T-1 5mm Through Hole LED Lamp Datasheet - Red 639nm - 2.4V 30mA - 72mW - English Technical Document

1. Product Overview

This document details the specifications for a standard T-1 (5mm) diameter through-hole LED lamp. This component is designed for status indication and illumination across a broad range of electronic applications. Its primary advantages include low power consumption, high luminous efficiency, and a lead-free, RoHS-compliant construction. The device features a red color diffused lens utilizing AlInGaP technology, offering a popular form factor suitable for both prototyping and volume production.

The target markets for this LED are diverse, encompassing communication equipment, computer peripherals, consumer electronics, home appliances, and industrial control systems. Its design flexibility is supported by availability in various luminous intensity bins and a standard viewing angle, allowing engineers to select the appropriate brightness level for their specific application needs.

2. Technical Parameter Deep-Dive

2.1 Absolute Maximum Ratings

The device must not be operated beyond these limits to prevent permanent damage. Key ratings include a maximum power dissipation of 72mW at an ambient temperature (TA) of 25°C. The DC forward current is limited to 30mA, while a higher peak forward current of 90mA is permissible under pulsed conditions (1/10 duty cycle, 0.1ms pulse width). The operating temperature range is specified from -30°C to +85°C. A critical parameter is the derating factor for forward current, which is 0.57 mA/°C linearly from 50°C upwards. This means the allowable continuous current decreases as the ambient temperature rises above 50°C to manage junction temperature and ensure reliability.

2.2 Electrical & Optical Characteristics

Measured at TA=25°C and a standard test current (IF) of 20mA, the LED's core performance is defined. The luminous intensity (Iv) has a typical value of 180 millicandelas (mcd), with a minimum of 110 mcd and a maximum up to 400 mcd depending on the bin code. The viewing angle (2θ1/2), where intensity is half the on-axis value, is 50 degrees, providing a moderately wide beam. The peak emission wavelength (λP) is 639 nm, and the dominant wavelength (λd) ranges from 621 nm to 642 nm, defining the perceived red color. The forward voltage (VF) is typically 2.4V with a maximum of 2.4V at 20mA. The reverse current (IR) is limited to 100 μA at a reverse voltage (VR) of 5V, though the device is not designed for reverse bias operation.

3. Binning System Specification

To ensure color and brightness consistency in production, the LEDs are sorted into bins. Two primary binning dimensions are used:

3.1 Luminous Intensity Binning

LEDs are classified based on their measured luminous intensity at 20mA. The bin codes range from F (110-140 mcd) to K (310-400 mcd). A tolerance of ±15% is applied to each bin limit.

3.2 Dominant Wavelength Binning

For color consistency, LEDs are binned by their dominant wavelength. Codes H29 to H33 cover the range from 621.0 nm to 642.0 nm in approximately 4nm steps. The tolerance for each bin limit is ±1 nm.

4. Performance Curve Analysis

While specific graphical data is referenced in the datasheet (Fig. 1-6), typical curves for this class of device illustrate key relationships. The forward current vs. forward voltage (I-V) curve shows the exponential relationship characteristic of a diode. The relative luminous intensity vs. forward current curve demonstrates that light output increases linearly with current within the operating range. The relative luminous intensity vs. ambient temperature curve typically shows a decrease in output as temperature increases, highlighting the importance of thermal management. The spectral distribution curve centers around the 639 nm peak wavelength with a spectral half-width of approximately 20 nm.

5. Mechanical & Packaging Information

5.1 Outline Dimensions

The LED conforms to the standard T-1 (5mm) radial leaded package. Key dimensions include the lens diameter, overall height, and lead spacing. The leads emerge from the package with a specified spacing, and a tolerance of ±0.25mm applies to most dimensions. A maximum resin protrusion under the flange is defined as 1.0mm. The anode (positive) lead is typically identified as the longer lead.

5.2 Packing Specification

The LEDs are packaged for bulk handling and shipping. The standard packing flow is: 1,000 pieces per anti-static packing bag; 10 bags (10,000 pcs) per inner carton; 8 inner cartons (80,000 pcs) per master outer carton. Non-full packs are allowed only for the final pack in a shipping lot.

6. Soldering & Assembly Guidelines

6.1 Storage & Handling

LEDs should be stored in an environment not exceeding 30°C and 70% relative humidity. If removed from the original packaging, they should be used within three months. For longer storage, use a sealed container with desiccant. Handle with ESD precautions: use grounded wrist straps, workstations, and ionizers to neutralize static on the plastic lens.

6.2 Lead Forming

Bending of leads must be performed at a point at least 3mm from the base of the LED lens, at room temperature, and before the soldering process. The base of the lead frame must not be used as a fulcrum. During PCB insertion, use minimal clinch force.

6.3 Soldering Process

A minimum clearance of 3mm must be maintained between the solder point and the base of the lens. The lens must not be immersed in solder. Recommended conditions are:
Soldering Iron: Max 350°C for 3 seconds max, with the tip no closer than 2mm from the lens base.
Wave Soldering: Pre-heat to max 100°C for 60s max, solder wave at max 260°C for 5s max, with the solder level no higher than 2mm from the lens base.
Infrared (IR) reflow soldering is not suitable for this through-hole package. Excessive heat or time can deform the lens or cause failure.

7. Application Suggestions

7.1 Typical Application Circuits

LEDs are current-driven devices. For consistent brightness, especially when connecting multiple LEDs in parallel, it is strongly recommended to use a series current-limiting resistor for each LED (Circuit A). Driving multiple LEDs in parallel directly from a voltage source (Circuit B) is discouraged due to variations in individual LED forward voltage (VF), which will cause uneven current distribution and thus uneven brightness.

7.2 Design Considerations

Consider the forward voltage drop and desired current to calculate the appropriate series resistor value using Ohm's Law: R = (Vcc - VF) / IF. Factor in the derating of forward current with ambient temperature if the operating environment is warm. Ensure the PCB layout allows for the minimum recommended clearance between the solder joint and the LED body. This LED is suitable for both indoor and outdoor signage, as well as general electronic equipment, but the design must account for environmental sealing if used outdoors.

8. Technical Comparison & Differentiation

Compared to older technologies, this AlInGaP-based red LED offers higher luminous efficiency and better performance over temperature. The standard T-1 package ensures broad compatibility with existing PCB footprints and sockets. The availability of multiple intensity bins allows for cost optimization—selecting a lower bin for non-critical indicators and a higher bin for applications requiring greater visibility. The RoHS compliance is a key differentiator for products targeting global markets with strict environmental regulations.

9. Frequently Asked Questions (FAQ)

Q: Can I drive this LED without a series resistor?
A: No. Operating an LED directly from a voltage source is highly likely to exceed its maximum current rating, leading to immediate or rapid failure. A series resistor is mandatory for current regulation.

Q: What is the difference between peak wavelength and dominant wavelength?
A: Peak wavelength (λP) is the wavelength at which the emitted optical power is maximum (639 nm). Dominant wavelength (λd) is derived from the color coordinates and represents the single wavelength of the monochromatic light that would appear to have the same color to the human eye (621-642 nm). Dominant wavelength is more relevant for color perception.

Q: Can I use this LED for reverse voltage indication?
A: No. The device has a maximum reverse voltage rating of 5V for leakage current testing only. It is not designed to be operated in reverse bias. Applying reverse voltage in a circuit can damage it.

Q: How do I interpret the bin code on the bag?
A: The bag label includes codes for luminous intensity (e.g., G, H) and dominant wavelength (e.g., H31). Cross-reference these with the bin tables in section 3 to know the guaranteed minimum and maximum values for the LEDs in that bag.

10. Practical Application Case

Scenario: Designing a power indicator for a 12V DC adapter.
Design Steps:
1. Choose a target forward current (IF). Using the typical value of 20mA is standard.
2. Use the typical forward voltage (VF) of 2.4V for calculation.
3. Calculate the series resistor: R = (12V - 2.4V) / 0.020A = 480 Ohms. The nearest standard E24 value is 470 Ohms.
4. Recalculate the actual current: I = (12V - 2.4V) / 470Ω ≈ 20.4 mA (safe).
5. Calculate resistor power: P = I² * R = (0.0204)² * 470 ≈ 0.195W. A standard 1/4W (0.25W) resistor is sufficient with margin.
6. Select an appropriate luminous intensity bin. For a simple power indicator, a lower bin (e.g., F or G) is often adequate and cost-effective.
7. Ensure the PCB hole spacing matches the LED's lead spacing and that the soldering pad maintains the required 3mm clearance from the LED body.

11. Operating Principle

A Light Emitting Diode (LED) is a semiconductor p-n junction diode. When a forward voltage exceeding the junction's built-in potential is applied, electrons from the n-region and holes from the p-region are injected across the junction. When these charge carriers recombine in the active region, energy is released in the form of photons (light). The specific wavelength (color) of the emitted light is determined by the bandgap energy of the semiconductor materials used—in this case, Aluminum Indium Gallium Phosphide (AlInGaP) for red light emission. The diffused lens encapsulates the semiconductor chip and serves to protect it, shape the beam (viewing angle), and diffuse the light for a more uniform appearance.

12. Technology Trends

While through-hole LEDs remain vital for prototyping, repair, and certain applications requiring robust mechanical connections, the industry trend has strongly shifted towards surface-mount device (SMD) LEDs for high-volume automated assembly. SMD packages offer smaller footprints, lower profiles, and better suitability for reflow soldering. However, through-hole components like this T-1 LED continue to be relevant in educational settings, hobbyist projects, and applications where manual assembly or replacement is expected. Advances in materials like AlInGaP have significantly improved the efficiency and brightness of red LEDs compared to older technologies like GaAsP, allowing for lower current operation or higher light output. Future developments in this form factor may focus on further efficiency gains and expanded color offerings within the same mechanical package.