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LTL-14FM9HKP LED Lamp Datasheet - Right Angle Holder - Yellow Green/Red/Yellow - 20mA - 52mW - English Technical Document

Technical datasheet for the LTL-14FM9HKP through-hole LED lamp with right-angle black plastic holder. Features AlInGaP chips in yellow green (569nm), red (625nm), and yellow (589nm). Includes electrical, optical, and mechanical specifications.
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PDF Document Cover - LTL-14FM9HKP LED Lamp Datasheet - Right Angle Holder - Yellow Green/Red/Yellow - 20mA - 52mW - English Technical Document

1. Product Overview

The LTL-14FM9HKP is a Circuit Board Indicator (CBI) designed for through-hole mounting. It consists of a black plastic right-angle holder (housing) that mates with specific LED lamps. This design is intended to enhance contrast ratio and facilitate easy assembly on printed circuit boards (PCBs). The product is available in configurations featuring AlInGaP semiconductor chips emitting in yellow green, red, and yellow wavelengths.

1.1 Core Advantages

1.2 Target Applications

This LED indicator is suitable for a broad range of electronic equipment, including:

2. In-Depth Technical Parameter Analysis

The following section provides a detailed breakdown of the key electrical, optical, and thermal parameters specified for the LTL-14FM9HKP.

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. All values are specified at an ambient temperature (TA) of 25°C.

2.2 Electrical & Optical Characteristics

These are the typical performance parameters measured at TA=25°C and IF=10mA, unless otherwise noted.

3. Performance Curve Analysis

The datasheet provides typical characteristic curves which are essential for circuit design and understanding device behavior under varying conditions.

3.1 Relative Luminous Intensity vs. Forward Current

These curves show that luminous intensity increases with forward current in a non-linear relationship. For optimal brightness and longevity, operation at or below the recommended 20mA is advised. Driving the LED beyond this point yields diminishing returns in light output and increases heat generation.

3.2 Forward Voltage vs. Forward Current

The V-I curves demonstrate the diode-like behavior. The forward voltage exhibits a slight positive temperature coefficient, meaning it decreases as the junction temperature rises for a given current. This is an important consideration for constant-voltage drive circuits.

3.3 Relative Luminous Intensity vs. Ambient Temperature

These curves illustrate the thermal derating of light output. Luminous intensity decreases as ambient temperature increases. This is a critical factor for applications operating in elevated temperature environments, as it may necessitate current adjustment or heat sinking to maintain desired brightness levels.

4. Mechanical & Packaging Information

4.1 Outline Dimensions

The device uses a right-angle through-hole form factor. Key dimensional notes include:

4.2 Polarity Identification

Polarity is indicated by the physical structure of the holder and the lead lengths (typically the cathode lead is shorter or marked). The outline drawing in the datasheet must be consulted for the specific pinout configuration of each LED color within the holder.

4.3 Packing Specification

The components are supplied in bulk packaging or on tape and reel for automated assembly. The exact reel dimensions, pocket spacing, and orientation are detailed in the packing specification diagram.

5. Soldering & Assembly Guidelines

Proper handling is crucial for reliability.

5.1 Storage Conditions

For long-term storage outside the original packaging, it is recommended to store LEDs in a sealed container with desiccant or in a nitrogen ambient to prevent moisture absorption, which can affect soldering and long-term performance. Use within three months if removed from original packaging.

5.2 Lead Forming

5.3 Soldering Process

Critical Rule: Maintain a minimum clearance of 2mm from the base of the lens/holder to the soldering point. Do not immerse the lens or holder in solder.

6. Application & Circuit Design Recommendations

6.1 Drive Circuit Design

LEDs are current-operated devices. To ensure uniform brightness when multiple LEDs are used, especially in parallel, a current-limiting resistor must be placed in series with each LED.

6.2 Electrostatic Discharge (ESD) Protection

These LEDs are susceptible to damage from electrostatic discharge or power surges. Precautions must be taken during handling and assembly:

6.3 Cleaning

If cleaning is necessary after soldering, use only alcohol-based solvents such as isopropyl alcohol. Avoid harsh or abrasive cleaners.

7. Technical Comparison & Design Considerations

7.1 Technology Choice: AlInGaP

The use of Aluminum Indium Gallium Phosphide (AlInGaP) semiconductor material offers distinct advantages for colors in the red, orange, yellow, and yellow-green spectrum:

7.2 Form Factor: Right-Angle Through-Hole

This design is ideal for applications where the PCB is mounted vertically or where the indicator needs to be visible from the front panel while the board is parallel to it. The black housing provides built-in light piping and contrast enhancement, eliminating the need for a separate bezel or light guide in many designs.

8. Frequently Asked Questions (Based on Technical Data)

8.1 Can I drive this LED at 20mA continuously?

Yes, 20mA DC is the specified maximum continuous forward current. For optimal lifetime and reliability, operating at or slightly below this value (e.g., 15-18mA) is often recommended, especially in high ambient temperature conditions.

8.2 Why is a series resistor necessary even if my supply voltage matches the LED's typical Vf?

The forward voltage (Vf) has a tolerance range (1.6V to 2.5V). A constant voltage source cannot regulate current. A small increase in voltage can cause a large, potentially damaging, increase in current due to the diode's exponential I-V characteristic. The series resistor provides negative feedback, stabilizing the current against variations in both supply voltage and the LED's individual Vf.

8.3 Can I use reflow soldering for this component?

No. The datasheet explicitly states that IR reflow is not a suitable process for this through-hole type LED lamp. The recommended processes are hand soldering or wave soldering with the strict temperature and clearance guidelines provided.

8.4 How do I calculate the series resistor value?

Use Ohm's Law: R = (V_supply - Vf_LED) / I_desired.
Example: For a 5V supply, a typical Vf of 2.0V, and a desired current of 10mA:
R = (5V - 2.0V) / 0.010A = 300 Ohms.
Always consider the worst-case Vf (minimum) to ensure current does not exceed maximum limits, and verify power dissipation in the resistor (P = I^2 * R).

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.