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LTL1DETBEK5 Through Hole LED Lamp Datasheet - T-1 Package - Blue/Red - 20mA - 3.4V/2.4V - English Technical Document

Complete technical datasheet for the LTL1DETBEK5 through-hole LED lamp. Includes specifications for Blue (InGaN) and Red (AlInGaP) variants, electrical/optical characteristics, binning, packaging, and application guidelines.
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PDF Document Cover - LTL1DETBEK5 Through Hole LED Lamp Datasheet - T-1 Package - Blue/Red - 20mA - 3.4V/2.4V - English Technical Document

1. Product Overview

This document details the specifications for a through-hole LED lamp, identified by part number LTL1DETBEK5. The device is offered in two primary color variants: Blue and Red, utilizing InGaN and AlInGaP semiconductor technologies respectively. It is designed as a general-purpose status indicator lamp suitable for a wide range of electronic applications.

1.1 Core Features

1.2 Target Applications

The LED is suitable for status indication across multiple industries, including:

2. Mechanical & Package Information

The LED is housed in a standard radial leaded, T-1 (5mm) diameter package with a water-clear epoxy lens.

2.1 Outline Dimensions

Key dimensional notes (all in mm, inches in parentheses):

Note: Specifications are subject to change without notice.

3. Absolute Maximum Ratings

Ratings at an ambient temperature (TA) of 25°C. Exceeding these limits may cause permanent damage.

ParameterBlueRedUnit
Power Dissipation9675mW
Peak Forward Current (Duty ≤1/10, Pulse ≤10µs)10090mA
DC Forward Current3030mA
Operating Temperature Range-40°C to +85°C
Storage Temperature Range-40°C to +100°C
Lead Soldering Temp. (1.6mm from body)260°C for 5 seconds max.

4. Electrical & Optical Characteristics

Typical characteristics measured at TA=25°C and IF=20mA, unless otherwise noted.

ParameterSymbolColorMin.Typ.Max.UnitTest Condition
Luminous IntensityIvBlue1805201500mcdIF=20mA (Note 1,4)
Luminous IntensityIvRed4006801900mcdIF=20mA (Note 1,4)
Viewing Angle (2θ1/2)Blue/Red30degNote 2
Peak WavelengthλPBlue468nmAt Peak
Peak WavelengthλPRed632nmAt Peak
Dominant WavelengthλdBlue465470475nmNote 3
Dominant WavelengthλdRed617624627nmNote 3
Spectral Half-WidthΔλBlue22nm
Spectral Half-WidthΔλRed20nm
Forward VoltageVFBlue3.03.4VIF=20mA
Forward VoltageVFRed2.02.4VIF=20mA
Reverse CurrentIRBlue/Red10µAVR=5V (Note 5)

4.1 Characteristic Notes

  1. Luminous Intensity Measurement: Measured with a sensor/filter approximating the CIE photopic eye-response curve.
  2. Viewing Angle (2θ1/2): The off-axis angle where intensity is half the axial (on-axis) intensity.
  3. Dominant Wavelength (λd): Derived from the CIE chromaticity diagram, representing the perceived single wavelength of the color.
  4. Intensity Tolerance: Iv specifications include a ±30% testing tolerance.
  5. Reverse Operation: The device is not designed for reverse bias operation. The VR=5V condition is for IR testing only.

5. Binning System Specification

The LEDs are sorted into bins based on luminous intensity at 20mA. This ensures consistency in brightness for production applications.

5.1 Luminous Intensity Bins

Blue LED BinsRed LED Bins
Bin CodeMin. (mcd)Max. (mcd)Bin CodeMin. (mcd)Max. (mcd)
HJ180310LM400680
KL310520NP6801150
MN520880QR11501900
PQ8801500

Note: Tolerance on each bin limit is ±15%.

6. Packaging Specification

The standard packaging flow is as follows:

7. Application & Handling Guidelines

7.1 Recommended Application

Suitable for indoor/outdoor signage and general electronic equipment status indication.

7.2 Storage Conditions

7.3 Cleaning

Use alcohol-based solvents like isopropyl alcohol if cleaning is necessary.

7.4 Lead Forming & PCB Assembly

7.5 Soldering Instructions

Critical Rule: Maintain a minimum clearance of 2mm from the base of the lens to the solder point. Do not immerse the lens in solder.

Recommended Conditions:

MethodParameterCondition
Soldering IronTemperature350°C Max.
Time3 seconds Max. (one time only)
Position>2mm from lens base
Wave SolderingPre-heat Temperature100°C Max.
Pre-heat Time60 seconds Max.
Solder Wave Temp.260°C Max.
Soldering Time5 seconds Max.
Dipping Position>2mm from lens base

Warning: Excessive temperature or time can deform the lens or cause catastrophic failure. IR reflow is NOT suitable for this through-hole LED product.

7.6 Drive Circuit Design

LEDs are current-operated devices. For uniform brightness when using multiple LEDs:

The series resistor value (R) can be calculated using Ohm's Law: R = (Vsupply - Vf_LED) / Idesired, where Vf_LED is the typical forward voltage from the datasheet and Idesired is the target drive current (e.g., 20mA).

7.7 ESD (Electrostatic Discharge) Precautions

These LEDs are susceptible to damage from static electricity.

8. Performance Curve Analysis & Design Considerations

8.1 Forward Voltage (Vf) vs. Forward Current (If)

The typical curves show the exponential relationship between voltage and current for both blue and red LEDs. The blue LED (InGaN) has a higher typical Vf (~3.4V) compared to the red LED (AlInGaP, ~2.4V) at 20mA. Designers must account for this difference when calculating series resistor values or designing power supplies for multi-color applications.

8.2 Luminous Intensity vs. Forward Current

Intensity is approximately proportional to forward current in the normal operating range. Driving the LED above the recommended DC current (30mA) will increase light output but also increase power dissipation and junction temperature, potentially reducing lifetime and causing color shift.

8.3 Thermal Considerations

While the document provides maximum ratings, it's important to understand that LED performance degrades with increasing junction temperature. For the red AlInGaP LED, luminous efficiency typically decreases more significantly with temperature rise compared to the blue InGaN LED. In high-ambient-temperature environments or high-current drive scenarios, thermal management (e.g., PCB copper area) should be considered to maintain performance and reliability.

8.4 Viewing Angle and Optical Design

The 30-degree half-angle provides a reasonably wide viewing cone suitable for panel indicators. For applications requiring a very narrow beam, secondary optics (e.g., lenses) would be necessary. The water-clear lens is optimal for the purest color output but offers no diffusion; for a softer, more uniform appearance, a diffused lens variant would be required.

9. Technical Comparison & Selection Guidance

9.1 Blue vs. Red Variant Summary

AspectBlue (InGaN)Red (AlInGaP)Design Implication
Typical Forward Voltage (20mA)~3.4V~2.4VDifferent series resistor values needed for same current from same voltage supply.
Luminous Intensity BinsHJ to PQ (180-1500 mcd)LM to QR (400-1900 mcd)Red LEDs generally offer higher intensity bins for a given drive current.
Peak/Dominant Wavelength~468nm / ~470nm~632nm / ~624nmStandard blue and high-efficiency red colors.
TechnologyInGaNAlInGaPBoth are mature, high-efficiency LED technologies.

9.2 Common Design Questions

Q: Can I drive this LED directly from a 5V digital logic pin?
A: No. The typical Vf is 2.4V (Red) or 3.4V (Blue). A series resistor is always required to limit the current. For a 5V supply and 20mA target: R_red ≈ (5V - 2.4V) / 0.02A = 130Ω; R_blue ≈ (5V - 3.4V) / 0.02A = 80Ω. Use the nearest standard higher value for safety.

Q: Why is the reverse current (IR) rating important if reverse operation is not allowed?
A> It is a quality and leakage test parameter. A high reverse leakage current can indicate a damaged or defective junction.

Q: How do I select the right intensity bin?
A> Choose based on application brightness requirements and required consistency. For a panel of multiple LEDs, specifying a single, tighter bin (e.g., KL for blue) ensures uniform appearance. For a single indicator, a wider bin may be acceptable for cost savings.

10. Practical Application Examples

10.1 Power-On Indicator for a 12V Device

Goal: Indicate device is powered using a red LED.
Design: Supply voltage = 12V. Target current = 15mA (for longer life).
Calculation: Vf_red_typ = 2.4V. Resistor value R = (12V - 2.4V) / 0.015A = 640Ω. Power in resistor P_R = (12V-2.4V)*0.015A = 0.144W. Use a standard 620Ω or 680Ω, 1/4W resistor.

10.2 Dual-Color Status Indicator (Microcontroller Driven)

Goal: Use one blue and one red LED to show different statuses (e.g., standby/active) controlled by MCU GPIO pins.
Design: MCU VDD = 3.3V. Drive LEDs at 10mA for lower power.
Calculation:
- Blue: R = (3.3V - 3.4V) / 0.01A = -10Ω (Invalid). This shows a problem: the typical Vf of the blue LED (3.4V) is higher than the supply (3.3V). The blue LED may not light, or will be very dim. Solution: Use a blue LED with a lower Vf bin, reduce current further, or use a charge pump/boost circuit.
- Red: R = (3.3V - 2.4V) / 0.01A = 90Ω. This works well.
This example highlights the importance of checking supply voltage against LED Vf.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.