Table of Contents
- 1. Product Overview
- 1.1 Core Advantages
- 1.2 Target Applications
- 2. In-Depth Technical Parameter Analysis
- 2.1 Absolute Maximum Ratings
- 2.2 Electrical & Optical Characteristics
- 3. Binning System Specification
- 3.1 Luminous Intensity Binning
- 3.2 Dominant Wavelength Binning
- 4. Mechanical & Packaging Information
- 4.1 Outline Dimensions
- 4.2 Packing Specification
- 5. Soldering & Assembly Guidelines
- 5.1 Storage
- 5.2 Cleaning
- 5.3 Lead Forming
- 5.4 Soldering Process
- 6. Application Design Considerations
- 6.1 Drive Circuit Design
- 6.2 ESD (Electrostatic Discharge) Protection
- 7. Performance Curves & Typical Characteristics
- 8. Technical Comparison & Differentiation
- 9. Frequently Asked Questions (FAQs)
- 9.1 What is the recommended operating current?
- 9.2 Can I drive multiple LEDs with one resistor?
- 9.3 Is this LED suitable for outdoor use?
- 9.4 What does the ±30% tolerance on luminous intensity mean?
- 10. Practical Application Example
- LED Specification Terminology
- Photoelectric Performance
- Electrical Parameters
- Thermal Management & Reliability
- Packaging & Materials
- Quality Control & Binning
- Testing & Certification
1. Product Overview
This document details the specifications for a through-hole LED lamp identified by part number LTLR1DESTBKJ. The device is offered in a standard T-1 type package, which is a common form factor for status indication and panel lighting applications. The product is designed to provide reliable performance with low power consumption and is compliant with environmental regulations.
1.1 Core Advantages
- Low Power Consumption & High Efficiency: Optimized for energy-sensitive applications.
- Environmental Compliance: The product is lead-free, RoHS compliant, and halogen-free (Cl<900 ppm, Br<900 ppm, Cl+Br<1500 ppm).
- Package Variety: Available in a T-1 through-hole package suitable for manual or automated insertion.
- Chip Technology: Utilizes InGaN technology for the blue emitter and AlInGaP technology for the yellow emitter, combined with a white diffused lens for a uniform appearance.
1.2 Target Applications
This LED is suitable for a wide range of applications requiring clear visual status indication, including but not limited to:
- Communication equipment
- Computer peripherals and motherboards
- Consumer electronics
- Home appliances
2. In-Depth Technical Parameter Analysis
The following sections provide a detailed breakdown of the device's operational limits and performance characteristics.
2.1 Absolute Maximum Ratings
These ratings define the stress limits beyond which permanent damage to the device may occur. Operation at or near these limits is not recommended for extended periods.
| Parameter | Blue | Yellow | Unit |
|---|---|---|---|
| Power Dissipation | 70 | 75 | mW |
| Peak Forward Current (Duty Cycle ≤1/10, Pulse Width ≤10 μs) | 60 | 60 | mA |
| DC Forward Current | 20 | 30 | mA |
| Operating Temperature Range | -30°C to +85°C | ||
| Storage Temperature Range | -40°C to +100°C | ||
| Lead Soldering Temperature [2.0mm From Body] | 260°C for 5 Seconds Max. | ||
2.2 Electrical & Optical Characteristics
These are the typical performance parameters measured under standard test conditions (TA=25°C, IF=10mA).
| Parameter | Symbol | Color | Min. | Typ. | Max. | Unit | Test Condition |
|---|---|---|---|---|---|---|---|
| Luminous Intensity | Iv | Blue | 110 | - | 520 | mcd | IF = 10 mA |
| Luminous Intensity | Iv | Yellow | 65 | - | 310 | mcd | IF = 10 mA |
| Viewing Angle | 2θ1/2 | Blue/Yellow | - | 40 | - | deg | |
| Dominant Wavelength | λd | Blue | 464 | 470 | 476 | nm | IF = 10 mA |
| Dominant Wavelength | λd | Yellow | 582 | 589 | 596 | nm | IF = 10 mA |
| Forward Voltage | VF | Blue | 2.6 | 3.2 | 3.5 | V | IF = 10 mA |
| Forward Voltage | VF | Yellow | 1.7 | 2.1 | 2.5 | V | IF = 10 mA |
| Reverse Current | IR | Blue/Yellow | - | - | 10 | μA | VR = 5V |
Key Notes:
- Luminous intensity is measured per the CIE eye-response curve.
- The viewing angle (2θ1/2) is 40 degrees, indicating a moderately wide beam.
- The device is not designed for reverse voltage operation; the IR test is for characterization only.
3. Binning System Specification
To ensure color and brightness consistency in production, LEDs are sorted into bins. The bin codes for this product are defined below.
3.1 Luminous Intensity Binning
| Bin Code (Blue) | Min. (mcd) | Max. (mcd) | Bin Code (Yellow) | Min. (mcd) | Max. (mcd) |
|---|---|---|---|---|---|
| FG | 110 | 180 | DE | 65 | 110 |
| HJ | 180 | 310 | FG | 110 | 180 |
| KL | 310 | 520 | HJ | 180 | 310 |
Tolerance of each bin limit is ±30%.
3.2 Dominant Wavelength Binning
| Bin Code (Blue) | Min. (nm) | Max. (nm) | Bin Code (Yellow) | Min. (nm) | Max. (nm) |
|---|---|---|---|---|---|
| 1 | 464.0 | 470.0 | 3 | 582.0 | 589.0 |
| 2 | 470.0 | 476.0 | 4 | 589.0 | 596.0 |
Tolerance of each bin limit is ±1nm.
4. Mechanical & Packaging Information
4.1 Outline Dimensions
The LED uses a standard T-1 (3mm) radial leaded package. Key dimensional notes include:
- All dimensions are in millimeters (inches).
- Tolerance is ±0.25mm (.010") unless otherwise noted.
- Protruded resin under the flange is 1.0mm (.04") maximum.
- Lead spacing is measured where the leads emerge from the package body.
4.2 Packing Specification
The product is packed to facilitate handling and automated assembly.
- Basic Unit: 500, 200, or 100 pieces per packing bag.
- Inner Carton: 10 packing bags per inner carton (total 5,000 pieces).
- Outer Carton: 8 inner cartons per outer carton (total 40,000 pieces).
- In every shipping lot, only the last pack may be a non-full pack.
5. Soldering & Assembly Guidelines
Proper handling is critical to maintain LED performance and reliability.
5.1 Storage
Store LEDs in an environment not exceeding 30°C and 70% relative humidity. If removed from the original packaging, use within three months. For extended storage, use a sealed container with desiccant or a nitrogen ambient.
5.2 Cleaning
Use alcohol-based solvents like isopropyl alcohol if cleaning is necessary.
5.3 Lead Forming
- Bend leads at a point at least 3mm from the base of the LED lens.
- Do not use the base of the lead frame as a fulcrum.
- Perform lead forming at normal temperature and before soldering.
- Use minimum clinch force during PCB assembly to avoid mechanical stress.
5.4 Soldering Process
Maintain a minimum clearance of 2mm from the base of the lens to the solder point. Avoid dipping the lens into solder.
| Method | Parameter | Condition |
|---|---|---|
| Soldering Iron | Temperature | 350°C Max. |
| Time | 3 seconds Max. (one time only) | |
| Position | No closer than 2mm from lens base | |
| Wave Soldering | Pre-heat Temperature | 100°C Max. |
| Pre-heat Time | 60 seconds Max. | |
| Solder Wave Temperature | 260°C Max. | |
| Soldering Time | 5 seconds Max. | |
| Wave Soldering | Dipping Position | No lower than 2mm from lens base |
Warning: Excessive temperature or time can deform the lens or cause catastrophic failure. IR reflow is not suitable for this through-hole LED.
6. Application Design Considerations
6.1 Drive Circuit Design
LEDs are current-operated devices. To ensure uniform brightness when connecting multiple LEDs in parallel, it is strongly recommended to use a current-limiting resistor in series with each LED (Circuit A). Using a single resistor for multiple parallel LEDs (Circuit B) is not recommended due to variations in individual LED forward voltage (VF), which will cause uneven brightness.
