1. Product Overview
The LTW-1NHDR5JH231 is a through-hole LED lamp designed for use with a black or natural plastic right-angle holder (housing), also known as a Circuit Board Indicator (CBI). This configuration provides a solid-state light source suitable for various electronic applications. The product is designed for ease of assembly onto printed circuit boards (PCBs).
1.1 Features
- Designed for ease in circuit board assembly.
- Solid-state light source for reliability.
- Low power consumption and high efficiency.
- Lead-free product compliant with RoHS directives.
- Utilizes a T-1 size lamp with an InGaN white LED and a white diffused lens.
1.2 Applications
This LED lamp is suitable for a wide range of applications, including but not limited to:
- Computer equipment
- Communication devices
- Consumer electronics
- Industrial equipment
2. Outline Dimensions
The mechanical drawing for the LTW-1NHDR5JH231 is provided on page 2 of the datasheet. Key notes regarding the dimensions include:
- All dimensions are specified in millimeters, with inches in parentheses.
- The default tolerance is ±0.25mm (±0.010\") unless otherwise stated.
- The holder material is black plastic.
- The LED lamp itself is white in color.
- All specifications are subject to change without prior notice.
3. Absolute Maximum Ratings
The following ratings are specified at an ambient temperature (TA) of 25°C. Exceeding these values may cause permanent damage to the device.
| Parameter | Maximum Rating | Unit |
|---|---|---|
| Power Dissipation | 108 | mW |
| Peak Forward Current (Duty Cycle ≤1/10, Pulse Width ≤10ms) | 100 | mA |
| DC Forward Current | 30 | mA |
| Derating (Linear from 30°C) | 0.45 | mA/°C |
| Operating Temperature Range | -40 to +85 | °C |
| Storage Temperature Range | -40 to +100 | °C |
| Lead Soldering Temperature (2.0mm from body) | 260 for 5 seconds max. | °C |
4. Electrical and Optical Characteristics
The following characteristics are measured at TA=25°C under the specified test conditions.
| Parameter | Symbol | Min. | Typ. | Max. | Unit | Test Condition |
|---|---|---|---|---|---|---|
| Luminous Intensity | Iv | 880 | 1900 | 3200 | mcd | IF = 20mA |
| Viewing Angle (2θ1/2) | - | - | 65 | - | deg | - |
| Chromaticity Coordinate x | x | - | 0.30 | - | - | IF = 20mA |
| Chromaticity Coordinate y | y | - | 0.29 | - | - | IF = 20mA |
| Forward Voltage | VF | 2.8 | 3.2 | 3.6 | V | IF = 20mA |
| Reverse Current | IR | - | - | 10 | μA | VR = 5V |
Notes:
- Luminous intensity is measured with a sensor and filter approximating the CIE photopic eye-response curve.
- θ1/2 is the off-axis angle where luminous intensity is half the axial value.
- The Iv classification code is marked on each packing bag.
- The Iv guarantee includes a ±15% tolerance.
- Chromaticity coordinates (x, y) are derived from the 1931 CIE chromaticity diagram.
- The reverse voltage condition is for IR testing only; the device is not designed for reverse operation.
5. Typical Electrical and Optical Characteristic Curves
The datasheet includes typical characteristic curves (shown on page 4) illustrating the relationship between various parameters. These curves are essential for understanding device performance under different operating conditions, such as forward current vs. luminous intensity and forward voltage. Analyzing these curves helps designers optimize drive circuits for consistent brightness and efficiency across a range of operating points.
6. Binning System Specification
The LTW-1NHDR5JH231 is classified according to optical and electrical bins to ensure consistency in applications.
6.1 Optical and Electrical Bin Table
Luminous Intensity Bins (Iv, mcd @ IF=20mA)
| Bin Code | Minimum (mcd) | Maximum (mcd) |
|---|---|---|
| P | 880 | 1150 |
| Q | 1150 | 1500 |
| R | 1500 | 1900 |
| S | 1900 | 2500 |
| T | 2500 | 3200 |
Note: Tolerance of each bin limit is ±15%.
Hue Ranks (Chromaticity Coordinates, CC(x,y) @ IF=20mA)
The datasheet provides a detailed table (on page 6) defining multiple hue ranks (A1, A2, B1, B2, C1, C2, D1, D2). Each rank is defined by a quadrilateral area on the CIE 1931 chromaticity diagram using four sets of (x, y) coordinates. This allows for precise color selection. The tolerance for each bin limit is ±0.01 in coordinate value.
6.2 C.I.E. 1931 Chromaticity Diagram
A reference CIE 1931 chromaticity diagram is included (on page 7) to visually represent the hue bins defined in the table. This diagram is a standard tool for specifying and understanding the color of light sources.
7. Packaging Specification
The standard packing configuration for the LTW-1NHDR5JH231 is as follows:
- Base Unit: 180 pieces per tray.
- Inner Carton: 8 trays per inner carton, totaling 1,440 pieces.
- Outer Carton: 8 inner cartons per outer carton, totaling 11,520 pieces.
A note specifies that in every shipping lot, only the final pack may be a non-full pack.
8. Cautions and Application Guidelines
8.1 Application
This LED lamp is suitable for indoor and outdoor signage, as well as ordinary electronic equipment.
8.2 Storage
For optimal longevity, LEDs should be stored in an environment not exceeding 30°C or 70% relative humidity. LEDs removed from their original packaging should be used within three months. For extended storage outside the original packaging, they should be kept in a sealed container with desiccant or in a nitrogen ambient.
8.3 Cleaning
If cleaning is necessary, use alcohol-based solvents such as isopropyl alcohol.
8.4 Lead Forming and Assembly
- Bend leads at a point at least 3mm from the base of the LED lens.
- Do not use the base of the lead frame as a fulcrum.
- Perform lead forming at normal temperature and before soldering.
- During PCB assembly, use minimal clinch force to avoid mechanical stress.
8.5 Soldering
Critical soldering guidelines must be followed to prevent damage:
- Maintain a minimum clearance of 2mm from the base of the lens/spacer to the solder point.
- Avoid dipping the lens/spacer into solder.
- Do not apply external stress to the lead frame during soldering while the LED is hot.
Recommended Soldering Conditions:
| Method | Parameter | Value | Note |
|---|---|---|---|
| Soldering Iron | Temperature | 350°C Max. | One time only. Iron tip no closer than 2mm from epoxy bulb base. |
| Time | 3 seconds Max. | ||
| Position | - | ||
| Wave Soldering | Pre-heat Temperature | 120°C Max. | Solder wave not lower than 2mm from epoxy bulb base. IR reflow is not suitable for this through-hole product. |
| Pre-heat Time | 100 seconds Max. | ||
| Solder Wave Temp. | 260°C Max. | ||
| Soldering Time | 5 seconds Max. | ||
| Dipping Position | - |
Warning: Excessive temperature or time can deform the lens or cause catastrophic failure.
8.6 Drive Method
LEDs are current-operated devices. To ensure uniform brightness when connecting multiple LEDs in parallel, it is strongly recommended to use a current-limiting resistor in series with each LED (Circuit Model A). Using a single resistor for multiple parallel LEDs (Circuit Model B) is not recommended, as slight variations in forward voltage (VF) between individual LEDs can lead to significant differences in current and, consequently, brightness.
9. Design Considerations and Application Notes
9.1 Thermal Management
While the device has a relatively low power dissipation (108mW max), proper thermal design is still important for long-term reliability, especially when operating near maximum ratings or in high ambient temperatures. The derating factor of 0.45 mA/°C above 30°C must be considered to ensure the DC forward current does not exceed safe limits. Adequate spacing on the PCB and possible airflow can help manage junction temperature.
9.2 Circuit Design for Consistent Brightness
The binning system for luminous intensity (Iv) and chromaticity (x, y) is a key feature for applications requiring color or brightness consistency. Designers should specify the required bins when ordering. Furthermore, as highlighted in the drive method section, the use of individual series resistors for each LED is the most reliable way to achieve uniform brightness in multi-LED arrays, compensating for the natural distribution in the LED's forward voltage characteristic.
9.3 Mechanical Integration
The product is designed for use with a specific right-angle holder (CBI). Designers must ensure the PCB layout accommodates the holder's footprint and the recommended keep-out area for soldering (2mm from the lens base). The instructions for lead forming and minimal clinch force are critical to avoid imposing mechanical stress on the LED package, which could lead to premature failure or cracked lenses.
10. Comparison and Selection Guidance
The LTW-1NHDR5JH231 offers a combination of a standard T-1 lamp with a dedicated holder system. Its primary advantages include ease of assembly and the availability of a right-angle viewing option via the holder. The detailed binning structure allows for precise selection for applications where color or intensity matching is critical. When selecting an LED, key parameters to compare include luminous intensity (Iv), viewing angle, forward voltage (VF), and the associated maximum ratings (current, power, temperature). This device's typical forward voltage of 3.2V at 20mA is common for white InGaN LEDs, making it compatible with standard logic-level power supplies when used with an appropriate current-limiting resistor.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |