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LTL42FGRBBH281 LED Lamp Datasheet - Multi-Color (Green/Red/Blue) - 20mA - Through-Hole Package - English Technical Document

Complete technical datasheet for the LTL42FGRBBH281 multi-color through-hole LED lamp. Includes electrical/optical characteristics, absolute maximum ratings, mechanical dimensions, application guidelines, and packaging specifications.
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PDF Document Cover - LTL42FGRBBH281 LED Lamp Datasheet - Multi-Color (Green/Red/Blue) - 20mA - Through-Hole Package - English Technical Document

1. Product Overview

The LTL42FGRBBH281 is a multi-color through-hole LED lamp designed for circuit board indication. It features a black plastic right-angle holder (housing) that mates with the LED components, enhancing contrast ratio. The product is designed for ease of assembly on printed circuit boards (PCBs) and is available in configurations that allow for stacking and simple installation.

1.1 Core Advantages

1.2 Target Applications

2. Technical Parameters: In-Depth Objective Interpretation

2.1 Absolute Maximum Ratings (TA=25°C)

The following table details the limits beyond which permanent damage to the device may occur. Operation outside these ranges is not recommended.

ParameterGreen (Yellow Green)RedBlueUnit
Power Dissipation525276mW
Peak Forward Current (Duty Cycle ≤1/10, Pulse Width ≤0.1ms)6060100mA
DC Forward Current202020mA
Operating Temperature Range-30°C to +85°C
Storage Temperature Range-40°C to +100°C
Lead Soldering Temperature (2.0mm from body)260°C for 5 seconds max.

2.2 Electrical and Optical Characteristics (TA=25°C)

These parameters define the typical performance of the device under specified test conditions.

ParameterSymbolColor / LEDMin.Typ.Max.UnitTest Condition
Luminous IntensityIvGreen (LED1,2)5.68515mcdIF=10mA
Red (LED1,2)1518050mcdIF=20mA
Blue (LED3,4)65140310mcdIF=10mA
Viewing Angle2θ1/2Green100degNote 2
Red50degNote 2
Blue90degNote 2
Peak Emission WavelengthλPGreen572nmMeasurement @ Peak
Red639nmMeasurement @ Peak
Blue468nmMeasurement @ Peak
Dominant WavelengthλdGreen564569574nmIF=10 mA
Red621631537nmIF=20mA
Blue460470475nmIF=10mA
Spectral Line Half-WidthΔλGreen15nm
Red20nm
Blue35nm
Forward VoltageVFGreen2.02.5VIF=10mA
Red2.02.5VIF=20mA
Blue3.23.8VIF=10mA
Reverse CurrentIRGreen/Red100μAVR = 5V
Blue10μAVR = 5V

Notes: 1. Luminous intensity measurement approximates CIE eye-response. 2. Viewing angle is the off-axis angle where intensity is half the axial value. 3. Dominant wavelength defines color per CIE diagram. 4. Iv includes ±15% test tolerance. 5. Reverse current is source-controlled. 6. Reverse voltage is for test only; device is not for reverse operation.

3. Binning System Explanation

The datasheet indicates typical values for key parameters. For production, devices are typically binned (grouped) based on specific characteristics to ensure consistency within an application. While exact bin codes are not provided in this document, the parameters subject to binning likely include:

Designers should consult specific binning information from the manufacturer for critical color-matching or current-matching applications.

4. Performance Curve Analysis

The datasheet references typical characteristic curves for each LED color (Green/Yellow Green, Red, Blue). These curves graphically represent the relationship between key parameters and are essential for circuit design.

4.1 Typical IV (Current-Voltage) Curves

These curves plot forward current (IF) against forward voltage (VF) for each LED color at 25°C. They show the non-linear relationship typical of diodes. The knee voltage is approximately 2.0V for Green/Red and 3.2V for Blue LEDs. Designers use these curves to determine the necessary supply voltage and series resistor value to achieve the desired operating current (typically 10mA or 20mA as per specs).

4.2 Luminous Intensity vs. Forward Current

These curves illustrate how light output (Iv) increases with forward current (IF). The relationship is generally linear within the recommended operating range (up to 20mA DC). Operating above the absolute maximum current can lead to super-linear increase in junction temperature and rapid degradation of light output and lifespan.

4.3 Spectral Distribution

While not explicitly graphed, the parameters for Peak Emission Wavelength (λP), Dominant Wavelength (λd), and Spectral Line Half-Width (Δλ) define the spectral characteristics. Δλ indicates the color purity; a smaller value denotes a more monochromatic light. Blue LEDs have the widest Δλ (35nm), while Green is the narrowest (15nm).

5. Mechanical and Packaging Information

5.1 Outline Dimensions

The device uses a through-hole package with a black plastic right-angle holder. Key mechanical notes from the datasheet:

The exact dimensional drawing is referenced in the datasheet, providing critical measurements for PCB footprint design, including lead spacing, body size, and mounting hole placement.

5.2 Polarity Identification

For through-hole LEDs, polarity is typically indicated by lead length (longer lead is anode) or a flat spot on the lens or housing. The datasheet's outline drawing should clearly mark the cathode (usually the shorter lead or the lead nearest a flat edge). Correct polarity is essential for device operation.

6. Soldering and Assembly Guidelines

6.1 Storage Conditions

The storage ambient should not exceed 30°C or 70% relative humidity. LEDs removed from their original packaging should be used within three months. For extended storage outside original packaging, store in a sealed container with desiccant or in a nitrogen ambient desiccator.

6.2 Cleaning

Use alcohol-based cleaning solvents like isopropyl alcohol if cleaning is necessary. Avoid harsh chemicals that may damage the plastic lens or housing.

6.3 Lead Forming

Bend leads at a point at least 3mm from the base of the LED lens. Do not use the base of the lead frame as a fulcrum. Perform lead forming before soldering at normal temperature. During PCB assembly, use the minimum clinch force possible to avoid excessive mechanical stress on the component.

6.4 Soldering Parameters

Maintain a minimum 2mm clearance from the base of the lens/holder to the soldering point. Avoid dipping the lens/holder into solder.

MethodParameterValueNote
Soldering IronTemperature350°C Max.Position: No closer than 2mm from base.
Soldering Time3 seconds Max. (one time only)
Wave SolderingPre-heat Temperature120°C Max.Dipping Position: No lower than 2mm from base.
Pre-heat Time100 seconds Max.
Solder Wave Temperature260°C Max.
Soldering Time5 seconds Max.

Important: Excessive temperature or time can deform the lens or cause failure. IR reflow is NOT suitable for this through-hole product. The maximum wave soldering temperature does not define the holder's Heat Deflection Temperature (HDT) or melting point.

7. Packaging and Ordering Information

7.1 Packing Specification

The datasheet includes a dedicated packing specification section (referenced as page 7/10). This details how the components are supplied, typically in anti-static tubes, reels, or trays. It includes information on quantity per package, reel dimensions, and orientation for automated handling.

7.2 Model Numbering Rule

The part number LTL42FGRBBH281 likely encodes key attributes. A common convention includes: Series (LTL), Size/package code (42), Color (FGRB for a combination of colors), and specific variant/optics code (BH281). The exact decoding should be confirmed with the manufacturer's product guide.

8. Application Recommendations

8.1 Typical Application Circuits

LEDs are current-operated devices. To ensure uniform brightness when connecting multiple LEDs in parallel, a current-limiting resistor must be used in series with EACH LED (Circuit Model A). Avoid connecting LEDs directly in parallel without individual resistors (Circuit Model B), as slight variations in forward voltage (VF) will cause significant differences in current share and, therefore, brightness.

Circuit A (Recommended): [Vcc] -- [Resistor] -- [LED] -- [GND]. A separate resistor-LED branch for each LED in parallel.

Circuit B (Not Recommended for uniformity): [Vcc] -- [Resistor] -- [LED1 // LED2 // LED3] -- [GND].

8.2 Electrostatic Discharge (ESD) Protection

LEDs are sensitive to static electricity. Prevention measures include:

8.3 Thermal Considerations

While power dissipation is low (52-76 mW), maintaining the junction temperature within the operating range (-30°C to +85°C) is crucial for longevity and stable light output. Ensure adequate spacing on the PCB and consider ambient temperature in the enclosure. Operating at or near the maximum DC current will generate more heat.

9. Technical Comparison and Differentiation

The LTL42FGRBBH281 offers specific advantages in its category:

10. Frequently Asked Questions (Based on Technical Parameters)

Q1: Can I drive the blue LED at 20mA like the red one?
A: The Absolute Maximum Ratings table specifies a DC Forward Current of 20mA for all colors. However, the Electrical Characteristics table lists test conditions of IF=10mA for Blue and Green, and IF=20mA for Red. For reliable long-term operation, it is advisable to operate the Blue and Green LEDs at or near 10mA, as this is the condition under which their optical specs are guaranteed. Exceeding this may reduce lifespan or shift color.

Q2: Why is the reverse current for Blue LED (10μA) much lower than for Green/Red (100μA)?
A: This difference is inherent to the semiconductor materials used (InGaN for Blue vs. AlInGaP for Red/Green). The diode junction characteristics, including reverse leakage current, vary with material bandgap and fabrication process.

Q3: What is the difference between Peak Wavelength (λP) and Dominant Wavelength (λd)?
A: Peak Wavelength is the single wavelength at which the spectral power distribution is maximum. Dominant Wavelength is derived from the CIE chromaticity diagram and represents the perceived color of the light; it is the single wavelength that would match the color sensation. λd is more relevant for color specification in human-centric applications.

Q4: Is a heat sink required?
A: Given the low power dissipation (max 76mW for Blue), a dedicated heat sink is generally not required for standard operation within the specified current limits. Proper PCB layout with some copper area around the leads will suffice for heat dissipation in most environments.

11. Practical Application Case Study

Scenario: Designing a Multi-Function Status Indicator for an Industrial Controller.
An industrial programmable logic controller (PLC) requires a single indicator to show multiple states: Standby (Green), Running (Flashing Green), Fault (Red), and Communication Active (Blue).

Design Implementation:
1. The LTL42FGRBBH281 is selected for its integrated multi-color capability in one through-hole package, saving board space compared to using three separate LEDs.
2. A microcontroller GPIO pin is connected to each LED cathode (via a current-limiting resistor), with the anodes connected to the supply rail. This allows independent control of each color.
3. Resistor values are calculated using R = (Vcc - VF) / IF. For a 5V supply: R_Green/Red ≈ (5V - 2.5V) / 0.01A = 250Ω; R_Blue ≈ (5V - 3.8V) / 0.01A = 120Ω. Standard resistor values (270Ω and 120Ω) are chosen.
4. The right-angle housing allows the indicator to be mounted on the edge of the PCB, facing outward through a panel cutout. The black housing ensures high contrast against the panel.
5. Software controls the flashing pattern for the \"Running\" state by toggling the Green LED pin.

This design leverages the product's key features: multi-color integration, ease of assembly, and high-contrast housing.

12. Principle of Operation

Light Emitting Diodes (LEDs) are semiconductor p-n junction devices that emit light through electroluminescence. When a forward voltage exceeding the junction's built-in potential is applied, electrons from the n-region recombine with holes from the p-region in the active region. This recombination releases energy in the form of photons (light). The wavelength (color) of the emitted light is determined by the bandgap energy of the semiconductor material used in the active region. The LTL42FGRBBH281 utilizes AlInGaP for red and green emission and InGaN for blue emission. The plastic lens serves to focus the light, protect the semiconductor die, and, when diffused, to widen the viewing angle and soften the light appearance.

13. Technology Trends

The through-hole LED lamp represents a mature and reliable packaging technology. Current industry trends show a strong shift towards surface-mount device (SMD) packages (e.g., 0603, 0805, 1206, and larger power packages) for most new designs due to their smaller footprint, suitability for automated pick-and-place assembly, and lower profile. However, through-hole components like the LTL42FGRBBH281 remain relevant in specific niches: applications requiring extreme mechanical robustness, high-voltage isolation, manual assembly/repair, educational kits, or where the right-angle viewing and stacking features are specifically advantageous. The technology continues to benefit from improvements in semiconductor materials (e.g., higher efficiency, better color rendering) and plastic molding techniques, even within the through-hole form factor.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.