6.2 ESD (Electrostatic Discharge) Protection
Static electricity can damage the LED. Implement the following precautions:
- Use a conductive wrist strap or anti-static gloves when handling.
- Ensure all equipment, worktables, and storage racks are properly grounded.
- Use an ionizer to neutralize static charge in the work area.
7. Performance Curves & Typical Characteristics
The datasheet references typical performance curves which graphically represent the relationship between key parameters. While the specific graphs are not reproduced in text, they typically include:
- Relative Luminous Intensity vs. Forward Current: Shows how light output increases with current, up to the maximum rating.
- Forward Voltage vs. Forward Current: Illustrates the diode's I-V characteristic curve.
- Relative Luminous Intensity vs. Ambient Temperature: Demonstrates the decrease in light output as junction temperature rises.
- Spectral Distribution: Depicts the relative power emitted across wavelengths, showing the peak emission wavelength (λP).
Designers should consult these curves to understand device behavior under non-standard conditions (e.g., different drive currents or temperatures).
8. Technical Comparison & Differentiation
This T-1 LED offers a balance of performance and cost for general-purpose indication. Key differentiators in its class include:
- Dual-Chip Technology: The use of InGaN for blue and AlInGaP for yellow provides efficient, saturated colors compared to older technologies like phosphor-converted white or less efficient chip materials.
- Halogen-Free Construction: Exceeds basic RoHS compliance, making it suitable for applications with stricter environmental requirements.
- Clear Binning Structure: Well-defined intensity and wavelength bins allow for tighter color and brightness matching in applications requiring multiple LEDs.
9. Frequently Asked Questions (FAQs)
9.1 What is the recommended operating current?
While the absolute maximum DC current is 20mA (Blue) and 30mA (Yellow), the standard test condition and typical performance data are given at 10mA. For most applications aiming for a balance of brightness and longevity, operating at or near 10mA is advisable. Always refer to the derating curves if operating at higher ambient temperatures.
9.2 Can I drive multiple LEDs with one resistor?
It is not recommended. Due to natural variations in the forward voltage (VF) of individual LEDs, connecting them in parallel with a single series resistor will result in uneven current distribution and thus uneven brightness. Always use a separate current-limiting resistor for each LED when connecting in parallel.
9.3 Is this LED suitable for outdoor use?
The datasheet states it is good for indoor and outdoor signs. However, the operating temperature range is -30°C to +85°C. For harsh outdoor environments with direct weather exposure, additional design considerations are necessary, such as conformal coating on the PCB, UV-stable lenses if applicable, and ensuring the operating temperature within the enclosure stays within limits.
9.4 What does the ±30% tolerance on luminous intensity mean?
This means the actual measured luminous intensity of any given LED can vary by up to 30% from the nominal bin value. For example, an LED from the "HJ" bin for Blue (180-310 mcd) could measure as low as 126 mcd (70% of 180) or as high as 403 mcd (130% of 310) and still be within specification. This is why binning is important for consistency.
10. Practical Application Example
Scenario: Designing a status indicator panel for a network router using a blue LED (LTLR1DESTBKJ, Blue, Bin HJ).
- Circuit Design: The system power is 5V. Target forward current (IF) is 10mA for adequate brightness and efficiency. Using the typical forward voltage (VF) of 3.2V for Blue:
Required series resistor R = (Vsupply - VF) / IF = (5V - 3.2V) / 0.01A = 180 Ω.
The nearest standard value of 180 Ω or 220 Ω can be used. The resistor power rating: P = I²R = (0.01)² * 180 = 0.018W, so a standard 1/8W or 1/10W resistor is sufficient. - PCB Layout: Place the LED on the board, ensuring the hole spacing matches the LED's lead spacing. Keep the solder pads at least 2mm away from the LED body outline to respect the soldering clearance requirement.
- Assembly: Insert the LED, form the leads (if necessary) at >3mm from the body, and solder using a controlled iron at 350°C for less than 3 seconds per lead.
This example ensures reliable operation within all specified parameters.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |