Table of Contents
- 1. Product Overview
- 2. Technical Parameter Deep Dive
- 2.1 Absolute Maximum Ratings
- 2.2 Electrical & Optical Characteristics
- 3. Performance Curve Analysis
- 4. Mechanical & Packaging Information
- 5. Soldering & Assembly Guidelines
- 6. Application Suggestions
- 6.1 Typical Application Scenarios
- 6.2 Drive Circuit Design
- 6.3 Design Considerations
- 7. Reliability & Testing
- 8. Cautions & Limitations
- 9. Technical Principle Introduction
- 10. Common Questions Based on Technical Parameters
- 11. Practical Usage Case
- LED Specification Terminology
- Photoelectric Performance
- Electrical Parameters
- Thermal Management & Reliability
- Packaging & Materials
- Quality Control & Binning
- Testing & Certification
1. Product Overview
This document details the technical specifications for a high-intensity green LED lamp designed for through-hole mounting. The device utilizes AlInGaP (Aluminum Indium Gallium Phosphide) semiconductor technology to produce green light. It is housed in a popular T-1 3/4 diameter package, which is a standard size widely used in electronic assemblies. The primary design goal is to provide a reliable, rugged light source with a narrow viewing angle, resulting in higher perceived brightness when viewed on-axis. This makes it suitable for a variety of general-purpose indicator and illumination applications where a distinct, focused green signal is required.
2. Technical Parameter Deep Dive
2.1 Absolute Maximum Ratings
The device must not be operated beyond these limits to prevent permanent damage. Key ratings include a maximum power dissipation of 75 mW at an ambient temperature (TA) of 25°C. The continuous forward current is rated at 30 mA. For pulsed operation, a peak forward current of 60 mA is permissible under specific conditions: a 1/10 duty cycle and a pulse width of 0.1 ms. The device can withstand a reverse voltage of up to 5 V. The operating and storage temperature ranges are from -40°C to +100°C. For soldering, the leads can tolerate 260°C for 5 seconds when measured 1.6mm from the body.
2.2 Electrical & Optical Characteristics
These parameters are measured at TA=25°C and define the typical performance of the LED. The luminous intensity (IV) has a typical value of 310 mcd at a forward current (IF) of 20 mA, with a minimum specified value of 140 mcd. The viewing angle (2θ1/2), defined as the full angle where intensity drops to half its axial value, is 40 degrees. The peak emission wavelength (λP) is 574 nm, and the dominant wavelength (λd), which defines the perceived color, is 572 nm. The spectral line half-width (Δλ) is 11 nm. The forward voltage (VF) typically measures 2.4 V at IF=20mA, with a maximum of 2.4 V. Reverse current (IR) is a maximum of 100 µA at VR=5V, and the junction capacitance (C) is typically 40 pF.
3. Performance Curve Analysis
The datasheet references typical characteristic curves which are essential for design. These curves, though not displayed in the provided text, would typically illustrate the relationship between forward current and forward voltage (I-V curve), the variation of luminous intensity with forward current, the temperature dependence of forward voltage and luminous intensity, and the spectral power distribution. Analyzing these curves allows designers to predict performance under non-standard conditions, such as different drive currents or ambient temperatures, ensuring stable operation across the intended application environment.
4. Mechanical & Packaging Information
The LED uses a standard T-1 3/4 (approximately 5mm) diameter round package. Key dimensional notes specify that all dimensions are in millimeters, with a general tolerance of ±0.25mm unless stated otherwise. The maximum protrusion of resin under the flange is 1.0mm. Lead spacing is measured at the point where the leads emerge from the package body. The lens is transparent, and the source color is green from the AlInGaP chip.
5. Soldering & Assembly Guidelines
Proper handling is critical for reliability. For lead forming, bends must be made at least 3mm from the base of the epoxy bulb, and the base should not be used as a fulcrum. Forming must be done at room temperature before soldering. When mounting, avoid creating residual mechanical stress from clinching the leads. For soldering, maintain a minimum 2mm clearance between the solder point and the resin body. Do not immerse the resin into solder. Recommended conditions are: soldering iron temperature maximum 300°C for 3 seconds max (one time only), or wave soldering with pre-heat to 100°C max for 60 seconds max, followed by a solder wave at 260°C max for 10 seconds max. The housing material is sensitive to temperature; exceeding these limits can cause melting.
6. Application Suggestions
6.1 Typical Application Scenarios
This LED is intended for ordinary electronic equipment such as office equipment, communication devices, and household appliances. Its high intensity and narrow viewing angle make it suitable for status indicators, panel lights, and backlighting where a bright, focused green point is needed.
6.2 Drive Circuit Design
LEDs are current-operated devices. A current-limiting mechanism is mandatory in the driving circuit. The simplest method is to use a series resistor. The resistor value must be chosen considering the power supply voltage variation to prevent the forward current from exceeding 40% over the desired value. The datasheet recommends a circuit where each LED has its own current-limiting resistor (Circuit A). Using a single resistor for multiple LEDs in parallel (Circuit B) is discouraged due to the natural variation in forward voltage (Vf) between individual LEDs, which leads to uneven current sharing and thus uneven brightness.
6.3 Design Considerations
Consider thermal management; the maximum power dissipation derates linearly above 50°C ambient at 0.4 mA/°C. Electrostatic discharge (ESD) protection is crucial; handlers should use grounded wrist straps, and all equipment must be properly grounded. For storage before use, keep at 30°C or less and 70% RH or less, with a recommended use-within period of 3 months. For longer storage (up to one year), a sealed container with a nitrogen atmosphere and desiccant is advised.
7. Reliability & Testing
The device undergoes several reliability tests per industry standards. Endurance testing includes a 1000-hour operational life test at room temperature with pulsed current. Environmental tests include temperature cycling between -55°C and +105°C, solder resistance at 260°C, and solderability tests. These tests ensure the device can withstand the rigors of manufacturing and long-term operation.
8. Cautions & Limitations
This product is not designed for safety-critical applications where failure could jeopardize life or health (e.g., aviation, automotive primary controls, medical life-support). For such applications, consultation with the manufacturer is required prior to design-in. The specifications and product appearance are subject to change for quality improvement without notice. Users must avoid rapid temperature transitions in high humidity to prevent condensation on or inside the device. Cleaning should be done with alcohol-based solvents like isopropyl alcohol.
9. Technical Principle Introduction
This LED is based on AlInGaP semiconductor material. When a forward voltage is applied across the p-n junction, electrons and holes recombine in the active region, releasing energy in the form of photons. The specific composition of the AlInGaP alloy determines the bandgap energy, which in turn defines the wavelength (color) of the emitted light—in this case, green at around 572 nm. The transparent epoxy lens serves to protect the semiconductor die, shape the radiation pattern to a 40-degree viewing angle, and enhance light extraction from the chip.
10. Common Questions Based on Technical Parameters
Q: What resistor value should I use with a 5V supply for 20mA drive current?
A: Using the typical Vf of 2.4V, the voltage across the resistor is (5V - 2.4V) = 2.6V. Using Ohm's Law (R = V/I), R = 2.6V / 0.02A = 130 Ω. A standard 130 Ω or 120 Ω resistor would be suitable, considering the power rating (P = I²R = 0.0004 * 130 = 0.052W, so a 1/8W or 1/10W resistor is sufficient).
Q: Can I drive this LED at 30mA continuously?
A: Yes, 30mA is the maximum continuous forward current rating at 25°C. However, ensure the ambient temperature is considered, as the permissible current derates above 50°C.
Q: Why is a narrow viewing angle an advantage?
A: A narrow viewing angle (40°) concentrates the luminous flux into a smaller solid angle. This results in higher axial luminous intensity (candelas) when viewed head-on, making the LED appear brighter for indicator applications where the viewer is typically aligned with the LED axis.
11. Practical Usage Case
Scenario: Designing a multi-indicator status panel. A control unit requires three independent status LEDs: Power (green), Warning (yellow), and Fault (red). For the green "Power On" indicator, this LTL307JGT LED is selected. The design uses a 5V logic supply. A 130 Ω series resistor is chosen for each LED to set the current to approximately 20mA. Each LED-resistor pair is driven directly by a microcontroller output pin. The narrow 40-degree viewing angle ensures the indicators are clearly visible to an operator directly in front of the panel, even in moderately lit environments. The through-hole package allows for secure mounting on the PCB and easy visual inspection during assembly.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |