Green Through-Hole LED Lamp 525nm - 3.0mm Dia. - 2.4-3.3V - 64mW - English Technical Document

1. Product Overview

This document details the specifications for a green through-hole LED lamp designed for use in a right-angle black plastic holder (CBI - Circuit Board Indicator). The product is a solid-state light source offering low power consumption and high efficiency. It is a lead-free product compliant with RoHS directives. The emitted color is green with a dominant wavelength of 525nm, utilizing InGaN technology. The device is supplied in tape and reel packaging for automated assembly processes.

1.1 Core Advantages

• Designed for ease of circuit board assembly.
• Solid-state reliability with long operational life.
• Low power consumption and high luminous efficiency.
• Environmentally friendly, lead-free, and RoHS compliant construction.
• Available in a stackable, right-angle holder format for versatile mounting.
• Supplied in tape and reel for efficient high-volume production.

1.2 Target Applications

This LED is suitable for a wide range of applications across multiple industries, including:

• Computer peripherals and status indicators.
• Communication equipment.
• Consumer electronics.
• Industrial control panels and machinery.

2. In-Depth Technical Parameter Analysis

2.1 Absolute Maximum Ratings

The following ratings define the limits beyond which permanent damage to the device may occur. All values are specified at an ambient temperature (TA) of 25°C.

• Power Dissipation (Pd): 64 mW - The maximum power the LED can safely dissipate as heat.
• Peak Forward Current (IFP): 60 mA - Permissible only under pulsed conditions (duty cycle ≤ 1/10, pulse width ≤ 10μs).
• DC Forward Current (IF): 20 mA - The maximum continuous forward current recommended for reliable operation.
• Operating Temperature Range: -30°C to +85°C - The ambient temperature range for normal device function.
• Storage Temperature Range: -40°C to +100°C - The safe temperature range for the device when not in operation.
• Lead Soldering Temperature: 260°C for 5 seconds maximum, measured 2.0mm from the LED body. This is critical for wave or hand soldering processes.

2.2 Electrical & Optical Characteristics

These parameters define the typical performance of the LED under standard test conditions (TA=25°C, IF=10mA unless noted).

• Luminous Intensity (Iv): 180 to 880 mcd. This wide range is managed through a binning system (see Section 4). The measurement uses a sensor/filter approximating the CIE photopic eye-response curve.
• Viewing Angle (2θ1/2): 100 degrees. This is the full angle at which the luminous intensity drops to half of its axial (on-axis) value, indicating a relatively wide viewing pattern typical for a diffused lens.
• Peak Emission Wavelength (λP): 530 nm (typical). The wavelength at which the spectral power distribution is maximum.
• Dominant Wavelength (λd): 525 to 535 nm. This is the single wavelength perceived by the human eye that defines the color of the LED, derived from the CIE chromaticity diagram.
• Spectral Line Half-Width (Δλ): 25 nm (typical). The spectral bandwidth measured at half the maximum intensity, indicating the color purity.
• Forward Voltage (VF): 2.4 to 3.3 V at 10mA. This range must be considered when designing the current-limiting circuit.
• Reverse Current (IR): 10 μA maximum at VR=5V. Important: The device is not designed for reverse bias operation; this test condition is for characterization only.

3. Binning System Specification

To ensure color and brightness consistency in production, LEDs are sorted into bins. Designers must specify bin codes when ordering to guarantee performance within a defined range.

3.1 Luminous Intensity Binning

Binning is performed at a forward current of 10mA. The tolerance for each bin limit is ±15%.

• Bin HJ: 180 mcd (Min) to 310 mcd (Max)
• Bin KL: 310 mcd (Min) to 520 mcd (Max)
• Bin MN: 520 mcd (Min) to 880 mcd (Max)

3.2 Dominant Wavelength Binning

Binning is performed at a forward current of 10mA. The tolerance for each bin limit is ±1nm.

