Through Hole LED Lamp LTLR14FTBEEJH218Y Datasheet - Blue & Red Colors - Voltage 1.7-3.6V - Power 52-76mW - English Technical Document

1. Product Overview

This document details the specifications for a through-hole mounted LED lamp assembly, commonly referred to as a Circuit Board Indicator (CBI). The product consists of a black plastic right-angle holder (housing) designed to mate with specific LED lamp components. This design facilitates straightforward assembly onto printed circuit boards (PCBs). The assembly is available with either blue or red LED elements, each featuring a white diffused lens for enhanced light dispersion.

1.1 Core Features

• Engineered for simplified and efficient circuit board assembly processes.
• Black housing material increases the visual contrast ratio, improving indicator visibility.
• Utilizes solid-state light sources for reliability and longevity.
• Characterized by low power consumption and high luminous efficiency.
• Compliant with lead-free manufacturing requirements and RoHS directives.

1.2 Target Applications

This component is suitable for a broad range of electronic equipment, including but not limited to:

• Computer peripherals and internal indicators.
• Communication devices and network equipment.
• Consumer electronics and appliances.
• Industrial control systems and machinery.

2. Outline and Mechanical Dimensions

The LED lamp assembly is housed in a black PA9T plastic holder. The specific outline dimensions are provided in the associated engineering drawings within the source document. Key mechanical notes include:

• All primary dimensions are specified in millimeters, with tolerances typically at ±0.25mm unless stated otherwise.
• The LED component itself is available in blue or red color, encapsulated with a white diffused lens.
• It is important to note that all specifications are subject to change without prior notice.

3. Absolute Maximum Ratings

The following ratings define the limits beyond which permanent damage to the device may occur. All values are specified at an ambient temperature (TA) of 25°C.

4. Electrical and Optical Characteristics

These characteristics are measured at TA=25°C and represent typical device performance under the defined test conditions.

Important Notes: Luminous intensity is measured with a filter approximating the CIE photopic eye response. The viewing angle (2θ1/2) is the full angle where intensity drops to half its axial value. The device is not designed for operation under reverse bias; the IR test condition is for characterization only.

5. Binning System Specification

To ensure consistency in application, LEDs are sorted into bins based on key parameters. The bin code is marked on the packaging.

5.1 Luminous Intensity Binning

Tolerance for each bin limit is ±30%.

5.2 Forward Voltage Binning (Blue LED only)

Tolerance for each bin limit is ±0.1V.

5.3 Dominant Wavelength Binning (Blue LED only)

Tolerance for each bin limit is ±1 nm.

6. Assembly, Handling, and Storage Guidelines

6.1 Storage Conditions

Sealed Moisture Barrier Bag (MBB): Store at ≤30°C and ≤70% RH. Use within one year of bag sealing.
Opened Package: Store at ≤30°C and ≤60% RH. Components removed from the MBB should undergo IR reflow soldering within 168 hours (7 days). For storage beyond 168 hours, bake at 60°C for at least 48 hours before assembly to remove moisture and prevent \"popcorn\" effect during reflow.

6.2 Lead Forming and Placement

• Bend leads at a point at least 3mm from the base of the LED lens. Do not use the lens base as a fulcrum.
• Perform all lead forming operations at room temperature and before the soldering process.
• During PCB insertion, apply the minimum necessary clinch force to avoid imposing excessive mechanical stress on the component body.

6.3 Soldering Recommendations

Maintain a minimum distance of 2mm between the base of the lens/holder and the solder point. Avoid immersing the lens/holder in solder.

6.4 Reflow Soldering Profile (Reference)

• Preheat/Soak: 150°C to 200°C over a maximum of 100 seconds.
• Time Above Liquidous (T_L=217°C): 60 to 90 seconds.
• Peak Temperature (T_P): 250°C max.
• Time within 5°C of Specified Temp (T_C=245°C): 30 seconds max.
• Total Time from 25°C to Peak: 5 minutes max.

Warning: Exceeding the recommended soldering temperatures or times can cause lens deformation or catastrophic LED failure.

7. Performance Curves and Graphical Data

The source datasheet includes typical performance curves which are essential for detailed design analysis. These graphs visually represent the relationship between key parameters, providing insights beyond the tabular data.

7.1 Typical Characteristics Curves

While the specific graphs are not reproduced in text form here, the datasheet typically contains plots for the following relationships:

• Forward Current vs. Forward Voltage (I_F-V_F): This curve shows the exponential relationship typical of diode behavior. For both red and blue LEDs, the voltage increases logarithmically with current. Designers use this to determine the necessary driving voltage for a desired operating current, considering the variance indicated in the V_F binning table.
• Luminous Intensity vs. Forward Current (I_v-I_F): This plot demonstrates how light output increases with drive current. It is generally linear within the recommended operating range but will saturate at higher currents. The graph helps in selecting an appropriate current to achieve target brightness while maintaining efficiency and staying within absolute maximum ratings.
• Luminous Intensity vs. Ambient Temperature (I_v-T_A): LED light output is inversely related to junction temperature. This curve quantifies the derating of luminous intensity as the ambient (and consequently junction) temperature rises. It is critical for applications operating at high ambient temperatures or where consistent brightness is required.
• Relative Spectral Power Distribution: These graphs for red and blue LEDs show the intensity of emitted light across the wavelength spectrum. The red LED curve will peak around 632nm, while the blue peaks around 468nm. The width of these peaks, indicated by the Spectral Half-Width (Δλ) parameter, affects the color purity.

Consulting these curves allows engineers to model LED behavior under non-standard conditions (e.g., different drive currents or temperatures) and to design robust circuits that compensate for performance variations.

8. Packaging Specification

The component is supplied in packaging designed for automated handling and to protect against moisture and electrostatic discharge (ESD). The exact packing specification, including reel dimensions, tape width, pocket size, and orientation, is detailed in the corresponding drawing within the source document. This information is vital for setting up pick-and-place machines in automated assembly lines.

9. Application Notes and Design Considerations

9.1 Driving the LED

Always drive LEDs using a constant current source or a current-limiting resistor in series with a voltage source. Using just a voltage source risks thermal runaway and destruction of the LED. The series resistor value (R_s) can be calculated using Ohm's Law: R_s = (V_supply - V_F) / I_F. Use the maximum V_F from the datasheet for a given bin to ensure sufficient current under all conditions. For example, to drive a blue LED from a 5V supply at 10mA, assuming a max V_F of 3.6V: R_s = (5V - 3.6V) / 0.01A = 140Ω. A standard 150Ω resistor would be a safe choice.

9.2 Thermal Management

Although power dissipation is low (52-76mW), proper thermal design extends lifespan and maintains brightness. Ensure the PCB has adequate copper area connected to the LED leads to act as a heat sink. Avoid placing the LED near other heat-generating components. Operating at or near the maximum junction temperature will accelerate lumen depreciation.

9.3 Polarity and Orientation

Through-hole LEDs are polarized devices. The longer lead is typically the anode (positive). The housing may also have a flat side or other marking near the cathode lead. Incorrect insertion will prevent the LED from illuminating and applying reverse voltage beyond 5V may damage it.

9.4 Cleaning

If cleaning after soldering is necessary, use only alcohol-based solvents like isopropyl alcohol (IPA). Avoid aggressive flux removers or ultrasonic cleaning, as these can damage the plastic lens or housing.

10. Comparison and Selection Guidance

When selecting an indicator LED, key decision factors include:

• Color and Wavelength: Choose based on the required indication (e.g., red for warnings/alerts, blue for status). Consider the dominant wavelength bin for color-critical applications.
• Brightness (Luminous Intensity): Select the appropriate intensity bin for the viewing distance and ambient light conditions. Higher bins (e.g., HJ for blue) are brighter but may consume slightly more power for the same current due to typical V_F correlation.
• Viewing Angle: The 100° viewing angle provides a wide, diffuse light pattern suitable for panel indicators viewed from various angles. For a more focused beam, a lens with a narrower viewing angle would be required.
• Forward Voltage: The blue LED's higher V_F (~3.2V typical) compared to the red (~2.4V typical) has implications for power supply design, especially in battery-operated devices. The V_F bin allows selection of LEDs with tighter voltage consistency for parallel driving configurations.

This through-hole LED lamp offers a reliable, easy-to-assemble solution for standard PCB indicator needs, with detailed binning enabling precise selection for consistent performance in volume production.