T-1 Through Hole LED Lamp Specification - 3mm Diameter - 2.0-2.4V Forward Voltage - 75mW Power - Red/Green Color - English Technical Document

1. Product Overview

This document details the specifications for a series of through-hole LED lamps designed for status indication and signaling applications. The product is offered in a popular T-1 (3mm) diameter package, providing a compact and versatile solution for a wide range of electronic devices.

1.1 Core Advantages

• Low Power Consumption & High Efficiency: Designed for energy-efficient operation, making it suitable for battery-powered or power-sensitive applications.
• Lead-Free & RoHS Compliant: Manufactured in compliance with environmental regulations, ensuring safety and sustainability.
• Standard T-1 Package: The 3mm diameter is a widely adopted industry standard, ensuring easy integration and compatibility with existing PCB footprints and panel cutouts.
• Material Technology: Utilizes AlInGaP (Aluminum Indium Gallium Phosphide) semiconductor material for the red and green emitters, known for its high brightness and efficiency. The lens is white diffused for a uniform viewing appearance.

1.2 Target Applications

These LEDs are suitable for all applications requiring clear, reliable status indication. Primary markets include:

• Communication Equipment
• Computer Peripherals and Motherboards
• Consumer Electronics
• Home Appliances and Control Panels

2. In-Depth Technical Parameter Analysis

2.1 Absolute Maximum Ratings

All ratings are specified at an ambient temperature (TA) of 25°C. Exceeding these limits may cause permanent damage.

• Power Dissipation (Pd): 75 mW for both Red and Green variants. This is the maximum allowable power the device can dissipate as heat.
• Peak Forward Current (I_FP): 60 mA (Green) / 90 mA (Red). This is the maximum instantaneous current allowed under pulsed conditions (duty cycle ≤ 1/10, pulse width ≤ 10 ms). It is significantly higher than the continuous DC rating.
• DC Forward Current (I_F): 30 mA for both colors. This is the recommended maximum current for continuous operation.
• Current Derating: Above 50°C, the maximum allowable DC forward current must be reduced linearly at a rate of 0.4 mA/°C. For example, at 85°C, the maximum I_F would be 30 mA - ((85°C - 50°C) * 0.4 mA/°C) = 16 mA.
• Temperature Range: Operating: -40°C to +100°C. Storage: -55°C to +100°C.
• Soldering Temperature: Leads can withstand 260°C for a maximum of 5 seconds, measured 1.6mm from the LED body.

2.2 Electrical & Optical Characteristics

Typical performance is measured at TA=25°C and I_F=20mA, unless otherwise noted.

• Luminous Intensity (I_v): A key brightness parameter. Minimum typical values are 65 mcd for both colors, with maximums reaching 250 mcd (Red) and 450 mcd (Green). Testing includes a ±30% tolerance.
• Viewing Angle (2θ_1/2): 45 degrees for both colors. This is the full angle at which the luminous intensity drops to half of its peak (on-axis) value. It defines the beam spread.
• Wavelength:
  • Peak Wavelength (λ_P): Approximately 639 nm (Red) and 575 nm (Green). This is the wavelength at the highest point in the emission spectrum.
  • Dominant Wavelength (λ_d): Approximately 631 nm (Red) and 569 nm (Green). This is the single wavelength perceived by the human eye, derived from the CIE chromaticity diagram, and defines the color.
  • Spectral Bandwidth (Δλ): 20 nm (Red) and 11 nm (Green). This indicates the color purity; a smaller bandwidth means a more monochromatic light.
• Forward Voltage (V_F): Ranges from 2.0V to 2.4V (Red) and 2.1V to 2.4V (Green) at 20mA. This parameter is crucial for designing the current-limiting resistor in series with the LED.
• Reverse Current (I_R): Maximum 10 µA at a reverse voltage (V_R) of 5V. Important: The device is not designed for reverse-bias operation; this test condition is for characterization only.

3. Binning System Specification

To ensure color and brightness consistency in production, LEDs are sorted into bins.

3.1 Luminous Intensity Binning

Units: mcd @ 20mA. Tolerance for each bin limit is ±15%.

• Red & Green Common Bins:
  • DE Bin: 65 mcd (Min) to 140 mcd (Max)
  • FG Bin: 140 mcd (Min) to 250 mcd (Max)
• Green-Only Additional Bin:
  • HJ Bin: 250 mcd (Min) to 450 mcd (Max)

3.2 Dominant Wavelength Binning (Green Only)

Units: nm @ 20mA. Tolerance for each bin limit is ±1 nm.

• H06 Bin: 564.0 nm to 568.0 nm
• H07 Bin: 568.0 nm to 571.0 nm

4. Performance Curve Analysis

The datasheet references typical characteristic curves which illustrate the relationship between key parameters. While the specific graphs are not reproduced in text, their implications are critical for design.

• I-V (Current-Voltage) Curve: Shows the exponential relationship between forward voltage (V_F) and forward current (I_F). The curve is steeper for LEDs compared to resistors. This non-linearity is why a series resistor is mandatory for current control when using a constant voltage source.
• Relative Luminous Intensity vs. Forward Current: Demonstrates how light output increases with current. It is generally linear within the operating range but will saturate at very high currents due to thermal and efficiency limits.
• Relative Luminous Intensity vs. Ambient Temperature: Shows the decrease in light output as the junction temperature rises. This thermal derating effect must be accounted for in high-temperature environments.
• Spectral Distribution: A graph plotting relative intensity against wavelength, showing the peak (λ_P) and the shape of the emission spectrum, which determines the color purity (Δλ).

