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T-1 3/4 Yellow LED Lamp Datasheet - 5mm Diameter - 2.4V Forward Voltage - 75mW Power Dissipation - English Technical Document

Complete technical datasheet for a high-efficiency, low-power AlInGaP yellow through-hole LED lamp. Includes detailed specifications, electrical/optical characteristics, binning information, and application guidelines.
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PDF Document Cover - T-1 3/4 Yellow LED Lamp Datasheet - 5mm Diameter - 2.4V Forward Voltage - 75mW Power Dissipation - English Technical Document

1. Product Overview

This document provides the complete technical specifications for a high-performance, through-hole mounted LED lamp. The device is designed for general-purpose indicator and illumination applications where reliability, efficiency, and ease of integration are paramount. It utilizes an AlInGaP (Aluminum Indium Gallium Phosphide) semiconductor material to produce a distinct yellow light output, offering a balance of visual clarity and energy efficiency.

The LED is housed in a popular T-1 3/4 package, corresponding to a 5mm diameter lens, making it compatible with a vast array of existing PCB layouts and panel cutouts. Its design emphasizes low power consumption and high luminous intensity, making it suitable for battery-powered devices or applications where minimizing energy use is critical. The product is compliant with RoHS directives, indicating it is free from hazardous substances like lead (Pb).

2. Technical Parameters Deep Dive

2.1 Absolute Maximum Ratings

The device's operational limits are defined under specific ambient conditions (TA=25°C). Exceeding these ratings may cause permanent damage.

2.2 Electrical & Optical Characteristics

These parameters are measured at a standard test condition of IF = 20mA and TA = 25°C, providing the baseline performance.

3. Binning System Explanation

To ensure consistency in applications, LEDs are sorted (binned) based on key optical parameters. This datasheet details a binning system for luminous intensity.

Luminous Intensity Binning (@ 20mA): The LEDs are categorized into six bins (SB1 to SB6), each with a minimum and maximum intensity range. The tolerance for each bin limit is ±15%.

This system allows designers to select LEDs with the required brightness level for their specific application, ensuring visual uniformity when multiple LEDs are used together.

4. Performance Curve Analysis

While specific graphical data is referenced in the document (Typical Electrical/Optical Characteristics Curves on page 4), the parameters imply standard LED behavior curves that should be considered in design:

5. Mechanical & Packaging Information

5.1 Package Dimensions

The device uses a standard radial leaded package with a T-1 3/4 (5mm) diameter water-clear lens. Key dimensional notes include:

5.2 Polarity Identification

For through-hole LEDs, the cathode is typically identified by a flat spot on the lens rim, a shorter lead, or a notch in the flange. The datasheet's dimensional drawing would clarify the specific marker. Correct polarity is essential for operation.

6. Soldering & Assembly Guidelines

Proper handling is crucial for reliability. The document provides detailed cautions:

7. Packaging & Ordering Information

The standard packaging flow is as follows:

The specific part number for this device is LTL2R3KSK, which encodes information about the lens type (Water Clear), source technology (AlInGaP), and color (Yellow).

8. Application Suggestions

8.1 Typical Application Scenarios

This LED is intended for ordinary electronic equipment, including:

Important Note: For applications requiring exceptional reliability where failure could jeopardize life or health (aviation, medical devices, safety systems), specific consultation and qualification are necessary.

8.2 Design Considerations & Drive Method

An LED is a current-operated device. To ensure consistent brightness, especially when driving multiple LEDs in parallel, a series current-limiting resistor for each LED is strongly recommended (Circuit Model A).

Using a common voltage source with a single resistor for multiple parallel LEDs (Circuit Model B) is not recommended. Small variations in the forward voltage (VF) characteristic from one LED to another will cause significant differences in the current flowing through each, leading to uneven brightness. The series resistor for each LED stabilizes the current and compensates for these minor VF differences.

The resistor value (R) can be calculated using Ohm's Law: R = (Vcc - VF) / IF, where Vcc is the supply voltage, VF is the LED's forward voltage (use max value for reliability), and IF is the desired forward current (e.g., 20mA).

9. Electrostatic Discharge (ESD) Protection

LEDs are sensitive to electrostatic discharge. To prevent damage:

10. Technical Comparison & Differentiation

This AlInGaP yellow LED offers distinct advantages:

11. Frequently Asked Questions (FAQs)

Q1: Can I drive this LED directly from a 5V or 3.3V logic output?
A: No. You must use a series current-limiting resistor. For example, with a 5V supply and a typical VF of 2.4V at 20mA, a resistor of approximately (5V - 2.4V) / 0.02A = 130 Ohms is required. Always check the maximum current rating.

Q2: Why is there such a wide range in luminous intensity (400-2500 mcd)?
A: This reflects the natural variation in semiconductor manufacturing. The binning system (SB1-SB6) allows you to purchase LEDs within a tighter, specified brightness range for your application to ensure consistency.

Q3: What is the difference between Peak Wavelength and Dominant Wavelength?
A: Peak Wavelength (λP) is the physical peak of the light spectrum emitted. Dominant Wavelength (λd) is calculated from color coordinates and represents the single wavelength the human eye perceives the color to be. λd is more relevant for color specification.

Q4: Can I use this for outdoor applications?
A: The operating temperature range (-40°C to +100°C) allows for many outdoor environments. However, consider additional factors like lens durability against UV radiation and moisture ingress, which are not specified in this datasheet. Conformal coating or using an LED rated for outdoor use may be necessary.

12. Practical Design Case Study

Scenario: Designing a control panel with 10 uniform yellow status indicators, powered by a 12V DC rail.

Design Steps:

  1. LED Selection: Choose LEDs from the same intensity bin (e.g., SB3: 1150-1500 mcd) to guarantee brightness matching.
  2. Current Setting: Select a standard drive current of 20mA for good brightness and longevity.
  3. Resistor Calculation: Using the maximum VF (2.4V) for reliability: R = (12V - 2.4V) / 0.02A = 480 Ohms. The nearest standard value is 470 Ohms. Re-calculating current: IF = (12V - 2.4V) / 470Ω ≈ 20.4 mA (safe).
  4. Power in Resistor: P_R = IF^2 * R = (0.0204A)^2 * 470Ω ≈ 0.196W. Use a 1/4 Watt resistor.
  5. Layout: Place each LED with its dedicated 470Ω resistor in series. Ensure PCB holes match the lead spacing from the datasheet's dimensional drawing. Maintain the 3mm minimum distance from the LED body to the solder pad.
  6. Assembly: Follow the soldering guidelines precisely, using a controlled-temperature iron to avoid thermal damage.

This approach ensures all 10 indicators have consistent, reliable performance.

13. Operating Principle

This LED operates on the principle of electroluminescence in a semiconductor p-n junction. The active region is composed of AlInGaP. When a forward voltage exceeding the material's bandgap energy is applied, electrons from the n-type region and holes from the p-type region are injected into the active region. When these charge carriers recombine, they release energy in the form of photons (light). The specific composition of the AlInGaP alloy determines the bandgap energy, which directly corresponds to the wavelength (color) of the emitted light—in this case, yellow (~590 nm). The water-clear epoxy lens encapsulates the semiconductor chip, provides mechanical protection, and shapes the light output beam.

14. Technology Trends

While through-hole LEDs remain vital for prototyping, repair, and certain industrial applications, the broader optoelectronics industry is trending towards surface-mount device (SMD) packages for most new designs. SMD LEDs offer advantages in automated assembly, smaller footprint, and better thermal management. For through-hole components, ongoing developments focus on increasing efficiency (more light output per watt), improving color consistency through advanced binning, and enhancing reliability under harsh environmental conditions. The AlInGaP material system used here represents a mature and efficient technology for amber, yellow, and red colors, with incremental improvements in epitaxial growth and packaging continuing to push performance boundaries.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.