• Bin G09: 516.0 nm (Min) to 520.0 nm (Max)
• Bin G10: 520.0 nm (Min) to 527.0 nm (Max)
• Bin G11: 527.0 nm (Min) to 535.0 nm (Max)

4. Performance Curve Analysis

While specific graphical curves are referenced in the datasheet, the following interpretations are based on standard LED behavior and the provided parameters:

4.1 Forward Current vs. Forward Voltage (I-V Curve)

The forward voltage (VF) has a specified range of 2.4V to 3.3V at 10mA. The I-V characteristic is exponential. Operating the LED above its rated current will cause a significant increase in forward voltage and power dissipation, potentially exceeding the maximum ratings. A constant current driver is strongly recommended over a constant voltage source to ensure stable luminous output and longevity.

4.2 Luminous Intensity vs. Forward Current

Luminous intensity is approximately proportional to the forward current within the recommended operating range. However, efficiency may decrease at very high currents due to increased thermal effects. The specified Iv values are at 10mA; driving at the maximum DC current of 20mA will yield higher intensity but must be done with careful thermal management.

4.3 Temperature Dependence

The luminous intensity of LEDs typically decreases as the junction temperature increases. While the datasheet provides operating temperature limits (-30°C to +85°C), the actual light output at the upper limit will be lower than at 25°C. For applications requiring stable brightness over a wide temperature range, thermal design on the PCB and potential brightness compensation in the drive circuit should be considered.

5. Mechanical & Packaging Information

5.1 Outline Dimensions and Assembly

The LED is designed to mate with a specific right-angle black plastic holder. Key mechanical notes include:

• All dimensions are in millimeters, with a general tolerance of ±0.25mm unless otherwise specified.
• The holder material is black plastic.
• The LED lamp itself features a green diffused lens.
• For assembly, the leads must be bent at a point at least 3mm from the base of the LED lens. The base of the lead frame should not be used as a fulcrum during bending.

5.2 Packaging Specification

The device is supplied in an industry-standard tape and reel format.

• Carrier Tape: Made of black conductive polystyrene alloy, with a thickness of 0.50 ±0.06 mm.
• Reel Capacity: 400 pieces per 13-inch reel.
• Carton Packaging:
  • 1 reel is packed with a desiccant and humidity indicator card in a Moisture Barrier Bag (MBB).
  • 2 MBBs (800 pcs total) are packed in an Inner Carton.
  • 10 Inner Cartons (8,000 pcs total) are packed in an Outer Carton.

6. Soldering & Assembly Guidelines

6.1 Storage and Handling

• Sealed Package: Store at ≤30°C and ≤70% RH. Use within one year of opening the moisture-proof bag.
• Opened Package: Store at ≤30°C and ≤60% RH. Components should be IR-reflowed within 168 hours (1 week) of exposure. For storage beyond 168 hours, bake at 60°C for at least 48 hours before soldering to prevent moisture-induced damage ("popcorning") during reflow.

6.2 Soldering Process

A minimum clearance of 2mm must be maintained between the base of the lens/holder and the solder point.

• Soldering Iron: Maximum temperature 350°C, maximum time 3 seconds per joint. Apply only once.
• Wave Soldering: Maximum pre-heat temperature 120°C for up to 100 seconds. Maximum solder wave temperature 260°C for a maximum of 5 seconds.
• Cleaning: Use alcohol-based solvents like isopropyl alcohol if necessary. Avoid harsh chemicals.

6.3 Application Cautions

• This LED is suitable for indoor/outdoor signage and general electronic equipment.
• Avoid applying external stress to the leads during soldering while the LED is hot.
• Use minimum clinch force during PCB assembly to avoid mechanical stress on the component.
• Excessive soldering temperature or time can deform the LED lens and damage the internal die.

7. Design Considerations & Application Notes

7.1 Circuit Design

Always use a series current-limiting resistor or a constant-current driver circuit. Calculate the resistor value using the formula: R = (Vsupply - VF) / IF, where VF should be taken as the maximum value from the datasheet (3.3V) to ensure the current does not exceed the limit even with a low-VF LED. For a 5V supply and 10mA target current, the resistor would be approximately (5V - 3.3V) / 0.01A = 170 Ω. A standard 180 Ω resistor would be a safe choice.

7.2 Thermal Management

Although power dissipation is low (64mW max), ensuring adequate heat dissipation from the LED junction extends lifespan and maintains brightness stability. The right-angle plastic holder provides some isolation, but the PCB layout should avoid placing the LED near other significant heat sources. For applications running at the maximum DC current (20mA), thermal considerations become more important.