5. Mechanical & Package Information

5.1 Outline Dimensions

The LED features a standard T-1 (3mm) round lens diameter. Key dimensional notes include:

• All dimensions are in millimeters (inches provided in parenthesis).
• Standard tolerance is ±0.25mm (±0.010\") unless specified otherwise.
• The maximum allowable protrusion of resin under the flange is 1.0mm (0.04\").
• Lead spacing is measured at the point where the leads exit the package body, which is the critical dimension for PCB hole placement.

5.2 Polarity Identification

Through-hole LEDs typically use lead length or a flat spot on the lens flange to indicate polarity. The longer lead is the anode (positive), and the shorter lead (or the lead adjacent to the flat spot) is the cathode (negative). Correct polarity is essential for operation.

6. Soldering & Assembly Guidelines

6.1 Lead Forming

• Bending must occur at a point at least 3mm from the base of the LED lens.
• Do not use the package body as a fulcrum during bending.
• All lead forming must be completed before the soldering process and at room temperature.
• During PCB insertion, use minimal clinching force to avoid imposing excessive mechanical stress on the leads or epoxy seal.

6.2 Soldering Process

A minimum clearance of 2mm must be maintained between the solder point and the base of the lens. Immersing the lens in solder must be avoided.

• Hand Soldering (Iron):
  • Maximum Iron Temperature: 350°C
  • Maximum Soldering Time per lead: 3 seconds
  • Soldering should be performed only once per lead.
• Wave Soldering:
  • Maximum Pre-heat Temperature: 100°C
  • Maximum Pre-heat Time: 60 seconds
  • Maximum Solder Wave Temperature: 260°C
  • Maximum Contact Time: 5 seconds
• Critical Note: Infrared (IR) reflow soldering is not a suitable process for this through-hole type LED product. Excessive temperature or time can cause lens deformation or catastrophic failure.

6.3 Storage & Handling

• Storage: Recommended storage conditions are ≤30°C and ≤70% relative humidity. LEDs removed from their original moisture-barrier packaging should be used within three months. For longer storage outside the original bag, use a sealed container with desiccant or a nitrogen desiccator.
• Cleaning: If necessary, clean only with alcohol-based solvents like isopropyl alcohol (IPA).
• ESD (Electrostatic Discharge) Protection: LEDs are sensitive to static electricity. Handling precautions include:
  • Using grounded wrist straps or anti-static gloves.
  • Ensuring all equipment, workstations, and storage racks are properly grounded.
  • Using an ionizer to neutralize static charge that may accumulate on the plastic lens.

7. Packaging & Ordering Information

7.1 Packaging Specification

The product is packed in a multi-tiered system:

1. Packing Bag: Contains 500, 200, or 100 pieces.
2. Inner Carton: Contains 10 packing bags, totaling 5,000 pieces (when using 500pc bags).
3. Master (Outer) Carton: Contains 8 inner cartons, totaling 40,000 pieces.
4. A note specifies that in any shipping lot, only the final pack may be a non-full pack.

8. Application Design Recommendations

8.1 Drive Circuit Design

An LED is a current-driven device. To ensure uniform brightness, especially when multiple LEDs are used in parallel, a current-limiting resistor must be placed in series with each LED.

• Recommended Circuit (A): Each LED has its own series resistor connected to the voltage supply (V_CC). This provides independent current control, compensating for natural variations in the forward voltage (V_F) of individual LEDs.
• Non-Recommended Circuit (B): Multiple LEDs connected in parallel with a single shared series resistor. This should be avoided, as small differences in the I-V characteristics of each LED will cause significant imbalances in current distribution, leading to uneven brightness and potential over-stress of the LED with the lowest V_F.
• Resistor Calculation: R = (V_CC - V_F) / I_F. Use the maximum V_F from the datasheet for a conservative design that ensures I_F does not exceed the desired value even with part-to-part variation.

8.2 Thermal Management Considerations

While the power dissipation is low (75mW), the derating curve must be respected in high ambient temperature applications. Reducing the operating current (I_F) is the primary method to manage junction temperature and maintain long-term reliability and stable light output.

8.3 Application Scope

This LED lamp is suitable for both indoor and outdoor signage, as well as general electronic equipment. The AlInGaP technology offers good brightness and stability for indicator purposes.

9. Technical Comparison & Differentiation

Compared to older technologies like standard GaP (Gallium Phosphide) LEDs, the AlInGaP material used in this product offers significantly higher luminous efficiency, resulting in greater brightness for the same operating current. The T-1 package remains one of the most cost-effective and mechanically robust choices for through-hole mounting, offering a good balance of size, light output, and ease of assembly compared to smaller surface-mount devices (SMDs) for certain applications.

10. Frequently Asked Questions (FAQ)

10.1 Can I drive this LED directly from a 5V or 3.3V logic supply?

No, you must use a series resistor. Connecting it directly will allow excessive current to flow, destroying the LED instantly. Calculate the resistor value using the formula R = (V_supply - V_F) / I_F.

10.2 Why is there a difference between Peak and Dominant Wavelength?

The Peak Wavelength is the physical peak of the light emission spectrum. The Dominant Wavelength is a calculated value based on human color perception (CIE standards). The dominant wavelength is what defines the color we see, which is why it is used for binning.

10.3 What happens if I exceed the 5-second soldering time at 260°C?

Exceeding the rated soldering time or temperature can cause several failures: thermal stress cracking of the epoxy lens, degradation of the internal wire bonds, or delamination inside the package. This will likely lead to immediate failure or severely reduced long-term reliability.

10.4 How do I select the correct bin for my application?

For applications where multiple LEDs are viewed together (e.g., an array of status lights), select LEDs from the same intensity bin (DE, FG, HJ) and, for green LEDs, the same wavelength bin (H06, H07) to ensure visual consistency in brightness and color hue.