maximum ratings define the stress limits beyond which permanent damage to the device may occur. These ratings are specified at an ambient temperature (T_A) of 25°C and must not be exceeded under any operating conditions.

• Power Dissipation (P_D): 102 mW. This is the maximum amount of power the LED can dissipate as heat.
• Peak Forward Current (I_FP): 60 mA. This is the maximum allowable current under pulsed conditions, defined at a 1/10 duty cycle and a 0.1ms pulse width. It is significantly higher than the DC rating, allowing for brief, high-intensity flashes.
• DC Forward Current (I_F): 30 mA. This is the maximum continuous forward current recommended for reliable long-term operation.
• Current Derating: Linear derating of 0.5 mA/°C from 30°C. For ambient temperatures above 30°C, the maximum allowable DC forward current must be reduced to prevent overheating.
• Operating Temperature Range: -30°C to +80°C. The device is guaranteed to function within this ambient temperature range.
• Storage Temperature Range: -40°C to +100°C. The device can be stored without degradation within these limits.
• Lead Soldering Temperature: 260°C for 5 seconds, measured 2.0mm (0.8\") from the LED body. This defines the acceptable thermal profile for hand or wave soldering processes.

2.2 Electrical and Optical Characteristics

These parameters are measured at T_A=25°C and I_F=20mA, which is the standard test condition. They define the typical performance of the device.

• Luminous Intensity (I_V): 85 (Min), 180 (Typ), 520 (Max) mcd. This is a measure of the perceived brightness of the LED to the human eye, measured using a sensor filtered to match the CIE photopic response curve. The wide range indicates a binning system is used (detailed in Section 3).
• Viewing Angle (2θ_1/2): 45° (Typ). This is the full angle at which the luminous intensity drops to half of its value at the central axis (0°). The diffused lens creates this wide viewing angle.
• Peak Emission Wavelength (λ_P): 468 nm (Typ). This is the wavelength at which the optical power output is maximum.
• Dominant Wavelength (λ_d): 465 nm (Min), 475 nm (Max). This is derived from the CIE chromaticity diagram and represents the single wavelength that best defines the perceived color (blue) of the LED. It is also subject to binning.
• Spectral Line Half-Width (Δλ): 20 nm (Typ). This indicates the spectral purity or bandwidth of the emitted light.
• Forward Voltage (V_F): 3.0 V (Typ), 3.4 V (Max). The voltage drop across the LED when driven at 20mA.
• Reverse Current (I_R): 10 μA (Max) at V_R=5V. The LED is not designed for reverse operation; this parameter is for leakage characterization only.
• Capacitance (C): 40 pF (Typ) at V_F=0V, f=1 MHz. This is the junction capacitance, relevant for high-speed switching applications.

3. Binning System Specification

To ensure consistency in brightness and color for production applications, LEDs are sorted into bins. This allows designers to select parts that meet specific minimum performance criteria.

3.1 Luminous Intensity Binning

Units: mcd @ 20mA. Tolerance for each bin limit is ±15%.

• Bin E: 85 – 110 mcd
• Bin F: 110 – 140 mcd
• Bin G: 140 – 180 mcd
• Bin H: 180 – 240 mcd
• Bin J: 240 – 310 mcd
• Bin K: 310 – 400 mcd
• Bin L: 400 – 520 mcd

The specific bin code for luminous intensity is marked on the product packaging.

3.2 Dominant Wavelength Binning

Units: nm @ 20mA. Tolerance for each bin limit is ±1 nm.

• Bin B08: 465 – 470 nm
• Bin B09: 470 – 475 nm

4. Performance Curve Analysis

While specific graphs are referenced in the datasheet (Fig.1, Fig.6), typical curves for such LEDs illustrate key relationships:

• I-V (Current-Voltage) Curve: Shows the exponential relationship between forward current and forward voltage. The knee voltage is around 2.8V-3.0V for blue LEDs.
• Relative Luminous Intensity vs. Forward Current: Brightness increases approximately linearly with current up to a point, after which efficiency may drop due to heating.
• Relative Luminous Intensity vs. Ambient Temperature: Luminous output typically decreases as ambient temperature increases. The derating factor of 0.5 mA/°C is applied to manage this thermal effect.
• Spectral Distribution: A plot of relative intensity versus wavelength, showing a peak around 468nm with a typical half-width of 20nm.
• Viewing Angle Pattern: A polar plot showing the Lambertian or near-Lambertian distribution characteristic of a diffused lens, with intensity tapering to half at ±22.5° from the axis.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED is housed in a standard T-1 package with a 3mm diameter diffused lens. Key dimensional notes include:

• All dimensions are in millimeters (inches are provided in parentheses).
• Standard tolerance is ±0.25mm (±0.010\") unless otherwise specified.
• The maximum protrusion of resin under the flange is 1.0mm (0.04\").
• Lead spacing is measured at the point where the leads emerge from the package body.

5.2 Polarity Identification

For through-hole LEDs, the cathode is typically identified by a flat spot on the lens rim, a shorter lead, or a notch on the flange. The datasheet diagram should be consulted for the specific polarity marking of this component. Correct polarity is essential for operation.

6. Soldering and Assembly Guidelines

6.1 Lead Forming

• Bending must be performed at a point at least 3 mm from the base of the LED lens.
• The base of the lead frame must not be used as a fulcrum during bending.
• Lead forming must be done at room temperature and before the soldering process.
• During PCB assembly, use the minimum clinching force necessary to avoid imposing excessive mechanical stress on the LED package.

6.2 Soldering Process

Critical: A minimum clearance of 3 mm must be maintained from the base of the lens to the soldering point. Dipping the lens into solder must be avoided to prevent epoxy from climbing up the lead frame, which can cause soldering issues.

Recommended Conditions:

• Soldering Iron: Temperature: 300°C Max. Time: 3 seconds Max. (one-time soldering only).
• Wave Soldering: Pre-heat: 100°C Max. for 60 sec Max. Solder Wave: 260°C Max. for 5 sec Max.

Important Note: Excessive soldering temperature and/or time can cause deformation of the LED lens or catastrophic failure. Infrared (IR) reflow soldering is not a suitable process for this through-hole LED type.

6.3 Cleaning

If cleaning is required, use only alcohol-based solvents such as isopropyl alcohol.

6.4 Storage

• The recommended storage environment should not exceed 30°C and 70% relative humidity.
• LEDs removed from their original, moisture-protective packaging should be used within three months.
• For extended storage outside the original packaging, store in a sealed container with desiccant or in a nitrogen-purged desiccator.

7. Packaging and Ordering Information

7.1 Packaging Specification

The LEDs are packed in anti-static bags to prevent electrostatic discharge (ESD) damage.

• Packing Bag: 1000, 500, or 250 pieces per bag.
• Inner Carton: 10 packing bags per carton (total 10,000 pcs).
• Outer Carton: 8 inner cartons per outer carton (total 80,000 pcs).
• Note: In every shipping lot, only the final pack may contain a non-full quantity.

8. Application Design Recommendations

8.1 Drive Circuit Design

LEDs are current-operated devices. To ensure uniform brightness when driving multiple LEDs in parallel, it is strongly recommended to use a individual current-limiting resistor in series with each LED (Circuit Model A). Driving multiple LEDs in parallel from a single voltage source with a shared resistor (Circuit Model B) is not recommended, as slight variations in the forward voltage (V_F) of each LED will cause significant differences in current and, consequently, brightness.

8.2 Electrostatic Discharge (ESD) Protection

This LED is susceptible to damage from electrostatic discharge. The following precautions must be observed during handling and assembly:

• Operators should wear a conductive wrist strap or anti-static gloves.
• All equipment, workbenches, and storage racks must be properly grounded.
• Use ionizers to neutralize static charges in the work area.

8.3 Application Scope and Limitations

This LED is designed for use in ordinary electronic equipment, including office equipment, communication devices, and household appliances. It is not specifically designed or qualified for applications where high reliability is critical to safety, such as in aviation, transportation, traffic control, medical/life-support systems, or safety devices. For such applications, consultation with the manufacturer for appropriately qualified components is mandatory.

