LTL1NHSJ4D LED Lamp Datasheet - 3.1mm Diameter Package - Amber Diffused - 2.1V Typ - 20mA - English Technical Document

1. Product Overview

This document provides the complete technical specifications for a high-efficiency, through-hole mounted LED lamp. The device is designed for general-purpose indicator applications requiring high luminous output with low power consumption. Its primary features include a compact 3.1mm diameter package, compatibility with integrated circuits due to low current requirements, and versatile mounting options on printed circuit boards or panels. The light source utilizes AlInGaP technology to produce an amber, diffused yellow light output.

2. Technical Parameters Deep Objective Interpretation

2.1 Absolute Maximum Ratings

The device must not be operated beyond the following limits to prevent permanent damage. The maximum power dissipation is 75 mW. The peak forward current, applicable under pulsed conditions (1/10 duty cycle, 0.1ms pulse width), is 60 mA. The maximum continuous DC forward current is 20 mA. The device can withstand a reverse voltage of up to 5 V. The operating temperature range is from -40°C to +85°C, while the storage temperature range extends from -40°C to +100°C. For soldering, the leads can be subjected to a temperature of 260°C for a maximum of 5 seconds, measured 1.6mm from the body of the LED.

2.2 Electrical / Optical Characteristics

All parameters are specified at an ambient temperature (T_A) of 25°C. The luminous intensity (I_V) has a typical value of 700 mcd at a forward current (I_F) of 20 mA, with a minimum of 240 mcd and a maximum of 1150 mcd. The viewing angle (2θ_1/2) is 25 degrees. The peak emission wavelength (λ_P) is 591 nm. The dominant wavelength (λ_d) ranges from 586 nm to 594 nm, with a typical value of 590 nm. The spectral line half-width (Δλ) is 15 nm. The forward voltage (V_F) is typically 2.1 V at 20 mA, ranging from 1.6 V to 2.6 V. The reverse current (I_R) is a maximum of 100 μA at a reverse voltage (V_R) of 5V. It is critical to note that the device is not designed for operation under reverse bias; this test condition is for characterization only.

3. Binning System Explanation

The LEDs are sorted into bins based on luminous intensity and dominant wavelength to ensure consistency in applications. The luminous intensity bins are: JK (240-400 mcd), LM (400-680 mcd), and NP (680-1150 mcd), each with a tolerance of ±15%. The dominant wavelength bins are: H16 (586.0-588.0 nm), H17 (588.0-590.0 nm), H18 (590.0-592.0 nm), and H19 (592.0-594.0 nm), each with a tolerance of ±1 nm. The specific bin code for intensity is marked on each packing bag.

4. Performance Curve Analysis

The datasheet references typical electrical and optical characteristic curves measured at 25°C ambient temperature. These curves visually represent the relationship between key parameters such as forward current vs. forward voltage, luminous intensity vs. forward current, and the spectral distribution of the emitted light. Analyzing these curves is essential for understanding device behavior under different operating conditions, predicting performance at non-standard currents, and designing appropriate drive circuits to achieve desired brightness levels while maintaining efficiency and longevity.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The LED features a standard 3.1mm diameter round package designed for through-hole mounting. Key dimensional tolerances are ±0.25mm unless otherwise specified. The resin under the flange may be protruded or depressed by a maximum of 0.5mm. Lead spacing is measured at the point where the leads emerge from the package body. Detailed mechanical drawings with all critical dimensions are provided in the datasheet for precise PCB layout and mechanical integration.

5.2 Packing Specification

The LEDs are supplied in packing bags containing 1000, 500, 200, or 100 pieces. Ten of these packing bags are combined into an inner carton, totaling 10,000 pieces per inner carton. For larger shipments, eight inner cartons are packed into an outer carton, resulting in a total of 80,000 pieces per outer carton. It is noted that within a shipping lot, only the final pack may not be a full packing unit.

6. Soldering and Assembly Guidelines

Proper handling is crucial for reliability. For storage, the ambient should not exceed 30°C or 70% relative humidity. LEDs removed from their original packaging should be used within three months. For cleaning, only alcohol-based solvents like isopropyl alcohol are recommended. During lead forming, bends must be made at least 3mm from the base of the LED lens, and the operation must be performed at room temperature before soldering. When soldering, a minimum clearance of 2mm must be maintained between the solder point and the lens base. Recommended soldering conditions are: soldering iron temperature max 350°C for max 3 seconds (one time only), or wave soldering with pre-heat max 100°C for max 60 seconds and solder wave temperature max 260°C for max 5 seconds. Infrared (IR) reflow is not suitable for this through-hole LED product.

7. Application Suggestions

7.1 Drive Method

LEDs are current-operated devices. To ensure uniform brightness when connecting multiple LEDs in parallel, it is strongly recommended to use a current-limiting resistor in series with each individual LED. Using a single resistor for a parallel array (Circuit B in the datasheet) is not advised, as slight variations in the forward voltage (V_F) characteristics of each LED can lead to significant differences in current sharing and, consequently, uneven luminous intensity.

7.2 ESD (Electrostatic Discharge) Protection

These devices are sensitive to electrostatic discharge. To prevent damage, personnel should use conductive wrist straps or anti-static gloves. All equipment, worktables, and storage racks must be properly grounded. An ion blower is suggested to neutralize static charges that may accumulate on the plastic lens during handling and storage.

7.3 Intended Use and Cautions

This LED is intended for ordinary electronic equipment in office, communication, and household applications. It is not designed for safety-critical applications where failure could jeopardize life or health (e.g., aviation, medical devices, transportation controls) without prior consultation and specific qualification.

8. Technical Comparison and Design Considerations

Compared to older technologies, the use of AlInGaP material offers higher efficiency and more stable color output over time and temperature. The 3.1mm package is a common industry standard, ensuring compatibility with existing PCB footprints and panel cutouts. The typical forward voltage of 2.1V at 20mA makes it suitable for direct drive from 3.3V or 5V logic supplies with a simple series resistor. Designers must carefully consider heat dissipation, as exceeding the absolute maximum ratings for power, current, or temperature will degrade performance and shorten lifespan. The 25-degree viewing angle indicates a relatively focused beam, suitable for direct line-of-sight indicator applications.

9. Frequently Asked Questions Based on Technical Parameters

Q: What resistor value should I use with a 5V supply?
A: Using Ohm's Law (R = (V_supply - V_F) / I_F) and the typical V_F of 2.1V at 20mA, R = (5 - 2.1) / 0.02 = 145 Ohms. A standard 150 Ohm resistor is a suitable starting point. Always verify actual current in the circuit.

Q: Can I drive this LED at 30mA for more brightness?
A: No. The absolute maximum continuous DC forward current is 20 mA. Exceeding this rating risks permanent damage to the device and violates the specified operating conditions.

Q: The luminous intensity has a wide range (240-1150 mcd). How do I ensure consistent brightness?
A: Utilize the binning system. Specify the required luminous intensity bin (JK, LM, or NP) when ordering to get LEDs within a tighter performance range. The bin code is marked on the packing bag.

Q: Is reverse voltage protection needed?
A: While the device can tolerate up to 5V in reverse, it is not designed for reverse operation. In circuits where reverse voltage is possible (e.g., AC coupling, inductive loads), external protection such as a diode in parallel (cathode to anode) is recommended.

10. Practical Application Case

Consider designing a status indicator panel for a network router with ten identical amber LED indicators. To ensure uniform brightness, each LTL1NHSJ4D LED should be driven individually from the 3.3V microcontroller GPIO pin. A series resistor of approximately 62 Ohms ((3.3V - 2.1V) / 0.02A = 60 Ohms, nearest standard value 62 Ohms) is placed on each LED's anode line. The LEDs are mounted on the PCB with the leads formed 4mm from the body to fit the panel thickness. During assembly, ESD precautions are followed, and soldering is performed with a temperature-controlled iron set to 320°C for 2 seconds per joint. By specifying the LM intensity bin (400-680 mcd), a consistent medium-brightness appearance is achieved across all ten indicators.

11. Principle Introduction

This LED operates on the principle of electroluminescence in a semiconductor diode. The active region is composed of Aluminum Indium Gallium Phosphide (AlInGaP). When a forward voltage is applied, electrons and holes are injected into the active region where they recombine, releasing energy in the form of photons. The specific composition of the AlInGaP alloy determines the bandgap energy, which in turn defines the dominant wavelength of the emitted light, in this case, amber/yellow. The diffused lens material scatters the light, creating a wider, more uniform viewing pattern compared to a clear lens.

12. Development Trends

The general trend in indicator LEDs continues toward higher efficiency (more lumens per watt), which allows for the same luminous output at lower drive currents, reducing power consumption and heat generation. There is also a focus on improving color consistency and stability over temperature and lifetime. While through-hole packages remain popular for prototyping, manual assembly, and certain industrial applications, surface-mount device (SMD) packages are increasingly dominant in automated, high-volume manufacturing due to their smaller size and lower profile. The underlying AlInGaP material technology is mature and offers excellent performance for red, orange, and amber colors.