7.3 Optical Integration

The 100-degree viewing angle and diffused lens provide a wide, soft light emission suitable for status indicators that need to be visible from various angles. For applications requiring a more focused beam, secondary optics would be necessary. The green color (525-535nm) is in a region of high sensitivity for the human eye, making it highly effective for attention-grabbing indicators.

8. Technical Comparison & Differentiation

This through-hole LED differentiates itself through its integration with a dedicated right-angle holder (CBI), offering a complete, easy-to-assemble indicator solution. Compared to surface-mount LEDs, through-hole versions like this one often provide superior mechanical strength for applications subject to vibration or manual handling. The specific binning structure for both intensity and wavelength allows for precise color and brightness matching in multi-indicator panels, a key advantage over unbinned or broadly binned commodity LEDs. The comprehensive moisture sensitivity and soldering guidelines also indicate a product designed for robust, reliable manufacturing processes.

9. Frequently Asked Questions (FAQ)

9.1 What is the difference between Peak Wavelength and Dominant Wavelength?

Peak Wavelength (λP) is the physical wavelength at which the LED emits the most optical power. Dominant Wavelength (λd) is a calculated value based on human color perception (CIE chart) that represents the single wavelength we perceive the light to be. For green LEDs, they are often close, but λd is the more relevant parameter for color specification.

9.2 Can I drive this LED at 20mA continuously?

Yes, 20mA is the maximum recommended DC forward current. However, operating at this maximum will generate more heat and may reduce the LED's lifespan compared to operating at a lower current like 10mA. Ensure the ambient temperature is within spec and consider thermal design if many LEDs are used.

9.3 Why is the luminous intensity range so wide (180-880 mcd)?

This is the total possible range across all production. The binning system (HJ, KL, MN) divides this range into smaller, more consistent groups. You must specify your required bin code(s) when ordering to get LEDs within a predictable brightness range for your application.

9.4 Is baking always required if the bag is opened for more than 168 hours?

Yes, baking at 60°C for 48 hours is strongly recommended to drive out absorbed moisture. Skipping this step risks vapor pressure buildup during the high-temperature soldering process, which can cause internal delamination or cracking ("popcorning"), leading to immediate or latent failure.

10. Practical Application Example

Scenario: Designing a multi-status indicator panel for an industrial controller.

A designer needs green "System Normal" indicators on a vertical panel. They choose this LED with the right-angle holder for easy PCB mounting and a clear side-view. To ensure uniform appearance, they specify Bin KL for intensity (310-520 mcd) and Bin G10 for wavelength (520-527 nm) in their purchase order. On the PCB, they place the LEDs with a center-to-center spacing that matches the holder's footprint. The drive circuit uses a 5V rail and 180Ω current-limiting resistors for each LED, setting the current to ~10mA. During assembly, the production team follows the 168-hour floor life rule, baking any exposed reels before wave soldering the board. The result is a panel with consistent, bright green indicators that are clearly visible from the operator's position.

11. Operating Principle

This is a semiconductor light-emitting diode (LED). When a forward voltage exceeding its characteristic forward voltage (VF) is applied, electrons and holes recombine within the active region of the InGaN (Indium Gallium Nitride) semiconductor material. This recombination process releases energy in the form of photons (light). The specific composition of the InGaN alloy determines the bandgap energy, which directly defines the wavelength (color) of the emitted light—in this case, green at approximately 525-535 nm. The diffused epoxy lens encapsulates the semiconductor die, provides mechanical protection, and shapes the light output into a wide viewing angle.

12. Technology Trends

While through-hole LEDs remain vital for robustness and certain assembly types, the broader industry trend is toward surface-mount device (SMD) LEDs due to their smaller size, suitability for automated pick-and-place, and better thermal path to the PCB. However, through-hole versions like this one continue to serve applications requiring higher mechanical bond strength, easier manual prototyping, or specific optical formats (like right-angle viewing). Advancements in phosphor-converted and direct-color semiconductor materials continue to improve the efficiency, color rendering, and maximum brightness of all LED types, including through-hole packages. The emphasis on precise binning and moisture sensitivity handling, as seen in this datasheet, reflects the industry's drive toward higher reliability and consistency in both consumer and industrial electronics.