9. Technical Comparison and Design Considerations

Compared to clear-lens T-1 LEDs, this diffused version offers a much wider and softer light pattern, eliminating the \"hot spot\" effect. This makes it superior for panel indicators where viewing from multiple angles is required. The 468nm blue wavelength is a common choice for status indicators, backlighting, and decorative lighting. Designers must carefully consider thermal management, especially when operating near the maximum current rating or in elevated ambient temperatures, utilizing the provided derating curve. The forward voltage of ~3.0V requires a drive voltage higher than that needed for standard red or green LEDs, which must be accounted for in power supply design.

10. Frequently Asked Questions (FAQ)

Q: Can I drive this LED directly from a 5V supply?

A: No. With a typical V_F of 3.0V at 20mA, a series current-limiting resistor is required. Using Ohm's Law: R = (V_supply - V_F) / I_F. For a 5V supply and 20mA target: R = (5V - 3.0V) / 0.02A = 100 Ω. A resistor of 100Ω (or the nearest standard value) must be used.

Q: What is the difference between Peak Wavelength and Dominant Wavelength?

A: Peak Wavelength (λ_P) is the physical wavelength of highest spectral power output. Dominant Wavelength (λ_d) is a calculated value based on human color perception (CIE chart) that best represents the perceived color. For monochromatic LEDs like this blue one, they are often close but not identical.

Q: Why is a separate resistor needed for each LED in parallel?

A: The forward voltage of LEDs can vary slightly from unit to unit, even within the same bin. Without individual resistors, LEDs with a lower V_F will draw disproportionately more current, leading to uneven brightness and potential overstress of the lower-V_F units.

Q: Is this LED suitable for automotive interior lighting?

A: While it may function, this standard datasheet does not indicate qualification for the extended temperature ranges, vibration, and reliability standards required for automotive applications. Components specifically qualified to automotive-grade standards (e.g., AEC-Q102) should be used for such purposes.

11. Practical Application Example

Scenario: Designing a multi-indicator panel for a piece of test equipment. Four blue status LEDs are needed to show different operational modes (Standby, Testing, Pass, Fail). Uniform brightness is critical for user experience.

Design Implementation:

1. Circuit: Use a microcontroller GPIO pin to drive each LED. Each pin will connect to a 100Ω current-limiting resistor, then to the anode of the LED. The LED cathodes will connect to ground.
2. Component Selection: Specify LEDs from the same luminous intensity bin (e.g., Bin G: 140-180 mcd) and the same dominant wavelength bin (e.g., B08: 465-470nm) to ensure color and brightness consistency on the panel.
3. Layout: Place the LEDs on the PCB with the recommended 3mm minimum bend radius for the leads. Ensure the soldering points on the PCB are at least 3mm away from the LED body.
4. Software: Drive the GPIO pins high (e.g., 3.3V or 5V) to turn on the respective LEDs. The 100Ω resistor will set the current to approximately (3.3V-3.0V)/100Ω = 3mA or (5V-3.0V)/100Ω = 20mA, depending on the supply voltage, providing safe and controlled illumination.

12. Operating Principle

A light-emitting diode is a semiconductor p-n junction device. When a forward voltage exceeding the junction's built-in potential is applied, electrons from the n-type region and holes from the p-type region are injected into the junction region. When these charge carriers recombine, energy is released. In this specific LED, the semiconductor material (typically based on indium gallium nitride, InGaN) is engineered so that this energy is released in the form of photons (light) with a wavelength in the blue spectrum (~468 nm). The diffused epoxy lens surrounding the semiconductor chip contains scattering particles that randomize the direction of the emitted photons, creating a wide, uniform viewing angle instead of a narrow beam.

13. Technology Trends

The development of efficient blue LEDs, for which the Nobel Prize in Physics was awarded in 2014, was a foundational breakthrough enabling white LED lighting (via phosphor conversion) and full-color displays. Current trends in indicator-type LEDs like this one focus on increasing efficiency (more light output per watt), improving color consistency through tighter binning, and enhancing reliability. There is also a continuous drive for miniaturization (smaller than T-1) and the integration of LEDs into surface-mount device (SMD) packages, which dominate modern automated assembly lines. However, through-hole LEDs remain relevant for prototyping, educational use, repair work, and applications requiring robust mechanical mounting.